Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
CN212286297U
一种激光对焊机
Grant
Publication/Patent Number: CN212286297U Publication Date: 2021-01-05 Application Number: 202020207930.5 Filing Date: 2020-02-25 Inventor: 张曙红   Assignee: 宁波市美科劳义齿研发有限公司   IPC: B23K26/22 Abstract: 本实用新型一种激光对焊机,创新采用摄像头对准焊接点,并设置滤镜活动移动,在没焊接时摄像头直视对焦,焊接时加装滤镜,减轻焊光对摄像头的损坏,并确保摄像、焊接工作的持续性,摄像头所摄录的实时状况在显示屏上实时展现,便于加工人员对着显示屏移动加工物件持续操作;体现激光对焊机的创新性、创造性和实用性;必将受到专业人士和市场的喜爱。
2
EP3766623A1
LASER POWER CONTROL DEVICE, LASER PROCESSING DEVICE, AND LASER POWER CONTROL METHOD
Publication/Patent Number: EP3766623A1 Publication Date: 2021-01-20 Application Number: 19767064.9 Filing Date: 2019-03-08 Inventor: Aiba, Takeshi   Assignee: Sumitomo Heavy Industries, Ltd.   IPC: B23K26/03 Abstract: Provided are a laser power control device, a laser machining device, and a laser power control method capable of reducing a time needed to measure power of a laser beam. A laser machining device (1) and a laser power control device (10) includes a storage unit (12) that stores relational data having a measurement value of a heat radiation sensor (27), which measures heat radiation of an irradiation object (42) irradiated with the laser beam from the laser machining device, in association with a power value of the laser beam on a machining surface of the laser machining device.
3
US2021023651A1
LASER WELDING METHOD
Publication/Patent Number: US2021023651A1 Publication Date: 2021-01-28 Application Number: 17/066,823 Filing Date: 2020-10-09 Inventor: Sakurai, Michio   Mishima, Toshiyuki   Sakai, Toru   Kubota, Kenta   Urata, Kensuke   Assignee: Panasonic Intellectual Property Management Co., Ltd.   IPC: B23K26/03 Abstract: A plurality of values measured are relatively compared to determine an optical axis deviation direction in which an optical axis of a measurement beam S deviates from a laser beam L. In performing laser welding in the optical axis deviation direction, an irradiation position of the measurement beam S is changed so that the irradiation position of the measurement beam S is moved to a rear side of the center of the optical axis of the laser beam L in the welding direction.
4
CN109689277B
用于在沉积焊接方法中的过程监控的装置和方法
Grant
Publication/Patent Number: CN109689277B Publication Date: 2021-01-05 Application Number: 201780040345.1 Filing Date: 2017-06-14 Inventor: 霍尔格·佩法尔   克里斯汀·凯德威格   Assignee: 萨奥有限公司   IPC: B23K26/03 Abstract: 本发明涉及一种用于在沉积焊接方法中的过程监控的装置和方法。本发明的目的在于提供一种用于在沉积焊接方法中的过程监控的进一步优化的装置,并且可以可靠地避免可能影响产品质量的处理偏差。令人惊奇的是,现有技术中已知的用于在沉积焊接中过程监控的装置可以改进成为基本上优化的过程监控,其中所述装置增加用于检测时间段的装置和用于自由中止沉积焊接处理的装置,在所述时间段中,所检测的所述表面区域比预定的最小值大,所述用于自由中止沉积焊接处理的装置在所检测的表面区域的时间段比预定的时间值大的时间段的情况下自动中止沉积焊接处理。
5
CN112203797A
激光加工机、控制装置及判定方法
Substantial Examination
Publication/Patent Number: CN112203797A Publication Date: 2021-01-08 Application Number: 201880093079.3 Filing Date: 2018-05-07 Inventor: 西胁基晃   腰前利树   大村浩嘉   小筑隆博   Assignee: 三菱电机株式会社   IPC: B23K26/382 Abstract: 激光加工机(100)由下述部分构成:激光振荡器(1),其射出激光(4);加工头(5),其通过照射激光(4)而对工件(9)进行激光加工;控制装置(10),其对激光振荡器(1)及加工头(5)进行控制;光传感器(8),其对激光(4)照射至工件(9)时产生的来自工件(9)的散射光进行测定而输出与散射光相对应的信号;阈值设定部(14),其基于在穿孔加工开始后的一定期间输出的信号,对成为通过穿孔加工而孔是否贯通工件(9)的判定基准的阈值进行设定;以及贯通判定部(13),其基于信号及阈值,对孔是否贯通工件(9)进行判定。
6
CN112222626A
PCB板白漆处二氧化碳激光打标的视觉定位装置及方法
Substantial Examination
Publication/Patent Number: CN112222626A Publication Date: 2021-01-15 Application Number: 202010978052.1 Filing Date: 2020-09-17 Inventor: 吴俊   Assignee: 武汉中谷联创光电科技股份有限公司   IPC: B23K26/362 Abstract: 本发明涉及一种PCB板白漆处二氧化碳激光打标的视觉定位装置及方法,其中,阻挡气缸,视觉识别系统,二氧化碳激光器,振镜,电机,X轴移动副,Y轴移动副,传送带安装在机架顶部,电机固定在机架的箱体内,所述电机与传送带连接,PCB板位于传送带上,二氧化碳激光器与X轴移动副和Y轴移动副连接,视觉识别系统、振镜、633nm线性光源安装在二氧化碳激光器的激光头上,PLC与电机电连接,电机与X轴移动副和Y轴移动副连接,上位机与工控机电连接,工控机与打标板卡电连接,打标板卡与二氧化碳激光器电连接。本发明能对PCB板白漆处指定位置打标,打标位置精度高,保证了设备平稳运行,提高了工作效率,降低了人员劳动强度。
7
CN109014590B
一种激光蚀刻超幅面自由拼接加工方法
Grant
Publication/Patent Number: CN109014590B Publication Date: 2021-01-26 Application Number: 201810899723.8 Filing Date: 2018-08-09 Inventor: 许军成   郁国松   金朝龙   Assignee: 天弘激光(宿迁)有限公司   IPC: B23K26/362 Abstract: 本发明公开了一种激光蚀刻超幅面自由拼接加工方法,该方法由影像识别系统、传动机构和激光蚀刻机构建的拼接加工装置实现,通过传动机构配合激光蚀刻机实现对待加工片料中不同幅面的蚀刻,同时通过激光刻蚀机实现对已经蚀刻的产品幅面作辅助图形标记;再通过影像识别系统对已蚀刻的产品幅面的辅助图形标记进行识别和定位,并计算当前蚀刻幅面与下一蚀刻幅面和前一蚀刻幅面的角度偏移,根据偏移角度和幅面进行每一次加工长度的传动和加工幅面的调节,以保证当前幅面与前一幅面或下一幅面的拼接位置统一;本发明实现了激光蚀刻超幅面自由拼接加工,解决了超幅面产品激光蚀刻的拼接问题,为超幅面产品激光蚀刻高精度拼接加工提供了解决方法。
8
CN212371455U
一种基于传像束的激光切割监视系统
Grant
Publication/Patent Number: CN212371455U Publication Date: 2021-01-19 Application Number: 202020962879.9 Filing Date: 2020-05-29 Inventor: 方笑尘   方强   Assignee: 方笑尘   IPC: B23K26/38 Abstract: 本实用新型公开了一种基于传像束的激光切割监视系统,由激光切割头、带有物镜的传像束、传像束固定装置和传像束像方监视系统组成;传像束固定装置把带有物镜的传像束与激光切割头固定在一起;带有物镜的传像束中的物镜将激光切割区域成像在传像束的端面,带有物镜的传像束中的传像束将其一个端面上的图像传递到另一个端面;传像束像方监视系统将传像束端面上的光学图像数字化,用于后续图像处理。本实用新型提供的监视系统光路独立于激光加工系统光路,既避免了对大功率激光光路的干扰,也避免了大功率激光光路对监视系统的影响,采用传像束成像系统,使监视系统小型化,并便于与激光切割头的连接,对激光切割头不造成额外影响。
9
CN112222609A
高峰值功率激光焦点的定位方法
Substantial Examination
Publication/Patent Number: CN112222609A Publication Date: 2021-01-15 Application Number: 202011001548.X Filing Date: 2020-09-22 Inventor: 吴分翔   冷雨欣   许毅   张宗昕   杨晓骏   钱佳毅   归佳彦   Assignee: 中国科学院上海光学精密机械研究所   IPC: B23K26/066 Abstract: 本发明公开了一种高峰值功率激光焦点的定位方法,放大激光先经多孔掩膜完成能量衰减,衰减后的激光进入压缩器压缩,然后被离轴抛面镜聚焦,其焦点通过CCD直接定位。此方法不需要引入其他复杂的能量衰减光路,仅利用多孔掩膜就可以将高峰值功率激光的能量充分衰减,而且不改变激光聚焦特性,从而能够实现激光焦点的直接定位。此外,通过优化多孔掩膜中小孔的数量和直径,还能轻松实现不同程度的激光能量衰减。本发明具有经济高效,实用性强的特点。
10
CN212330015U
一种基于同轴视觉系统的紫外激光加工装置
Grant
Publication/Patent Number: CN212330015U Publication Date: 2021-01-12 Application Number: 201922314716.X Filing Date: 2019-12-20 Inventor: 许靓   喻露   魏泽雄   Assignee: 武汉大音科技有限责任公司   IPC: B23K26/362 Abstract: 本实用新型公开了一种基于同轴视觉系统的紫外激光加工装置,包括反射镜片,成像镜片,同轴结构,视觉光源及振镜,激光光束从紫外激光器发出后沿轴向经过扩束镜,透过45度反射镜,依次经过振镜镜片,再透过场镜,聚焦后照射到工件上,从而对工件进行加工;其中,为了消除因人工每次上料时工件的位置误差,在激光器和工件之间设置了同轴CCD视觉系统,从而达到修正工件的位置误差的目的。通过二维偏振镜头,可以让工作台和工件固定不动,避免了工件运动带来的位置误差;通过同轴CCD视觉系统的“所见即所得”,消除人工每次的安装误差,通过以上一系列的设计,确保紫外激光加工的超高精度和极小的加工热影响。
11
US10888954B2
Method for monitoring and controlling a laser cutting process
Publication/Patent Number: US10888954B2 Publication Date: 2021-01-12 Application Number: 16/046,010 Filing Date: 2018-07-26 Inventor: Hesse, Tim   Schindhelm, David   Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG   IPC: B23K26/03 Abstract: An example device for monitoring and controlling a laser cutting process on a workpiece includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.
12
US2021013580A1
METHODS AND APPARATUSES FOR TUNING A FILTER
Publication/Patent Number: US2021013580A1 Publication Date: 2021-01-14 Application Number: 16/510,083 Filing Date: 2019-07-12 Inventor: Montoya, Ryan David   Brannon, Alan Scott   Assignee: CACI, Inc. - Federal   IPC: H01P11/00 Abstract: The present application describes a method of tuning a printed device. The method includes measuring a frequency response of a target device and a device under tune (DUT). The method includes computing, based on the measured frequency response, a coupling matrix for the target device and a coupling matrix for the DUT. The method also includes extracting eigenvalues for the coupling matrix of the target device and a first set of eigenvalues for the coupling matrix of the DUT. The eigenvalues of the target device are different than the first set of eigenvalues of the DUT. The method further includes tuning the DUT with a material removal source. The method even further includes measuring a second set of eigenvalues of the DUT. The second set of eigenvalues is different from the first set of eigenvalues of the DUT. The method yet even further includes calculating a tune path for iterative convergence of the second or a subsequent set of eigenvalues of the DUT with the eigenvalues of the target device. The method still even further includes observing the iterative convergence of the DUT and the target device.
13
CN109834385B
在激光加工中警告保护窗口的污染的激光加工装置
Grant
Publication/Patent Number: CN109834385B Publication Date: 2021-02-09 Application Number: 201811391001.8 Filing Date: 2018-11-21 Inventor: 和泉贵士   Assignee: 发那科株式会社   IPC: B23K26/03 Abstract: 本发明的激光加工装置具有:分束器,其配置在聚光透镜和保护窗口之间;返回光测定部,其经由分束器测定通过工件反射并返回到外部光学系统的返回光的强度分布;存储部,其存储表示保护窗口正常时的返回光的强度分布的正常图案以及表示保护窗口污染时的返回光的强度分布的异常图案中的至少一方的数据;处理部,其根据返回光的测定数据和正常图案及异常图案中至少一方的数据来检测在激光加工中进行检测保护窗口的污染的处理;以及警告部,其根据处理来警告保护窗口的污染。
14
CN212577805U
在线式激光焊接装置
Publication/Patent Number: CN212577805U Publication Date: 2021-02-23 Application Number: 202023080411.6 Filing Date: 2020-12-21 Inventor: 周雄伟   姚煜   陆继楠   Assignee: 快克智能装备股份有限公司   IPC: B23K26/21 Abstract: 本实用新型涉及一种在线式激光焊接装置,在基座上转动安装具有焊盘安装工位的转盘,并在基座上转盘的四周顺时针依次固定安装视觉定位组件、视觉定位测高组件、激光焊接运动组件和AOI检测视觉组件,视觉定位组件用于检测焊盘位置;视觉定位测高组件用于检测焊盘高度;激光焊接运动组件用于对处于正确位置和正确高度的焊盘进行焊接;AOI检测视觉组件用于检测焊点品质。本实用新型在对焊盘进行焊接前,判断焊盘位置,检测焊盘高度,并根据检测结果对符合要求的焊盘进行焊接,焊接完成后利用AOI检测视觉组件检测工件品质,提高了焊盘焊接效率、提升了焊盘产品品质。
15
CN212552339U
一种基于PLC控制的线材切断机
Grant
Publication/Patent Number: CN212552339U Publication Date: 2021-02-19 Application Number: 202021556158.4 Filing Date: 2020-07-31 Inventor: 秦春节   屠立群   包显功   Assignee: 浙江工业大学   IPC: B23K26/38 Abstract: 本实用新型涉及切断机技术领域,且公开了一种基于PLC控制的线材切断机,包括有工作台;所述工作台顶端的中部固定安装有支撑柱;所述支撑柱的上下两端分别固定安装有液晶显示屏和按钮面板;所述支撑柱中部的两侧均设置有绕线组件;所述工作台的顶部设置有导线组件、切割组件、连接板、测量单元和送线组件,所述导线组件、切割组件、连接板、测量单元和送线组件的数量均为两个,且对称设置在支撑柱的两侧;所述切割组件对称设置在工作台顶部的两侧;所述导线组件设置在绕线组件的下方。本实用新型通过PLC控制器和工控机的组合,能够控制切割组件对线材进行精准切割,在提高切割效率的同时,还能提高切割精度,为实际操作带来便利。
16
US2021016389A1
ADJUSTMENT ASSISTANCE DEVICE AND LASER WELDING APPARATUS
Publication/Patent Number: US2021016389A1 Publication Date: 2021-01-21 Application Number: 16/921,054 Filing Date: 2020-07-06 Inventor: Hatada, Masanobu   Yamamoto, Tomoyuki   Yoshida, Shigeo   Tanaka, Takahiro   Assignee: FANUC CORPORATION   IPC: B23K26/03 Abstract: An adjustment assistance device is attached to a galvanometer scanner at a laser output side of the galvanometer scanner and used to adjust a tool coordinate system of the galvanometer scanner. The adjustment assistance device includes a light-receiving member having a light-receiving surface, which is at least one flat surface; and a connecting member that connects the light-receiving member to the galvanometer scanner and that enables the light-receiving surface to face a laser output port of the galvanometer scanner with a predetermined distance therebetween. The light-receiving member includes a light-receiving mark portion on the light-receiving surface, the light-receiving mark portion being a mark used to quantify a relative positional difference between a reference light-receiving position for light output from the laser output port and an actual light-receiving position at which the light output from the laser output port is received.
17
US2021031298A1
LASER WELDING METHOD, AND LASER WELDING DEVICE
Publication/Patent Number: US2021031298A1 Publication Date: 2021-02-04 Application Number: 17/066,875 Filing Date: 2020-10-09 Inventor: Sakai, Toru   Sakurai, Michio   Mishima, Toshiyuki   Kubota, Kenta   Urata, Kensuke   Assignee: Panasonic Intellectual Property Management Co., Ltd.   IPC: B23K26/03 Abstract: A plurality of values measured are relatively compared to determine an optical axis deviation direction in which an optical axis of a measurement beam deviates from a laser beam. Then, a first parallel plate and a second parallel plate are rotated to move an irradiation position of the measurement beam so that an optical axis of the measurement beam is substantially coaxial with an optical axis of the laser beam.
18
US2021008663A1
LASER MARKING SYSTEM AND METHOD FOR LASER MARKING A WORKPIECE
Publication/Patent Number: US2021008663A1 Publication Date: 2021-01-14 Application Number: 16/510,046 Filing Date: 2019-07-12 Inventor: Raab, Simon   Longmuir, Mark S.   Assignee: MECCO Partners LLC   IPC: B23K26/18 Abstract: A laser marking system for marking a predetermined pattern on a workpiece may include a first light source structured to emit first light at a first wavelength; a second light source structured to emit second light at a second wavelength different from the first wavelength and selected to mark a marking surface of the workpiece; beam shaping optics structured to adjust a focal length of the second light; beam steering optics structured to aim the first laser light and the second laser light; a controller configured to control the first light source to emit the first light at the marking surface of the workpiece and control the beam steering optics to aim the second light so as to mark the marking surface of the workpiece and create the first predetermined pattern; and a camera structured to detect first light reflected from the marking surface and record an image.
19
CN112276385A
一种利用激光束在喷油嘴中加工喷孔的方法及系统
Public
Publication/Patent Number: CN112276385A Publication Date: 2021-01-29 Application Number: 202011557804.3 Filing Date: 2020-12-25 Inventor: 田东坡   张鹏   麻丁龙   Assignee: 西安中科微精光子制造科技有限公司   IPC: B23K26/382 Abstract: 本发明实施例公开了一种利用激光束在喷油嘴中加工喷孔的方法及系统,该方法包括:使所述激光束逐层扫描与所述喷孔的横截面对应的多个圆形区域,其中,每次扫描将所述喷油嘴的处于所述圆形区域下方的一定厚度的材料层去除;判断所述喷油嘴是否已经被贯穿;相应于所述喷油嘴已经被贯穿,确定待扫描的圆形区域中的已贯通区段;当所述激光束扫描所述已贯通区段时将所述激光束关闭。
20
CN112207444A
一种用于LED灯珠不良品标记的超高精度激光打标方法
Substantial Examination
Publication/Patent Number: CN112207444A Publication Date: 2021-01-12 Application Number: 202010978975.7 Filing Date: 2020-09-17 Inventor: 黄采敏   易群生   朱伟东   伏燕军   方利华   刘金生   Assignee: 广东吉洋视觉技术有限公司   IPC: B23K26/362 Abstract: 本发明公开一种用于LED灯珠不良品标记的超高精度激光打标方法;包括以下步骤:S1、LED元件编号转换成图像坐标;S2、对位点校正;S3、LED元件的实际图像位置获取;S4、激光打标坐标转换;根据相机和激光坐标关系,将LED元件的实际图像位置转换成激光位移坐标;S5、激光打标;激光根据激光位移坐标位置移动到相应的LED元件位置处对不良品LED元件进行激光烧断电路的标记;S6、机器出板;本发明采用了同轴相机和激光,利用相机和激光的特定坐标关系的标定方式,确定激光坐标,能够超高精度的对不良品LED元件进行激光标记,这种激光标记不良品的方式能够不受LED元件的排版间距的限制,对排版的数量也没有固定的限制。
Total 462 pages