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1 | US10921743B2 |
Information processing apparatus that enables communication with image forming apparatus to which fixing devices of different types are selectively attachable, image forming apparatus, and control method therefor
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Publication/Patent Number: US10921743B2 | Publication Date: 2021-02-16 | Application Number: 16/874,965 | Filing Date: 2020-05-15 | Inventor： Inoue, Seita Hayakawa, Takuya Kakomura, Kiyoharu Omura, Naoka Ohta, Yuya Nishimura, Shunsuke Yamamoto, Yuichi Kojima, Satoru | Assignee: Canon Kabushiki Kaisha | IPC: G03G15/00 | Abstract: An information processing apparatus that is capable of improving estimating accuracy of a usable period of a fixing device. The information processing apparatus enables communication with an image forming apparatus to which one of fixing devices is selectively attachable. A controller obtains information about a type of a fixing device attached, determines a remaining period of a second fixing device based on second data about a consumption amount of the second fixing device in a case where a first fixing device of a first type is replaced with the second fixing device of a second type, and determines a remaining period of a third fixing device based on first data about a consumption amount of the first fixing device and third data about a consumption amount of the third fixing device in a case where the first fixing device is replaced with the third fixing device of the first type. | |||
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2 | US2020251428A1 |
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INTEGRATED SUBSTRATE, AND ELECTRONIC DEVICE
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Publication/Patent Number: US2020251428A1 | Publication Date: 2020-08-06 | Application Number: 16/857,110 | Filing Date: 2020-04-23 | Inventor： Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L23/00 | Abstract: The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element. | |||
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3 | US10672724B2 |
Semiconductor device, manufacturing method of semiconductor device, integrated substrate, and electronic device
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Publication/Patent Number: US10672724B2 | Publication Date: 2020-06-02 | Application Number: 16/086,708 | Filing Date: 2017-03-17 | Inventor： Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L23/053 | Abstract: The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element. | |||
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4 | EP3748664A1 |
ELECTROMAGNETIC CONTACTOR
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Publication/Patent Number: EP3748664A1 | Publication Date: 2020-12-09 | Application Number: 20187679.4 | Filing Date: 2012-05-09 | Inventor： Yokoyama, Shoji Yamamoto, Yuichi | Assignee: Fuji Electric FA Components & Systems Co. Ltd. | IPC: H01H50/02 | Abstract: There is provided an electromagnetic contactor such that it is possible to improve productivity, and simplify a brazing jig, and furthermore, it is possible to control the flatness and warpage of a plate portion supporting fixed contacts. An electromagnetic contactor includes an arc extinguishing chamber (102) inside which is mounted a contact mechanism (101) having a pair of fixed contacts (111) and (112) and a movable contact (130) in contact with the pair of fixed contacts, wherein the arc extinguishing chamber (102) has a plate-like fixed contact support substrate (105) wherein metal foils are each formed at least around through holes (105) and (106) in which are fixed the pair of fixed contacts and on an outer peripheral edge of one surface by a metalizing process, is such that the pair of fixed contacts (111) and (112) and a metal cylindrical body (104) are brazed and joined to the metal foils of the fixed contact support insulating substrate (105), and an insulating cylindrical body (140) is disposed on the inner peripheral surface of the metal cylindrical body (104). | |||
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5 | EP2711956B1 |
ELECTROMAGNETIC CONTACTOR
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Publication/Patent Number: EP2711956B1 | Publication Date: 2020-09-09 | Application Number: 12785055.0 | Filing Date: 2012-05-09 | Inventor： Yokoyama, Shoji Yamamoto, Yuichi | Assignee: Fuji Electric FA Components & Systems Co. Ltd. | IPC: H01H50/02 | ||||
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6 | US10574844B2 |
Image reading device, document feeder device, and image forming apparatus
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Publication/Patent Number: US10574844B2 | Publication Date: 2020-02-25 | Application Number: 15/728,185 | Filing Date: 2017-10-09 | Inventor： Yamamoto, Yuichi Kawamura, Shinji | Assignee: Canon Kabushiki Kaisha | IPC: H04N1/00 | Abstract: An image reading device includes a turning unit, a hinge, and a reading unit having a reader that reads a sheet image. The hinge turns the turning unit which turns relative to the reading unit. The reader reads, through a reading unit reading glass, an image on a sheet placed on the reading glass. The turning unit includes a pressing plate, a conveying roller, a motor, and a communication unit. The pressing plate presses a sheet against the reading glass when the turning unit is at a position closing the reading glass. The motor rotates the conveying roller to convey a sheet. In a direction perpendicular to a turning axis line direction of the hinge, the motor is disposed on one side of the turning unit. The communication unit is disposed on the other side and receives data from outside of the image reading device. | |||
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7 | EP3310031B1 |
IMAGE READING DEVICE, DOCUMENT FEEDER DEVICE, AND IMAGE FORMING APPARATUS
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Publication/Patent Number: EP3310031B1 | Publication Date: 2020-07-08 | Application Number: 17195950.5 | Filing Date: 2017-10-11 | Inventor： Yamamoto, Yuichi Kawamura, Shinji | Assignee: CANON KABUSHIKI KAISHA | IPC: H04N1/00 | ||||
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8 | EP3595173A1 |
DEMULTIPLEXING CIRCUIT, MULTIPLEXING CIRCUIT, AND CHANNELIZER RELAY UNIT
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Publication/Patent Number: EP3595173A1 | Publication Date: 2020-01-15 | Application Number: 18764164.2 | Filing Date: 2018-03-05 | Inventor： Takemoto, Yuta Fujimura, Akinori Yamamoto, Yuichi | Assignee: Mitsubishi Electric Corporation | IPC: H03H17/00 | Abstract: A multi-stage demultiplexing circuit in which a plurality of circuits each combining a selector and a frequency decimation circuit are connected is included. The selector selects one of input signals based on a control signal, and generates a plurality of output signals. The plurality of output signals output from the selector are input to the frequency decimation circuit, and the frequency decimation circuit performs frequency conversion processing, low pass filter processing, and down-sampling processing based on a control signal to generate an output signal. Two or more reception signals are input to the multi-stage demultiplexing circuit, and the multi-stage demultiplexing circuit executes demultiplexing processing based on a control signal so that an output signal that includes an unused band portion is prevented from being output downstream. | |||
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9 | US10672722B2 |
Mounting component and electronic device
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Publication/Patent Number: US10672722B2 | Publication Date: 2020-06-02 | Application Number: 16/299,358 | Filing Date: 2019-03-12 | Inventor： Kasai, Ryohei Tsunoda, Tsuyoshi Yamamoto, Yuichi Sagara, Shuji Tanaka, Masaya | Assignee: DAI NIPPON PRINTING Co., Ltd. | IPC: H01L23/12 | Abstract: Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer. | |||
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10 | EP3595192A1 |
DIGITAL SWITCH, WIRELESS COMMUNICATION DEVICE, CONTROL STATION, AND WIRELESS COMMUNICATION CONTROL METHOD
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Publication/Patent Number: EP3595192A1 | Publication Date: 2020-01-15 | Application Number: 18764545.2 | Filing Date: 2018-03-06 | Inventor： Tsuji, Kazuyoshi Fujimura, Akinori Takemoto, Yuta Hirakuri, Shinya Yamamoto, Yuichi | Assignee: Mitsubishi Electric Corporation | IPC: H04B7/185 | Abstract: Provided is a digital switch including: a plurality of input-side memories, which are arranged in a one-to-one correspondence with a plurality of input ports, and are configured to accumulate time-division multiplexed data; a plurality of output-side memories, which are arranged in a one-to-one correspondence with a plurality of output ports, and are configured to accumulate time-division multiplexed data; and a switch matrix configured to receive, as input, the time-division multiplexed data read out in every cycle from each of the plurality of input-side memories, and execute routing for selecting, in accordance with a connection control signal received from outside, any one of the plurality of output-side memories such that the time-division multiplexed data read out in every cycle is output from each of the plurality of output ports without causing a difference in delay, to output the time-division multiplexed data. | |||
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11 | US2020364004A1 |
INFORMATION PROCESSING APPARATUS THAT ENABLES COMMUNICATION WITH IMAGE FORMING APPARATUS THAT HAS CONSUMABLE, IMAGE FORMING APPARATUS THAT HAS CONSUMABLE, AND CONTROL METHOD FOR IMAGE FORMING APPARATUS THAT HAS CONSUMABLE
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Publication/Patent Number: US2020364004A1 | Publication Date: 2020-11-19 | Application Number: 16/847,303 | Filing Date: 2020-04-13 | Inventor： Omura, Naoka Hayakawa, Takuya Kakomura, Kiyoharu Inoue, Seita Ohta, Yuya Nishimura, Shunsuke Yamamoto, Yuichi Kojima, Satoru | Assignee: CANON KABUSHIKI KAISHA | IPC: G06F3/12 | Abstract: An information processing apparatus that is capable of reducing a delay of delivery of a consumable even if a history of a consumption amount of a consumable is erased. The information processing apparatus enables communication with an image forming apparatus that has a consumable. The information processing apparatus includes a memory that stores data related to a consumption amount of the consumable, a controller configured to determine a future change of a remaining amount of the consumable from the data stored in the memory based on a first determination condition, control a timing at which a delivery request that urges delivery of a replacement consumable is output based on the future change, and receive user instruction information. The controller determines the future change from the data stored in the memory based on a second determination condition that is different from the first determination condition after receiving the user instruction information. | |||
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12 | EP3706169A1 |
BACKSIDE IRRADIATION TYPE SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING BACKSIDE IRRADIATION TYPE SOLID-STATE IMAGING DEVICE, IMAGING DEVICE, AND ELECTRONIC APPARATUS
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Publication/Patent Number: EP3706169A1 | Publication Date: 2020-09-09 | Application Number: 18872679.8 | Filing Date: 2018-10-16 | Inventor： Takachi, Taizo Yamamoto, Yuichi Saito, Suguru Wakiyama, Satoru Ootsuka, Yoichi Komai, Naoki Takimoto, Kaori Iijima, Tadashi Haneda, Masaki Nagata, Masaya | Assignee: Sony Semiconductor Solutions Corporation | IPC: H01L27/146 | Abstract: The present disclosure relates to a backside illumination type solid-state imaging device, a manufacturing method for a backside illumination type solid-state imaging device, an imaging apparatus, and electronic equipment by which the manufacturing cost can be reduced. A singulated memory circuit and a singulated logic circuit are laid out in a horizontal direction and are embedded by an oxide film and flattened, and then are stacked so as to be contained in a plane direction under a solid-state imaging element. The present disclosure can be applied to an imaging apparatus. | |||
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13 | US2020273897A1 |
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
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Publication/Patent Number: US2020273897A1 | Publication Date: 2020-08-27 | Application Number: 16/807,049 | Filing Date: 2020-03-02 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. | |||
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14 | US2020258924A1 |
BACKSIDE ILLUMINATION TYPE SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD FOR BACKSIDE ILLUMINATION TYPE SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS AND ELECTRONIC EQUIPMENT
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Publication/Patent Number: US2020258924A1 | Publication Date: 2020-08-13 | Application Number: 16/758,535 | Filing Date: 2018-10-16 | Inventor： Takachi, Taizo Yamamoto, Yuichi Saito, Suguru Wakiyama, Satoru Ootsuka, Yoichi Komai, Naoki Takimoto, Kaori Iijima, Tadashi Haneda, Masaki Nagata, Masaya | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: H01L27/146 | Abstract: The present disclosure relates to a backside illumination type solid-state imaging device, a manufacturing method for a backside illumination type solid-state imaging device, an imaging apparatus, and electronic equipment by which the manufacturing cost can be reduced. A singulated memory circuit and a singulated logic circuit are laid out in a horizontal direction and are embedded by an oxide film and flattened, and then are stacked so as to be contained in a plane direction under a solid-state imaging element. The present disclosure can be applied to an imaging apparatus. |
