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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
CN109686813B
一种光电耦合器及其制备方法
Grant
Publication/Patent Number: CN109686813B Publication Date: 2021-02-12 Application Number: 201910120225.3 Filing Date: 2019-02-18 Inventor: 梁志清   赵嘉学   罗宗海   石锦涛   张铭   徐灿明   郭泽宇   刘子骥   Assignee: 电子科技大学   IPC: H01L31/12 Abstract: 一种光电耦合器及其制备方法,属于光电子器件技术领域。光电耦合器包括光发射单元和光接收单元以及后级处理电路;所述光接收单元是以微纳米孔结构的PIN结为基本单元,所述微纳米孔结构的孔道自n型层始贯穿本征层并延伸至p型层表面,微纳米孔结构周期性排列形成光电检测阵列;所述光接收单元设置在CMOS集成电路的上方实现单片集成。本发明显著降低光接收单元的响应时间,将光电耦合器整体的响应速度从ns量级提高到ps量级。微纳米孔阵列有利于将吸收光谱拓展至更高的波长,提高了光吸收效率。此外,本发明提供的制造工艺与集成电路制造工艺兼容,相比现有光敏芯片,减小体积的同时显著改善器件性能,提高了成品率和器件可靠性,也降低了生产成本。
2
CN112289884A
一种激光冗余的光电集成电路
Public
Publication/Patent Number: CN112289884A Publication Date: 2021-01-29 Application Number: 202011254632.2 Filing Date: 2020-11-11 Inventor: 冯大增   王奕琼   梁虹   武爱民   Assignee: 中国科学院上海微系统与信息技术研究所   IPC: H01L31/12 Abstract: 本发明涉及半导体技术领域,本发明公开了一种激光冗余的光电集成电路。该光电集成电路包括激光器和多模干涉器,激光器的数量为N个,N为大于等于2的整数;多模干涉器包括输入端和至少两个输出端,输入端的数量为M个,M为大于等于N的整数;N个激光器与该M个输入端中的N个输入端一一对应波导连接;多模干涉器用于当N个激光器中存在L个激光器故障时,将剩余N‑L个非故障的激光器确定为目标激光器,并利用目标激光器对应的N‑L个输入端接收该目标激光器产生的光,并将接收到的该光均等分配到该至少两个输出端,L为小于N的自然数。从而使得本发明提供的光电集成电路具有可靠性高和成本低的优点。
3
CN112259634A
光学装置及其制造方法
Public
Publication/Patent Number: CN112259634A Publication Date: 2021-01-22 Application Number: 202010625596.X Filing Date: 2020-07-02 Inventor: 陈仁君   Assignee: 日月光半导体制造股份有限公司   IPC: H01L31/12 Abstract: 本发明提供一种光学装置,其包含衬底、光接收组件、封装物、耦合层及光屏蔽层。所述光接收组件安置于所述衬底上。所述封装物覆盖所述光接收组件。所述耦合层安置于所述封装物的至少一部分上。所述光屏蔽层安置于所述耦合层上。
4
CN109904276B
一种GaN基垂直集成光电子芯片及其制备方法
Grant
Publication/Patent Number: CN109904276B Publication Date: 2021-01-26 Application Number: 201910097597.9 Filing Date: 2019-01-31 Inventor: 黎大兵   程东碧   孙晓娟   贾玉萍   石芝铭   Assignee: 中国科学院长春光学精密机械与物理研究所   IPC: H01L31/12 Abstract: 本发明涉及一种GaN基垂直集成光电子芯片及其制备方法,解决现有GaN集成光电子集成密度不能进一步提高和水平结构结构相同,性能不能达到最优的技术问题。本发明的GaN基垂直集成光电子芯片能实现LED和PD之间的光通讯,在两块蓝宝石上分别生长外延层,并在外延层上生长设计好的探测器和发光二极管的结构,然后将蓝宝石减薄,将两块蓝宝石没有生长器件的一面通过Bonding键合在一起,可以用于垂直方向建立光通讯,进一步提高GaN基材料光通信的集成密度。这种结构通过分别单独设计探测器PD和发光二极管LED,可实现垂直结构器件之间的信息传输。本发明工艺简单,成本低廉,具有广阔的应用前景。
5
US2021005771A1
LIGHT SENSOR CIRCUIT, LIGHT SENSOR DEVICE, AND DISPLAY DEVICE
Publication/Patent Number: US2021005771A1 Publication Date: 2021-01-07 Application Number: 17/024,725 Filing Date: 2020-09-18 Inventor: Tsubuku, Masashi   Tsunashima, Takanori   Mochizuki, Marina   Assignee: Japan Display Inc.   IPC: H01L31/12 Abstract: The problem of the present disclosure is to provide a photo sensor circuit that uses oxide semiconductor transistors and the operation of which is stable. The photo sensor circuit includes: a photo transistor; a first switching transistor; a second switching transistor; and a capacitance element. The photo transistor includes: a gate connected to a first wiring; a source connected to a second wiring; and a drain. The first switching transistor includes: a gate connected to a third wiring; a source connected to a fourth wiring; and a drain connected to the drain of the photo transistor. The capacitance element includes: a first terminal connected to the drain of the photo transistor; and a second terminal connected to the source of the first switching transistor. The second switching transistor includes: a gate connected to a gate line; a source connected to a signal line; and a drain connected to the first terminal of the capacitance element. Each of the photo transistor, the first switching transistor, and the second transistor includes an oxide semiconductor layer as a channel layer.
6
US10884197B2
Optical receptacle, optical module, and method for manufacturing optical module
Publication/Patent Number: US10884197B2 Publication Date: 2021-01-05 Application Number: 16/467,503 Filing Date: 2017-11-06 Inventor: Sukegawa, Takayuki   Assignee: ENPLAS CORPORATION   IPC: G02B6/42 Abstract: This optical receptacle has an optical receptacle main body, a supporting member, and an adhesive. The optical receptacle main body includes a first optical surface, second optical surface, reflecting surface, first fit-in section, and recessed section. The supporting member includes: a supporting member main body; a second fit-in section fitted in the first fit-in section; and a through hole, which faces the recessed section, and which is opened in the inner-side surface of the supporting member main body, and in the outer-side surface on the reverse side of the inner-side surface. The adhesive is in contact with the inner surface of the recessed section, and the supporting member. The optical receptacle main body is disposed further toward the supporting member side than an installation surface.
7
US2021005769A1
PHOTOELECTRIC DETECTOR, PREPARATION METHOD THEREOF, DISPLAY PANEL AND DISPLAY DEVICE
Publication/Patent Number: US2021005769A1 Publication Date: 2021-01-07 Application Number: 16/909,526 Filing Date: 2020-06-23 Inventor: Li, Chao   Du, Jianhua   Guan, Feng   Gao, Yupeng   Qiang, Zhaohui   Wang, Zhi   Lyu, Yang   Luo, Chao   Assignee: BOE Technology Group Co., Ltd.   IPC: H01L31/105 Abstract: The present disclosure discloses a photoelectric detector, a preparation method thereof, a display panel and a display device. The photoelectric detector includes a base, and a thin film transistor (TFT) and a photosensitive PIN device on the base, wherein the PIN device includes an I-type region that does not overlap with an orthographic projection of the TFT on the base; a first etching barrier layer covering a top surface of the I-type region; a first heavily doped region in contact with a side surface on a side, proximate to the TFT, of the I-type region; and a second heavily doped region in contact with a side surface on a side, away from the TFT, of the I-type region, the doping types of the first heavily doped region and the second heavily doped region being different from each other.
8
US2021050922A1
METHOD OF BONDING OPTICAL COMPONENTS OF OPTICAL TRANSCEIVER
Publication/Patent Number: US2021050922A1 Publication Date: 2021-02-18 Application Number: 16/540,751 Filing Date: 2019-08-14 Inventor: Cheng, Chin-lung   Tung, Chien Yin   Assignee: Prime World International Holdings Ltd.   IPC: H04B10/40 Abstract: A method of bonding optical components of an optical transceiver is disclosed. An electro-optical assembly is provided. The electro-optical assembly includes a substrate and two first optical components bonded with the substrate. A reference pair of coordinates is obtained according to a geometric factor related to the first optical components. At least one second optical component is bonded with the substrate according to the reference pair of coordinates.
9
US10923605B2
Optoelectronic apparatus
Publication/Patent Number: US10923605B2 Publication Date: 2021-02-16 Application Number: 16/078,507 Filing Date: 2017-02-22 Inventor: Burger, Daniel   Kuhn, Sascha   Mühleck, Peter   Assignee: Vishay Semiconductor GmbH   IPC: H01L31/02 Abstract: An optoelectronic apparatus is provided, comprising a carrier device that has a longitudinal extent and a transverse extent, wherein the carrier device has a plurality of electrically conductive tracks aligned in parallel with the longitudinal extent, and wherein the carrier device has a plurality of contact chambers aligned in parallel with the transverse extent at an upper side. Each of the contact tracks is electrically contactable in each contact chamber to be able to install at least one optoelectronic transmitter and/or at least one optoelectronic receiver in a variable mounting in the respective chamber.
10
US2021005770A1
LIGHTING DEVICE
Publication/Patent Number: US2021005770A1 Publication Date: 2021-01-07 Application Number: 16/794,518 Filing Date: 2020-02-19 Inventor: Xu, Biao   Zhang, Lin   Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.   BOE TECHNOLOGY GROUP CO., LTD.   IPC: H01L31/12 Abstract: This disclosure provides a lighting device, which relates to a field of display technologies. The lighting device of the present disclosure includes: a light emitting panel emitting a predetermined color light; and a solar cell panel disposed on a light-emitting side of the light emitting panel and including an active layer. The active layer has no absorption within a wavelength range of the predetermined color light. The lighting device can ensure to be self-powered under normal light emission when the solar cell panel is disposed on the light-emitting side of the light emitting panel.
11
EP3759742A1
MULTI-SPECTRAL LIGHT SENSOR
Publication/Patent Number: EP3759742A1 Publication Date: 2021-01-06 Application Number: 19775519.2 Filing Date: 2019-03-29 Inventor: Tsang, Koon-wing   Lin, Yuh-min   Assignee: Vishay Intertechnology Inc.   IPC: H01L31/00
12
CN112216599A
多次光固化一次蚀刻形成光学挡墙的方法及光学挡墙结构
Substantial Examination
Publication/Patent Number: CN112216599A Publication Date: 2021-01-12 Application Number: 201910547353.6 Filing Date: 2019-06-24 Inventor: 李蕙如   Assignee: 培英半导体有限公司   IPC: H01L21/027 Abstract: 本发明提供一种光学挡墙结构,其包括一基板、一第一挡墙层及一第二挡墙层,基板具有一工作面,第一挡墙层形成于工作面上,且第一挡墙层围构一裸露工作面的第一开窗;第二挡墙层形成于第一挡墙层上,且第二挡墙层围构一第二开窗,第二挡墙层的横截面积小于第一挡墙层,且第二开窗的轮廓大于第一开窗。本发明还提供前述光学挡墙结构的制作方法,是通过分别对第一、第二挡墙膜局部光固化后,再一次蚀刻的方式形成。
13
US2021050471A1
SENSING DEVICE
Publication/Patent Number: US2021050471A1 Publication Date: 2021-02-18 Application Number: 16/991,697 Filing Date: 2020-08-12 Inventor: Chen, Hung-jui   Lin, Po-jui   Assignee: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.   LITE-ON TECHNOLOGY CORPORATION   IPC: H01L31/12 Abstract: A sensing device includes a substrate, two chips, and a shielding structure. The two chips are respectively defined as an emitting chip and a receiving chip. The emitting chip can emit a sensing light beam, the receiving chip can receive the sensing light beam, and the two chips are fixed in position on the substrate at intervals. At least one of the chips is electrically connected to the substrate through at least one wire, and a position where the wire is connected to the substrate is located between the two chips. The shielding structure is formed on the substrate. The shielding structure is located between the two chips, and the shielding structure covers the wire and a portion of the chip connected to the wire. Compared with the conventional photo-plethysmography sensor, the sensing device has the advantage of a smaller size.
14
CN112310062A
封装结构及电子设备
Public
Publication/Patent Number: CN112310062A Publication Date: 2021-02-02 Application Number: 202011192715.3 Filing Date: 2020-10-30 Inventor: 杨望来   杨彩红   Assignee: 维沃移动通信有限公司   IPC: H01L25/16 Abstract: 本申请公开了一种封装结构及电子设备,属于封装技术领域。该封装结构包括基板以及设置于所述基板的同一侧的发光元件、感光元件、透光封装体和反射件,所述透光封装体包裹所述发光元件、所述感光元件和所述反射件;所述发光元件位于所述反射件和所述感光元件之间,所述发光元件背离所述感光元件的一侧具有出光面,所述反射件具有朝向所述发光元件的反射面,所述发光元件发出的光经所述反射面反射至所述封装结构之外,所述感光元件接收自所述封装结构之外反射回的光。该方案可以解决目前封装结构尺寸过大的问题。
15
US10912768B2
Compounds and methods for treating influenza
Publication/Patent Number: US10912768B2 Publication Date: 2021-02-09 Application Number: 16/448,267 Filing Date: 2019-06-21 Inventor: Rossignol, Jean-francois   Semple, J. Edward   Assignee: Romark Laboratories L.C.   IPC: A61K31/426 Abstract: This invention is directed to methods for treating and preventing influenza infection by inhibiting influenza virus HA maturation processes employing compounds of formula I. It is also directed to combinations for treating and preventing influenza infection comprising compounds of formula I and other agents.
16
US2021013358A1
DUAL WAVELENGTH LIGHT EMITTING DEVICE, DUAL WAVELENGTH LIGHT TRANSCEIVING DEVICE AND DISPLAY
Publication/Patent Number: US2021013358A1 Publication Date: 2021-01-14 Application Number: 16/509,466 Filing Date: 2019-07-11 Inventor: Lai, Hung-ching   Assignee: PixArt Imaging Inc.   IPC: H01L31/12 Abstract: The present invention discloses a dual wavelength light emitting device comprising: a first light emitting device, configured to emit first kind of light; and a second light emitting device, configured to emit second kind of light. The first light emitting device is stacked above the second light emitting device, or stacked below the second light emitting device. The present invention also discloses a dual wavelength light transceiving device which can transmit light and receive light by the same layer. Comparing with a conventional micro LED, the area occupied by the dual wavelength light emitting device or the dual wavelength light transceiving device can be reduced.
17
US10923645B2
Light source device having package including first electrode and second electrode and substrate including wiring members facing first electrode and second electrode
Publication/Patent Number: US10923645B2 Publication Date: 2021-02-16 Application Number: 16/710,309 Filing Date: 2019-12-11 Inventor: Aki, Takeshi   Wakaki, Ryosuke   Assignee: NICHIA CORPORATION   IPC: H01L27/15 Abstract: A light source device includes a package and a substrate. The package includes first and second electrodes. The first electrode has first and second parts separated from each other by a first separation region on a lower surface side of the first electrode while the first part is continuous with the second part on an upper surface side. The substrate includes a pair of wiring members. Lower surfaces of the first and second parts face and are mounted on an upper surface of one of the wiring members. A lower surface of the second electrode faces and is mounted on an upper surface of the other of the wiring members. A region of the substrate facing the first separation region has solder wettability lower than solder wettability of the upper surface of the one of the wiring members facing the first part and the second part of the first electrode.
18
US2021043780A1
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
Publication/Patent Number: US2021043780A1 Publication Date: 2021-02-11 Application Number: 17/081,299 Filing Date: 2020-10-27 Inventor: Saxod, Karine   Mas, Alexandre   Saugier, Eric   Lobascio, Gaetan   Besancon, Benoit   Assignee: STMicroelectronics (Grenoble 2) SAS   IPC: H01L31/0203 Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
19
CN108140688B
半导体结构
Grant
Publication/Patent Number: CN108140688B Publication Date: 2021-01-29 Application Number: 201680056298.5 Filing Date: 2016-09-27 Inventor: 朱振甫   Assignee: 曜晟光电有限公司   IPC: H01L31/12 Abstract: 本发明揭露了一种适用于处理光信号的半导体结构(100),半导体结构(100)包括:一第一类型半导体层(101);一第二类型半导体层(102);一主动层(103)(active layer),位于第一类型半导体层(101)和第二类型半导体层(102)之间;一反射层(R)(reflector),覆盖第一类型半导体层(101)和第二类型半导体层(102)的表面;一第一焊盘(101a),设置在覆盖第一类型半导体层(101)的反射层(R)的顶部表面上;第二焊盘(101b),设置在覆盖反射层(R)的顶部表面上或第二类型半导体层(102)上;一孔洞(P)(aperture),设置在第一类型半导体层(101)的顶部表面并穿过反射层(R);以及一光收集模块(C),设置环绕孔洞(P)或覆盖反射层(R)的顶部表面。
20
CN112310244A
一种单颗对管的制造方法及应用键盘
Public
Publication/Patent Number: CN112310244A Publication Date: 2021-02-02 Application Number: 202011176469.2 Filing Date: 2020-10-28 Inventor: 刘雪蓉   刘杯   鲁洪奎   刘创业   Assignee: 深圳市柯瑞光电科技有限公司   IPC: H01L31/18 Abstract: 本发明属于键盘技术领域,尤其涉及一种单颗对管的制造方法及应用键盘,该方法包括:固晶,将芯片通过固晶胶固定在支架的固晶区;焊线,将步骤S1中所述发射芯片和所述接收芯片的电极分别通过金线与自身腔体中的焊盘区连接在一起;点胶,将胶水分别点入两个凹型的腔体中,并且用于固定所述发射芯片的腔体采用透明的环氧树脂,用于固定所述接收芯片的腔体采用黑色的环氧树脂;分光分色,将成品按照发光强度、发光颜色、成品特性给予分组并进行编带封装,其中支架上并列开设两个凹型腔体,先通过固晶工艺分别在两个凹型腔体内固定发射芯片和接收芯片,将其应用到键盘的按键上,能够大大降低制造键盘消耗的材料,并提升生产效率。
Total 500 pages