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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US2005175301A1
Planar optical waveguide assembly
Publication/Patent Number: US2005175301A1 Publication Date: 2005-08-11 Application Number: 11/104,814 Filing Date: 2005-04-13 Inventor: Gardner, Geoffrey   Schmidt, Randall   Assignee: Gardner, Geoffrey   Schmidt, Randall   IPC: G03F007/26 Abstract: A planar optical waveguide assembly prepared by a method comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core.
2
US2005026083A1
Translucent polyester for enhancing contrast in lithographic printing members
Publication/Patent Number: US2005026083A1 Publication Date: 2005-02-03 Application Number: 10/898,619 Filing Date: 2004-07-26 Inventor: Ron, Hannoch   Assignee: Ron, Hannoch   IPC: G03F007/26 Abstract: The present invention provides for a method of enhancing visible contrast in an imaged lithographic printing plate, which comprises the use of a translucent or opaque polymer as a substrate for said plate. Such polymer may be high molecular weight polyester. The invention further provides a lithographic printing plate which comprises a substrate and at least one imaging layer, the substrate comprising translucent or opaque polymer.
3
US2005084802A1
Printing plate material
Publication/Patent Number: US2005084802A1 Publication Date: 2005-04-21 Application Number: 10/960,320 Filing Date: 2004-10-07 Inventor: Mori, Takahiro   Assignee: Konica Minolta Medical & Graphic, Inc.   IPC: G03F007/26 Abstract: Disclosed is a printing plate material comprising a support and provided thereon, a light sensitive layer containing a sensitizing dye, which is insoluble in water and soluble in an organic solvent, and particles to which the sensitizing dye is adhered.
4
US2005211119A1
Apparatus and method for thermally developing flexographic printing sleeves
Publication/Patent Number: US2005211119A1 Publication Date: 2005-09-29 Application Number: 10/811,763 Filing Date: 2004-03-29 Inventor: Markhart, Gary   Assignee: Markhart, Gary   IPC: G03F007/26 Abstract: An improved thermal development apparatus is used to remove uncured photopolymer from the imaged surface of a flexographic printing element. The apparatus typically comprises one or more heatable rolls that are contactable with an imaged surface of a flexographic printing element; and means for maintaining contact between the one or more heatable rolls and the imaged surface of the flexographic printing element. The one or more heatable rolls are heated and is moved over at least a portion of the imaged surface of the flexographic printing element, and non-crosslinked polymer on the imaged surface of the flexographic printing element is melted and removed by the one or more heatable rolls.
5
US2005211121A1
Flexo processor
Publication/Patent Number: US2005211121A1 Publication Date: 2005-09-29 Application Number: 11/055,196 Filing Date: 2005-02-10 Inventor: Vest, Ryan   Markhart, Gary   Assignee: Vest, Ryan   Markhart, Gary   IPC: G03F007/26 Abstract: An improved flexo processor and a method of using the improved flexo processor to increase the flexibility of both the type and the size of the flexographic printing element that may be processed. The novel thermal plate processor system is capable of processing both flat and round photosensitive printing elements with only minimal changes to the system. The thermal plate processor system may also include means for exposure and post-exposure/detack in the same system.
6
US2005227180A1
Method for making a printing plate and a plate exposing apparatus
Publication/Patent Number: US2005227180A1 Publication Date: 2005-10-13 Application Number: 11/091,710 Filing Date: 2005-03-29 Inventor: Matsuoka, Hiroshi   Sunagawa, Hiroshi   Katoh, Yoshinori   Kiso, Takeshi   Kimura, Akinori   Miyagawa, Ichirou   Assignee: FUJI PHOTO FILM CO., LTD.   IPC: G03F007/26 Abstract: The method and apparatus make a printing plate such as a lithographic printing plate by exposing an original plate of the printing plate such as a presensitized plate in a substantially oxygen-free state. The method and apparatus deprive substantially of oxygen at least an exposed area of the original plate being exposed to light at least during exposure and expose the original plate to the light at a wavelength of between 250 nm and 420 nm. The original plate has on a support an image recording layer containing a polymerization initiator, a polymerizable compound and a binder polymer, being sensitive to the light at the wavelengths of between 250 nm and 420 nm, having no oxygen barrier layer, and being removable with a printing ink and/or a fountain solution. That is, a latent image is formed by photo-polymerization on the original plate and the original plate is subjected to development on a printing press.
7
US2005037287A1
Method for postbaking a lithographic printing plate
Publication/Patent Number: US2005037287A1 Publication Date: 2005-02-17 Application Number: 10/914,336 Filing Date: 2004-08-09 Inventor: Verschueren, Eric   Van, Damme Marc   Assignee: AGFA-GEVAERT   IPC: G03F007/26 Abstract: A method for making a lithographic printing plate is disclosed wherein the method comprises the steps of: (i) providing a lithographic printing plate precursor comprising a photosensitive coating on a substrate having a hydrophilic surface, (ii) image-wise exposing said photosensitive coating, (iii) developing said exposed coating to form an image on said substrate and optionally gumming the plate and (iv) baking the image on the plate, wherein said baking step is carried out within a dwell-time of less than 1 minute and wherein the chemical resistance of the coating against printing liquids and press chemicals is improved. This baking step is preferably carried out by exposing the printing plate to an infrared radiation source, preferably in a dynamic configuration.
8
US2004161706A1
Flash memory with reduced source resistance and fabrication method thereof
Publication/Patent Number: US2004161706A1 Publication Date: 2004-08-19 Application Number: 10/749,648 Filing Date: 2003-12-30 Inventor: Jung, Sung Mun   Han, Chang Hun   Assignee: Jung, Sung Mun   Han, Chang Hun   IPC: G03F007/26 Abstract: A flash memory device having a reduced source resistance and a fabrication method thereof are disclosed. An example flash memory includes a cell region including a gate, a source line, a drain contact, and a cell trench area for device isolation on a silicon substrate. The example flash memory also includes a peripheral region positioned around the cell region and including a subsidiary circuit and a peripheral trench area for device isolation on the silicon substrate, wherein the cell trench area of the cell region is shallower than the peripheral trench area of the peripheral region.
9
US2004191697A1
Method for processing a niobium type thin film and method for manufacturing a superconducting integrated circuit
Publication/Patent Number: US2004191697A1 Publication Date: 2004-09-30 Application Number: 10/394,026 Filing Date: 2003-03-24 Inventor: Nakatsuka, Hisashi   Terai, Hirotaka   Wang, Zhen   Assignee: Communications Research Laboratory   IPC: G03F007/26 Abstract: The present invention provides a processing method for suppressing variation in the characteristics of a Josephson junction using a niobium type thin film. In the processing method of the present invention, CF4 gas to which CHF3 gas has been added is used as the etching gas in reactive ion etching. As a result, the etching rate is lowered so that high-precision etching control is facilitated. In addition, it is desirable that magnesium oxide is used as mask of this etching, because etching amount of the mask become reduced. In the superconducting integrated circuit manufacturing method of the present invention, the processing method of the present invention is used to process the counter-electrode of a Josephson junction. As a result, variation in the junction area can be reduced; accordingly, variation in the characteristics of the Josephson junction can be reduced.
10
US2004110091A1
High sensitivity X-ray photoresist
Publication/Patent Number: US2004110091A1 Publication Date: 2004-06-10 Application Number: 10/315,356 Filing Date: 2002-12-10 Inventor: Fedynyshyn, Theodore H.   Assignee: MASS INSTITUTE OF TECHNOLOGY (MIT)   IPC: G03F007/26 Abstract: The present invention provides methods for lithography utilizing X-ray radiation. More particularly, the methods of the invention can be employed for lithography at wavelengths in a range between about 0.8 nm and 30 nm, and more particularly, at wavelengths in a range between 0.8 and 1.2 nm. The methods of the invention employ photoresist compositions having fluorinated polymers with a fluorine content of at least about 10% by weight to provide enhanced sensitivity for X-ray lithography.
11
US2004161710A1
Pattern formation method
Publication/Patent Number: US2004161710A1 Publication Date: 2004-08-19 Application Number: 10/735,688 Filing Date: 2003-12-16 Inventor: Endo, Masayuki   Sasago, Masaru   Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.   IPC: G03F007/26 Abstract: A pattern formation method of this invention includes the steps of forming a resist film of a chemically amplified resist material and forming a resist pattern by developing the resist film with an alkaline developer after irradiating, through a mask having a desired pattern, the resist film with exposing light having a light component entering the resist film at the Brewster's angle. A thickness reduction ratio of the resist pattern to the resist film is 5% or less.
12
US2004185386A1
Methods of making an integrated waveguide photodetector
Publication/Patent Number: US2004185386A1 Publication Date: 2004-09-23 Application Number: 10/392,363 Filing Date: 2003-03-17 Inventor: Block, Bruce A.   Assignee: Intel Corporation   IPC: G03F007/26 Abstract: An integrated waveguide and photodetector which are evanescently coupled, and methods of making such integrated waveguide and photodetector.
13
US2004214112A1
Maintaining photoresist planarity at hole edges
Publication/Patent Number: US2004214112A1 Publication Date: 2004-10-28 Application Number: 10/421,188 Filing Date: 2003-04-23 Inventor: Cheng, Su-jen   Jang, Bor-ping   Wang, Chun-chieh   Gau, Jy-jie   Assignee: Taiwan Semicondutor Manufacturing Co.   IPC: G03F007/26 Abstract: Maintaining photoresist thickness and uniformity over a substrate that includes various cavities presents problems, such as preventing distortion of features in the resist image close to cavity edges. These problems have been overcome by laying down the photoresist as two separate layers. The first layer is used to eliminate or reduce problems associated with the presence of the cavities. The second layer is processed in the normal way and does not introduce distortions close to a cavity's edge. A first embodiment introduces some liquid into the cavity before laying down the first layer while the second embodiment etches away part of the first layer before applying the second one. Application of the process to the formation of a cantilever that overhangs a cavity is also described.
14
US2004029051A1
Stripping agent composition and method of stripping
Publication/Patent Number: US2004029051A1 Publication Date: 2004-02-12 Application Number: 10/312,415 Filing Date: 2002-12-26 Inventor: Koita, Tatsuya   Hirano, Keiji   Aoki, Hidemitsu   Tomimori, Hiroaki   Assignee: Koita, Tatsuya   Hirano, Keiji   Aoki, Hidemitsu   Tomimori, Hiroaki   IPC: G03F007/26 Abstract: A stripping composition comprising (a) an anticorrosive agent, (b) a stripping agent and (c) a solvent, wherein the anticorrosive agent (a) is a heterocyclic compound having a nitrogen atom-containing six-membered ring.
15
US2004131974A1
Method of processing light sensitive planographic printing plate precursor
Publication/Patent Number: US2004131974A1 Publication Date: 2004-07-08 Application Number: 10/443,940 Filing Date: 2003-05-22 Inventor: Suzuki, Toshitsugu   Assignee: KONICA CORPORATION   IPC: G03F007/26 Abstract: Disclosed is a method of processing a light sensitive planographic printing plate precursor comprising a support, and provided thereon, a photopolymerizable light sensitive layer and an overcoat layer in that order, the method comprising the steps of imagewise exposing the light sensitive planographic printing plate precursor, pre-washing the exposed light sensitive planographic printing plate precursor with washing water, and developing the pre-washed light sensitive planographic printing plate precursor with a developer containing an alkali metal-containing compound, wherein the pre-washing step comprises first washing the exposed light sensitive planographic printing plate precursor with a first water being water which has been used at least one time for washing the exposed light sensitive planographic printing plate precursor, and then washing the resulting precursor with a second water being fresh water which has not been used before for washing the exposed light sensitive planographic printing plate precursor.
16
US2004157163A1
Method of improving photoresist layer uniformity
Publication/Patent Number: US2004157163A1 Publication Date: 2004-08-12 Application Number: 10/439,371 Filing Date: 2003-05-16 Inventor: Chen, Meng-hung   Wu, Hsin-ling   Wu, Hung-mo   Lee, Chung-yuan   Assignee: Nanya Technology Corporation   IPC: G03F007/26 Abstract: A method for improving photoresist layer uniformity and fabricating a lower electrode of a trench capacitor. First, a substrate having a plurality of trenches is provided. Next, a protective photoresist layer is formed on the substrate to fill the trenches. Parts of the protective photoresist layer are removed to form first openings in trenches. A refill photoresist layer with a planar upper surface is blanketly formed to fill the first openings. The protective photoresist and/or the refill photoresist layer are recessed to leave a plurality of second openings with substantially equal depths in each of the trenches.
17
US2004180297A1
Method for forming pattern in semiconductor device
Publication/Patent Number: US2004180297A1 Publication Date: 2004-09-16 Application Number: 10/798,998 Filing Date: 2004-03-12 Inventor: Yoon, Jooyoung   Chun, Sungoh   Assignee: Yoon, Jooyoung   Chun, Sungoh   IPC: G03F007/26 Abstract: Disclosed is a method for forming a fine pattern of a semiconductor device in which the spacing between neighboring lines is reduced to be less than the resolution limit of a lithographic process. The method includes the steps of: (a) sequentially forming a base layer to be patterned, a lower photoresist layer, a blocking layer and an upper photoresist layer on a substrate; (b) forming the first photoresist pattern on the upper photoresist layer, and etching the blocking layer according to the first photoresist pattern; (c) forming the second photoresist pattern on the lower photoresist layer, which is opened by the spacing of the first photoresist pattern, wherein the spacing of the first photoresist pattern is greater than a line width of the second photoresist pattern; (d) etching the base layer using the second photoresist pattern as a mask; and (e) stripping the remaining photoresist layer.
18
US2004180299A1
Immersion lithography methods using carbon dioxide
Publication/Patent Number: US2004180299A1 Publication Date: 2004-09-16 Application Number: 10/386,356 Filing Date: 2003-03-11 Inventor: Rolland, Jason P.   Desimone, Joseph M.   Assignee: Rolland, Jason P.   Desimone, Joseph M.   IPC: G03F007/26 Abstract: A substrate is patterned by performing immersion lithography on a photoresist layer on the substrate using carbon dioxide. The immersion layer may be provided and/or removed and/or the photoresist layer may be developed, dried and/or removed using carbon dioxide. The immersion layer can include liquid and/or solid immersion layers. The need for organic solvents in immersion lithography can thereby be reduced or eliminated.
19
US2004175658A1
Embossing tool having an arbitrary three-dimensional microstructure
Publication/Patent Number: US2004175658A1 Publication Date: 2004-09-09 Application Number: 10/804,798 Filing Date: 2004-03-19 Inventor: Morales, Alfredo M.   Gonzales, Marcela   Assignee: Morales, Alfredo M.   Gonzales, Marcela   IPC: G03F007/26 Abstract: The present invention describes a method for fabricating an embossing tool or an x-ray mask tool, providing microstructures that smoothly vary in height from point-to-point in etched substrates, i.e., structure which can vary in all three dimensions. The process uses a lithographic technique to transfer an image pattern in the surface of a silicon wafer by exposing and developing the resist and then etching the silicon substrate. Importantly, the photoresist is variably exposed so that when developed some of the resist layer remains. The remaining undeveloped resist acts as an etchant barrier to the reactive plasma used to etch the silicon substrate and therefore provides the ability etch structures of variable depths.
20
US2004209194A1
Ultraviolet-light radiating apparatus, wet etching apparatus and wet etching method using ultravioletlight, and method of manufacturing semiconductor device
Publication/Patent Number: US2004209194A1 Publication Date: 2004-10-21 Application Number: 10/797,577 Filing Date: 2004-03-11 Inventor: Kume, Satoshi   Hishinuma, Nobuyuki   Sugahara, Hiroshi   Assignee: Kume, Satoshi   Hishinuma, Nobuyuki   Sugahara, Hiroshi   IPC: G03F007/26 Abstract: A substrate supporting film to be etched is held on a rotating stage. Ultraviolet light having a wavelength of 200 nm or shorter radiated from first lamps irradiates the film in air, thereby removing organic coatings from the film and making the surface of the film hydrophilic. A chemical solution applied to the hydrophilic film while rotating the substrate. Ultraviolet light having a wavelength longer than 200 nm is radiated from second lamps and onto the film through the chemical solution.
Total 11 pages