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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
EP3312611B1
METHOD FOR DIAGNOSIS OF ALZHEIMER'S DISEASE
Publication/Patent Number: EP3312611B1 Publication Date: 2020-02-26 Application Number: 16194973.0 Filing Date: 2016-10-21 Inventor: Lin, Chai-ching   Tsai chen wei   Assignee: Dr. Power Stem Biomedical Research Inc., Ltd.   IPC: G01N33/68
2
US10644048B2
Anti-reflective coating with high refractive index material at air interface
Publication/Patent Number: US10644048B2 Publication Date: 2020-05-05 Application Number: 15/421,879 Filing Date: 2017-02-01 Inventor: Fan, Chun-sheng   Tsai chen wei   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.
3
US2020335534A1
ANTI-REFLECTIVE COATING WITH HIGH REFRACTIVE INDEX MATERIAL AT AIR INTERFACE
Publication/Patent Number: US2020335534A1 Publication Date: 2020-10-22 Application Number: 16/816,683 Filing Date: 2020-03-12 Inventor: Fan, Chun-sheng   Tsai chen wei   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.
4
TWI663721B
Chip-scale image sensor package and associated method of making
Publication/Patent Number: TWI663721B Publication Date: 2019-06-21 Application Number: 107109297 Filing Date: 2018-03-19 Inventor: Lin, Wei Feng   Tsai chen wei   Fan, Chun Sheng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H01L27/146 Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.
5
US10256266B2
Chip-scale image sensor package and associated method of making
Publication/Patent Number: US10256266B2 Publication Date: 2019-04-09 Application Number: 15/480,131 Filing Date: 2017-04-05 Inventor: Tsai chen wei   Fan, Chun-sheng   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.
6
TW201843826A
Chip-scale image sensor package and associated method of making
Publication/Patent Number: TW201843826A Publication Date: 2018-12-16 Application Number: 107109297 Filing Date: 2018-03-19 Inventor: Lin, Wei Feng   Tsai chen wei   Fan, Chun Sheng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H01L27/146 Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.
7
US2018113129A1
METHOD FOR DIAGNOSIS OF ALZHEIMER'S DISEASE
Publication/Patent Number: US2018113129A1 Publication Date: 2018-04-26 Application Number: 15/335,036 Filing Date: 2016-10-26 Inventor: Tsai chen wei   Lin, Chai-ching   Assignee: Dr. Power Stem BiomedicaI Research Inc., Ltd.   IPC: G01N33/573 Abstract: The present invention is related to a method for risk detection, diagnosis, prognosis and monitoring of Alzheimer's disease (AD). The method comprises the steps of: (1) measuring the level of glyceraldehyde 3-phosphate dehydrogenase (GAPDH) in a sample from the subject, and (2) comparing the level of GAPDH in the sample with two or more AD reference levels of GAPDH.
8
EP3312611A1
METHOD FOR DIAGNOSIS OF ALZHEIMER'S DISEASE
Publication/Patent Number: EP3312611A1 Publication Date: 2018-04-25 Application Number: 16194973.0 Filing Date: 2016-10-21 Inventor: Lin, Chai-ching   Tsai chen wei   Assignee: Dr. Power Stem Biomedical Research Inc., Ltd.   IPC: G01N33/68 Abstract: The present invention is related to a method for risk detection, diagnosis, prognosis and monitoring of Alzheimer's disease (AD). The method comprises the steps of: (l) measuring the level of glyceraldehyde 3-phosphate dehydrogenase (GAPDH) in a sample from the subject, and (2) comparing the level of GAPDH in the sample with two or more AD reference levels of GAPDH.
9
TWI622771B
Method for diagnosis of alzheimer's disease
Publication/Patent Number: TWI622771B Publication Date: 2018-05-01 Application Number: 105134877 Filing Date: 2016-10-27 Inventor: Tsai chen wei   Lin, Chai-ching   Assignee: DR. POWER STEM BIOMEDICAI RESEARCH INC., LTD.   IPC: A61P25/28 Abstract: The present invention is related to a method for risk detection, diagnosis, prognosis and monitoring of Alzheimer's disease (AD). The method comprises the steps of: (1) measuring the level of glyceraldehyde 3-phosphate dehydrogenase (GAPDH) in a sample from the subject, and (2) comparing the level of GAPDH in the sample with two or more AD reference levels of GAPDH.
10
TW201816399A
Method for diagnosis of alzheimer's disease
Publication/Patent Number: TW201816399A Publication Date: 2018-05-01 Application Number: 105134877 Filing Date: 2016-10-27 Inventor: Tsai chen wei   Lin, Chai-ching   Assignee: DR. POWER STEM BIOMEDICAI RESEARCH INC., LTD.   IPC: A61P25/28 Abstract: The present invention is related to a method for risk detection, diagnosis, prognosis and monitoring of Alzheimer's disease (AD). The method comprises the steps of: (1) measuring the level of glyceraldehyde 3-phosphate dehydrogenase (GAPDH) in a sample from the subject, and (2) comparing the level of GAPDH in the sample with two or more AD reference levels of GAPDH.
11
TW201835609A
Anti-reflective coating with high refractive index material at air interface
Publication/Patent Number: TW201835609A Publication Date: 2018-10-01 Application Number: 106141082 Filing Date: 2017-11-27 Inventor: Lin, Wei-feng   Fan, Chun-sheng   Tsai chen wei   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H01L27/146 Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.
12
US2018219034A1
Anti-Reflective Coating with High Refractive Index Material at Air Interface
Publication/Patent Number: US2018219034A1 Publication Date: 2018-08-02 Application Number: 15/421,879 Filing Date: 2017-02-01 Inventor: Lin, Wei-feng   Tsai chen wei   Fan, Chun-sheng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.
13
US2018294298A1
CHIP-SCALE IMAGE SENSOR PACKAGE AND ASSOCIATED METHOD OF MAKING
Publication/Patent Number: US2018294298A1 Publication Date: 2018-10-11 Application Number: 15/480,131 Filing Date: 2017-04-05 Inventor: Tsai chen wei   Fan, Chun-sheng   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.
14
TWI496462B
Emi shield for camera module
Publication/Patent Number: TWI496462B Publication Date: 2015-08-11 Application Number: 101132827 Filing Date: 2012-09-07 Inventor: Lin, Wei Feng   Tsai chen wei   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H04N5/225 Abstract: Embodiments of the invention describe an electro-magnetic interference (EMI) shield cover disposed over a wafer level camera module. Said camera module includes substrate having a plurality of imaging pixels
15
TWI450580B
Reinforcement structure for wafer-level camera module
Publication/Patent Number: TWI450580B Publication Date: 2014-08-21 Application Number: 100118721 Filing Date: 2011-05-27 Inventor: Ho, Wen Jen   Lin, Wei Feng   Lee, Chi Kuei   Tsai chen wei   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: G03B17/02 Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.
16
US8665364B2
Reinforcement structure for wafer-level camera module
Publication/Patent Number: US8665364B2 Publication Date: 2014-03-04 Application Number: 13/099,905 Filing Date: 2011-05-03 Inventor: Lin, Wei-feng   Ho, Wen-jen   Lee, Chi-kuei   Tsai chen wei   Assignee: OmniVision Technologies, Inc.   IPC: H04N5/225 Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.
17
TW201316757A
Emi shield for camera module
Publication/Patent Number: TW201316757A Publication Date: 2013-04-16 Application Number: 101132827 Filing Date: 2012-09-07 Inventor: Lin, Wei Feng   Tsai chen wei   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H04N5/225 Abstract: Embodiments of the invention describe an electro-magnetic interference (EMI) shield cover disposed over a wafer level camera module. Said camera module includes substrate having a plurality of imaging pixels
18
US2013083229A1
EMI SHIELD FOR CAMERA MODULE
Publication/Patent Number: US2013083229A1 Publication Date: 2013-04-04 Application Number: 13/250,916 Filing Date: 2011-09-30 Inventor: Lin, Wei-feng   Tsai chen wei   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H04N9/07 Abstract: Embodiments of the invention describe an electro-magnetic interference (EMI) shield cover disposed over a wafer level camera module. Said camera module includes substrate having a plurality of imaging pixels, an imaging lens unit disposed on a top side the substrate and a plurality of conductive connectors disposed a bottom side of the substrate, wherein at least one of the conductive connectors comprises a ground connector. The substrate further includes a thru-silicon via (TSV) accessible on the top-side of the substrate and communicatively coupled to the ground connector. The EMI shield is communicatively coupled to the TSV, and thus coupled to the ground connection of the digital camera module.
19
TW201208357A
Reinforcement structure for wafer-level camera module
Publication/Patent Number: TW201208357A Publication Date: 2012-02-16 Application Number: 100118721 Filing Date: 2011-05-27 Inventor: Ho, Wen Jen   Lin, Wei Feng   Lee, Chi Kuei   Tsai chen wei   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: G03B17/02 Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.
20
US2011317065A1
REINFORCEMENT STRUCTURE FOR WAFER-LEVEL CAMERA MODULE
Publication/Patent Number: US2011317065A1 Publication Date: 2011-12-29 Application Number: 13/099,905 Filing Date: 2011-05-03 Inventor: Lin, Wei-feng   Ho, Wen-jen   Lee, Chi-kuei   Tsai chen wei   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H04N5/225 Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.