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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US2021091019A1
DISTRIBUTION LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF, AND BOND PAD STRUCTURE
Publication/Patent Number: US2021091019A1 Publication Date: 2021-03-25 Application Number: 17/109,783 Filing Date: 2020-12-02 Inventor: Wu ping heng   Hsu, Chieh-ting   Assignee: Changxin Memory Technologies, Inc.   IPC: H01L23/00 Abstract: A distribution layer structure and a manufacturing method thereof, and a bond pad structure are provided. The distribution layer structure includes a dielectric layer and a wire layer embedded in the dielectric layer. The wire layer includes a frame and a connection line, the frame has at least two openings and is divided into a plurality of segments by the at least two openings. The connection line is located in the frame and has a plurality of connecting ends connected to the frame. The connection line divides an interior of the frame into a plurality of areas, with each segment connected to one of the connecting ends, and each area connected to one of the openings. This structure provides improved binding force between the wire layer and the dielectric layer without increasing a resistance of a wire connecting with a top bond pad.
2
TWI651911B
Cascaded power converter apparatus
Publication/Patent Number: TWI651911B Publication Date: 2019-02-21 Application Number: 106139223 Filing Date: 2017-11-13 Inventor: Wu ping heng   Cheng, Po-tai   Assignee: National Tsing Hua University   IPC: H02J3/26 Abstract: A cascaded power converter apparatus includes a plurality of grid voltage generators, a plurality of autonomous voltage regulators (AVRs) and a total current regulator (TCR). The grid voltage generators respectively provide a plurality of grid voltages, each of the grid voltage generators includes a plurality of power converters, and the power converters are divided into a plurality of prior stage power converters and at least one rear stage power converter. Each of the AVRs controls a voltage converting operation of corresponding prior stage power converter according to corresponding prior direct current (DC) voltage and grid voltage. The TCR controls voltage converting operations of the rear stage power converters according to a plurality of grid currents and rear stage DC voltages of the rear stage power converters.
3
TW201919298A
Cascaded power converter apparatus
Publication/Patent Number: TW201919298A Publication Date: 2019-05-16 Application Number: 106139223 Filing Date: 2017-11-13 Inventor: Wu ping heng   Cheng, Po-tai   Assignee: National Tsing Hua University   IPC: H02J5/00 Abstract: A cascaded power converter apparatus includes a plurality of grid voltage generators, a plurality of autonomous voltage regulators (AVRs) and a total current regulator (TCR). The grid voltage generators respectively provide a plurality of grid voltages, each of the grid voltage generators includes a plurality of power converters, and the power converters are divided into a plurality of prior stage power converters and at least one rear stage power converter. Each of the AVRs controls a voltage converting operation of corresponding prior stage power converter according to corresponding prior direct current (DC) voltage and grid voltage. The TCR controls voltage converting operations of the rear stage power converters according to a plurality of grid currents and rear stage DC voltages of the rear stage power converters.
4
US9659886B2
Method of fabricating semiconductor device having voids between top metal layers of metal interconnects
Publication/Patent Number: US9659886B2 Publication Date: 2017-05-23 Application Number: 15/193,117 Filing Date: 2016-06-27 Inventor: Lin, Chung-hsin   Wu ping heng   Lay, Chao-wen   Wu, Hung-mo   Chuang, Ying-cheng   Assignee: NANYA TECHNOLOGY CORPORATION   IPC: H01L23/528 Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof. The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.
5
TWI532136B
Semiconductor device and method of fabricating the same
Publication/Patent Number: TWI532136B Publication Date: 2016-05-01 Application Number: 102142675 Filing Date: 2013-11-22 Inventor: Wu, Hung Mo   Chuang, Ying Cheng   Wu, Ping Heng   Lay, Chao Wen   Lin, Chung Hsin   Assignee: Nanya Technology Corporation   IPC: H01L21/60 Abstract: The invention provides a semiconductor device including a substrate
6
US2016307859A1
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication/Patent Number: US2016307859A1 Publication Date: 2016-10-20 Application Number: 15/193,117 Filing Date: 2016-06-27 Inventor: Lin, Chung-hsin   Wu ping heng   Lay, Chao-wen   Wu, Hung-mo   Chuang, Ying-cheng   Assignee: NANYA TECHNOLOGY CORPORATION   IPC: H01L23/00 Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof. The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.
7
US9418949B2
Semiconductor device having voids between top metal layers of metal interconnects
Publication/Patent Number: US9418949B2 Publication Date: 2016-08-16 Application Number: 14/028,554 Filing Date: 2013-09-17 Inventor: Lin, Chung-hsin   Wu ping heng   Lay, Chao-wen   Wu, Hung-mo   Chuang, Ying-cheng   Assignee: NANYA TECHNOLOGY CORPORATION   IPC: H01L23/528 Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof. The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.
8
TW201513284A
Semiconductor device and method of fabricating the same
Publication/Patent Number: TW201513284A Publication Date: 2015-04-01 Application Number: 102142675 Filing Date: 2013-11-22 Inventor: Wu, Hung Mo   Chuang, Ying Cheng   Wu, Ping Heng   Lay, Chao Wen   Lin, Chung Hsin   Assignee: Nanya Technology Corporation   IPC: H01L21/60 Abstract: The invention provides a semiconductor device including a substrate
9
US2015076698A1
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication/Patent Number: US2015076698A1 Publication Date: 2015-03-19 Application Number: 14/028,554 Filing Date: 2013-09-17 Inventor: Lin, Chung-hsin   Wu ping heng   Lay, Chao-wen   Wu, Hung-mo   Chuang, Ying-cheng   Assignee: NANYA TECHNOLOGY CORPORATION   IPC: H01L23/00 Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.
10
TWI321022B
Detecting system for an hearing aid
Publication/Patent Number: TWI321022B Publication Date: 2010-02-21 Application Number: 95137779 Filing Date: 2006-10-13 Inventor: Wu, Hsin Yi   Liu, Kuan Yu   Wu, Ping Heng   Wu, Hsi Hsiu   Wang, Chia An   Assignee: NAN KAI LNSTITUTE OF TECHNOLOGY   IPC: G06F19/00 Abstract: A detecting system for an hearing aid comprises a digital hearing aid
11
TWI296925B
Push-pull box rehabilitation system
Publication/Patent Number: TWI296925B Publication Date: 2008-05-21 Application Number: 95135910 Filing Date: 2006-09-28 Inventor: Wu, Hsin Yi   Liu, Kuan Yu   Wu, Ping Heng   Wu, Hsi Hsiu   Assignee: NAN KAI COLLEGE   IPC: A61H1/00 Abstract: A push-pull box rehabilitation system
12
TW200818961A
Detecting system for an hearing aid
Publication/Patent Number: TW200818961A Publication Date: 2008-04-16 Application Number: 95137779 Filing Date: 2006-10-13 Inventor: Wu, Hsin Yi   Liu, Kuan Yu   Wu, Ping Heng   Wu, Hsi Hsiu   Wang, Chia An   Assignee: NAN KAI LNSTITUTE OF TECHNOLOGY   IPC: G06F19/00 Abstract: A detecting system for an hearing aid comprises a digital hearing aid
13
TW200814985A
Push-pull box rehabilitation system
Publication/Patent Number: TW200814985A Publication Date: 2008-04-01 Application Number: 95135910 Filing Date: 2006-09-28 Inventor: Wu, Hsin Yi   Liu, Kuan Yu   Wu, Ping Heng   Wu, Hsi Hsiu   Assignee: NAN KAI COLLEGE   IPC: A61H1/00 Abstract: A push-pull box rehabilitation system
14
TW200816974A
Physical rehabilitation system for coordinating movement of upper extremities
Publication/Patent Number: TW200816974A Publication Date: 2008-04-16 Application Number: 95137409 Filing Date: 2006-10-11 Inventor: Wu, Hsin Yi   Liu, Kuan Yu   Wu, Ping Heng   Wu, Hsi Hsiu   Assignee: NAN KAI LNSTITUTE OF TECHNOLOGY   IPC: A61H1/00 Abstract: A physical rehabilitation system for coordinating movement of upper extremities mainly comprises a board
15
TWI303988B
Physical rehabilitation system for coordinating movement of upper extremities
Publication/Patent Number: TWI303988B Publication Date: 2008-12-11 Application Number: 95137409 Filing Date: 2006-10-11 Inventor: Wu, Hsin Yi   Liu, Kuan Yu   Wu, Ping Heng   Wu, Hsi Hsiu   Assignee: NAN KAI LNSTITUTE OF TECHNOLOGY   IPC: A61H1/00 Abstract: A physical rehabilitation system for coordinating movement of upper extremities mainly comprises a board
16
TW200816972A
Physical rehabilitation system for upper extremities
Publication/Patent Number: TW200816972A Publication Date: 2008-04-16 Application Number: 95136732 Filing Date: 2006-10-03 Inventor: Liu, Kuan-yu   Wu, Hsin-yi   Wu, Hsi-hsiu   Wu ping heng   Assignee: NAN KAI INSTITUTE OF TECHNOLOGY   IPC: A61H1/00 Abstract: A physical rehabilitation system for upper extremities
17
TW200844915A
An automatic diagnosing method and automatic failure-reporting device for traffic lights
Publication/Patent Number: TW200844915A Publication Date: 2008-11-16 Application Number: 96116748 Filing Date: 2007-05-11 Inventor: Liu, Kuan-yu   Wu, Hsin-yi   Wu, Hsi-hsiu   Wu ping heng   Assignee: NAN KAI INSTITUTE OF TECHNOLOGY   IPC: G08G1/07 Abstract: This invention relates to an automatic diagnosing method and automatic failure-reporting device for traffic lights. Without altering the structure of current traffic lights
18
TWI294776B
Physical rehabilitation system for upper extremities
Publication/Patent Number: TWI294776B Publication Date: 2008-03-21 Application Number: 95136732 Filing Date: 2006-10-03 Inventor: Liu, Kuan-yu   Wu, Hsin-yi   Wu, Hsi-hsiu   Wu ping heng   Assignee: NAN KAI INSTITUTE OF TECHNOLOGY   IPC: A61H1/00 Abstract: A physical rehabilitation system for upper extremities