Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1 US10804413B1
Package component
Publication/Patent Number: US10804413B1 Publication Date: 2020-10-13 Application Number: 16/729,842 Filing Date: 2019-12-30 Inventor: Tsai yu hsuan   Assignee: KINGPAK TECHNOLOGY INC   IPC: H01L31/0203 Abstract: A package component includes a base layer, a sensing layer, a photo-curable adhesive, a cover layer and a first filter structure. The photo-curable adhesive and the sensing layer are disposed on the base layer. The sensing layer includes a sensing unit surrounded by the photo-curable adhesive. The cover layer is disposed on the sensing layer. The first filter structure faces the photo-curable adhesive and is disposed on the cover layer. The first filter structure is configured for transmitting a curing light which is used to cure the photo-curable adhesive, and for reflecting a detectable light which is to be sensed by the sensing unit, where the wavelength of the curing light is different from the wavelength of the detectable light.
2 US10526200B2
Semiconductor device package including cover including tilted inner sidewall
Publication/Patent Number: US10526200B2 Publication Date: 2020-01-07 Application Number: 15/815,432 Filing Date: 2017-11-16 Inventor: Huang, Ching-han   Chan, Hsun-wei   Tsai yu hsuan   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L31/0232 Abstract: A semiconductor device package includes: (1) a carrier; (2) a sensor element disposed on or within the carrier; and (3) a cover including a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface, and the penetrating hole exposing the sensor element. The semiconductor device package is characterized such that (i) the inner sidewall is divided into an upper portion and a lower portion, the upper portion is substantially perpendicular to the top surface, and the lower portion is tilted; or (ii) the entire inner sidewall is tilted. The lower portion of the inner sidewall or the entire inner sidewall is tilted at an angle of between about 10° to less than about 90°, relative to the top surface.
3 US2020140262A1
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020140262A1 Publication Date: 2020-05-07 Application Number: 16/735,006 Filing Date: 2020-01-06 Inventor: Huang, Ching-han   Chan, Hsun-wei   Tsai yu hsuan   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: B81B7/00 Abstract: A semiconductor device package includes a carrier; a sensor element disposed on or within the carrier; a cover disposed above the carrier and comprising a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface; and a light transmissive element covering the penetrating hole, wherein the sensor element senses or detects light passing through the light transmissive element.
4 EP3674000A1
DETECTION METHOD, DEVICE AND CARTRIDGE FOR ENHANCING DETECTION SIGNAL INTENSITY
Publication/Patent Number: EP3674000A1 Publication Date: 2020-07-01 Application Number: 19215286.6 Filing Date: 2019-12-11 Inventor: Chiou, Chi-han   Liao, Shu-hsien   Tsai yu hsuan   Chang, Ching-yu   Assignee: Delta Electronics, Inc.   IPC: B01L3/00 Abstract: A detection method for enhancing detection signal intensity is provided. The detection method includes the following steps. Firstly, a detection device (2) is provided. The detection device (2) includes a channel (21), an inlet port (22) and an air chamber (23). The air chamber (23) includes an elastic layer (231). A bonding material (24) is immobilized in the channel (21) and served as a reaction area. Then, a sample (3) containing a detection material (31) is loaded into the inlet port (22). As the elastic layer (231) is moved upwardly and downwardly, the sample (3) is moved toward the air chamber (23) and the inlet port (22) in a reciprocating manner. Consequently, the possibility of combining the detection material (31) of the sample (3) with the bonding material (24) in the reaction area is increased. Afterwards, an optical signal from the reaction area is measured.
5 US10720751B2
Optical package structure, optical module, and method for manufacturing the same
Publication/Patent Number: US10720751B2 Publication Date: 2020-07-21 Application Number: 16/118,228 Filing Date: 2018-08-30 Inventor: Tsai yu hsuan   Lai, Lu-ming   Chen, Ying-chung   Tang, Shih-chieh   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: G02B6/02 Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
6 US2020206735A1
DETECTION METHOD, DEVICE AND CARTRIDGE FOR ENHANCING DETECTION SIGNAL INTENSITY
Publication/Patent Number: US2020206735A1 Publication Date: 2020-07-02 Application Number: 16/709,605 Filing Date: 2019-12-10 Inventor: Chiou, Chi-han   Liao, Shu-hsien   Tsai yu hsuan   Chang, Ching-yu   Assignee: Delta Electronics, Inc.   IPC: B01L3/00 Abstract: A detection method for enhancing detection signal intensity is provided. The detection method includes the following steps. Firstly, a detection device is provided. The detection device includes a channel, an inlet port and an air chamber. The air chamber includes an elastic layer. A bonding material is immobilized in the channel and served as a reaction area. Then, a sample containing a detection material is loaded into the inlet port. As the elastic layer is moved upwardly and downwardly, the sample is moved toward the air chamber and the inlet port in a reciprocating manner. Consequently, the possibility of combining the detection material of the sample with the bonding material in the reaction area is increased. Afterwards, an optical signal from the reaction area is measured.
7 US10841679B2
Microelectromechanical systems package structure
Publication/Patent Number: US10841679B2 Publication Date: 2020-11-17 Application Number: 15/879,335 Filing Date: 2018-01-24 Inventor: Hsiao, Hsu-liang   Tsai yu hsuan   Huang, Pu Shan   Huang, Ching-han   Lai, Lu-ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H04R1/04 Abstract: A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.
8 US2020283288A1
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020283288A1 Publication Date: 2020-09-10 Application Number: 16/885,150 Filing Date: 2020-05-27 Inventor: Lee, Ming Yen   Sung, Chia-hao   Huang, Ching-han   Tsai yu hsuan   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: B81B7/00 Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.
9 US10734337B2
Semiconductor package device having glass transition temperature greater than binding layer temperature
Publication/Patent Number: US10734337B2 Publication Date: 2020-08-04 Application Number: 16/293,606 Filing Date: 2019-03-05 Inventor: Chen, Kuang-hsiung   Tsai yu hsuan   Lee, Yu-ying   Wang, Sheng-ming   Syu, Wun-jheng   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L23/28 Abstract: A micro-electromechanical systems (MEMS) package structure includes: (1) a circuit layer; (2) a MEMS die with an active surface, wherein the active surface faces the circuit layer; (3) a conductive pillar adjacent to the MEMS die; and (4) a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar.
10 US10689248B2
Semiconductor device package and method of manufacturing the same
Publication/Patent Number: US10689248B2 Publication Date: 2020-06-23 Application Number: 15/921,265 Filing Date: 2018-03-14 Inventor: Lee, Ming Yen   Sung, Chia Hao   Huang, Ching-han   Tsai yu hsuan   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: B81B7/00 Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.
11 US202002162A1
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication/Patent Number: US202002162A1 Publication Date: 2020-01-02 Application Number: 20/191,645 Filing Date: 2019-06-25 Inventor: Lai, Lu-ming   Tsai yu hsuan   Tseng, Chi Sheng   Chen, Yin-hao   Wu, Hsin Lin   Yu, San-kuei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/498 Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
12 US2020002162A1
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication/Patent Number: US2020002162A1 Publication Date: 2020-01-02 Application Number: 16/452,370 Filing Date: 2019-06-25 Inventor: Tseng, Chi Sheng   Lai, Lu-ming   Tsai yu hsuan   Chen, Yin-hao   Wu, Hsin Lin   Yu, San-kuei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: B81C1/00 Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
13 US10170658B2
Semiconductor package structures and method of manufacturing the same
Publication/Patent Number: US10170658B2 Publication Date: 2019-01-01 Application Number: 14/941,069 Filing Date: 2015-11-13 Inventor: Tsai yu hsuan   Lai, Lu-ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L31/173 Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.
14 TW201924016A
Optical package structure, optical module, and method for manufacturing the same
Publication/Patent Number: TW201924016A Publication Date: 2019-06-16 Application Number: 107134051 Filing Date: 2018-09-27 Inventor: Chen, Ying-chung   Tang, Shih-chieh   Tsai yu hsuan   Lai, Lu-ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01S5/40 Abstract: The present disclosure provides an optical package structure, including a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
15 US2019097387A1
OPTICAL PACKAGE STRUCTURE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: US2019097387A1 Publication Date: 2019-03-28 Application Number: 16/118,228 Filing Date: 2018-08-30 Inventor: Tsai yu hsuan   Lai, Lu-ming   Chen, Ying-chung   Tang, Shih-chieh   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01S5/022 Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
16 US201997387A1
OPTICAL PACKAGE STRUCTURE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: US201997387A1 Publication Date: 2019-03-28 Application Number: 20/181,611 Filing Date: 2018-08-30 Inventor: Chen, Ying-chung   Lai, Lu-ming   Tsai yu hsuan   Tang, Shih-chieh   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01S5/40 Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
17 EP2890703B8
SYNTHESIS OF DIVERSE GLYCOSYLPHOSPHATIDYLINOSITOL GLYCANS FROM TOXOPLASMA GONDII AND THEIR APPLICATION AS VACCINES AND DIAGNOSTICS
Publication/Patent Number: EP2890703B8 Publication Date: 2019-03-06 Application Number: 13739727.9 Filing Date: 2013-07-23 Inventor: Azzouz, Nahid   GÖtze, Sebastian   Seeberger, Peter H.   Silva, Daniel Varon   Tsai yu hsuan   Assignee: Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V.   IPC: C07H15/207
18 US10224298B2
Semiconductor package device having glass transition temperature greater than binding layer temperature
Publication/Patent Number: US10224298B2 Publication Date: 2019-03-05 Application Number: 15/649,474 Filing Date: 2017-07-13 Inventor: Chen, Kuang-hsiung   Tsai yu hsuan   Lee, Yu-ying   Wang, Sheng-ming   Syu, Wun-jheng   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L23/28 Abstract: In one or more embodiments, a micro-electromechanical systems (MEMS) package structure comprises a MEMS die, a conductive pillar adjacent to the MEMS die, a package body and a binding layer on the package body. The package body encapsulates the MEMS die and the conductive pillar, and exposes a top surface of the conductive pillar. A glass transition temperature (Tg) of the package body is greater than a temperature for forming the binding layer (Tc).
19 US2019198469A1
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2019198469A1 Publication Date: 2019-06-27 Application Number: 16/293,606 Filing Date: 2019-03-05 Inventor: Chen, Kuang-hsiung   Tsai yu hsuan   Lee, Yu-ying   Wang, Sheng-ming   Syu, Wun-jheng   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/00 Abstract: A micro-electromechanical systems (MEMS) package structure includes: (1) a circuit layer; (2) a MEMS die with an active surface, wherein the active surface faces the circuit layer; (3) a conductive pillar adjacent to the MEMS die; and (4) a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar.
20 US2019267298A1
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: US2019267298A1 Publication Date: 2019-08-29 Application Number: 16/282,147 Filing Date: 2019-02-21 Inventor: Wu, Hsin Lin   Tsai yu hsuan   Tsai, Chang Chin   Lai, Lu-ming   Huang, Ching-han   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/20 Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.