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1
CN109980073B
一种封装薄膜及其制备方法、光电器件
Grant
Publication/Patent Number: CN109980073B Publication Date: 2021-02-19 Application Number: 201711450473.1 Filing Date: 2017-12-27 Inventor: 朱佩   曹蔚然   Assignee: TCL科技集团股份有限公司   IPC: H01L33/56 Abstract: 本发明公开一种封装薄膜及其制备方法、光电器件,其中,所述封装薄膜包括层叠设置的由化学式为XN的氮化物组成的第一陶瓷膜以及由化学式为YO的金属氧化物组成的第二陶瓷膜,在所述第一陶瓷膜与第二陶瓷膜之间的界面处有化学式为XYO的复合氧化物,其中1≦a≦3,1≦b≦3,2≦c≦6,1≦d≦4,1≦e≦4。在制备第一陶瓷膜的过程中通入还原性气氛,以及在所述第一陶瓷膜表面覆盖一层由金属氧化物组成的第二陶瓷膜,使得第一陶瓷膜内部和表面的氧杂质有效减少,这使得封装薄膜同时具备有良好的阻隔水氧作用以及导热性。
2
US2021013376A1
LIGHT EMITTING DEVICE PACKAGE
Publication/Patent Number: US2021013376A1 Publication Date: 2021-01-14 Application Number: 16/646,884 Filing Date: 2018-09-12 Inventor: Kim, Ki Seok   Kim, Won Jung   Song, June O   Lim, Chang Man   Assignee: LG INNOTEK CO., LTD.   IPC: H01L33/48 Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.
3
EP3771731A1
A CURABLE HOTMELT SILICONE COMPOSITION, ENCAPSULANT, FILM AND OPTICAL SEMICONDUCTOR DEVICE
Publication/Patent Number: EP3771731A1 Publication Date: 2021-02-03 Application Number: 20186820.5 Filing Date: 2020-07-20 Inventor: Takeuchi, Shunya   Inagaki, Sawako   Hayashi, Akito   Kobayashi, Akihiko   Assignee: DuPont Toray Specialty Materials Kabushiki Kaisha   IPC: C08L83/04 Abstract: [Problem] The provision of a curable hot-melt silicone composition that can exhibit excellent mechanical properties, particularly strength and extension, even when formed in a film or sheet shape. [Solution] The abovementioned problem is solved by a solvent-free curable hot-melt silicone composition that contains (A) alkenyl group-containing organopolysiloxane having at least 2 alkenyl groups per molecule, (B) branched organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule, at 0.1 to 5% by mass relative to the total mass of the composition, (C) additive represented by average unit formula (C-1), (D) hydrosilylation catalyst, and (E) silica.
4
US2021028336A1
DISPLAY DEVICE, METHOD FOR MANUFACTURING DISPLAY DEVICE, AND DEVICE FOR MANUFACTURING DISPLAY DEVICE
Publication/Patent Number: US2021028336A1 Publication Date: 2021-01-28 Application Number: 16/981,463 Filing Date: 2018-03-16 Inventor: Saitoh, Takao   Sun, Yi   Kanzaki, Yohsuke   Yamanaka, Masaki   Miwa, Masahiko   Kaneko, Seiji   Assignee: SHARP KABUSHIKI KAISHA   IPC: H01L33/56 Abstract: A display device includes: an underlayer, a first insulating film contacting an upper face of the underlayer, a semiconductor layer, a second insulating film, a first metal layer, a first resin layer, a first electrode, and a second resin layer, in order from a lower layer, wherein at least one of the underlayer, the first resin layer, and the second resin layer is a thin film layer having a maximum film thickness in a display region provided with a light-emitting element being thicker than a maximum film thickness in a frame region surrounding the display region.
5
US10903403B2
LED array package
Publication/Patent Number: US10903403B2 Publication Date: 2021-01-26 Application Number: 16/267,958 Filing Date: 2019-02-05 Inventor: Odnoblyudov, Vladimir   West, Scott   Basceri, Cem   Gan, Zhengqing   Assignee: BRIDGELUX, INC.   IPC: H01L33/56 Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
6
US2021043806A1
RADIATION-EMITTING SEMICONDUCTOR CHIP AND A METHOD FOR PRODUCING A RADIATION-EMITTING SEMICONDUCTOR CHIP
Publication/Patent Number: US2021043806A1 Publication Date: 2021-02-11 Application Number: 16/964,219 Filing Date: 2019-01-15 Inventor: Perzlmaier, Korbinian   Illek, Stefan   Assignee: OSRAM OLED GmbH   IPC: H01L33/46 Abstract: A radiation-emitting semiconductor chip may include a semiconductor body, a reflector, at least one cavity, and a seal. The semiconductor body may include an active region configured to generate electronic radiation. The reflector may be configured to reflect a portion of the electromagnetic radiation. The cavity may be filled with a material having a refractive index not exceeding 1.1. The seal may be impermeable to the material. The cavity may be arranged between the reflector and the semiconductor body, and the seal may cover the underside of the reflector.
7
US2021043813A1
Optoelectronic Component and Method for Producing an Optoelectronic Component
Publication/Patent Number: US2021043813A1 Publication Date: 2021-02-11 Application Number: 16/964,937 Filing Date: 2019-01-18 Inventor: Reeswinkel, Thomas   Schmidtke, Kathy   Assignee: OSRAM OLED GmbH   IPC: H01L33/56 Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one optoelectronic semiconductor chip configured to emit radiation and an encapsulation around the semiconductor chip. The encapsulation is a polysiloxane. A barrier layer can be used for protection against harmful gases, the barrier layer being arranged on the encapsulation. The barrier layer is a plasma-polymerized siloxane layer.
8
CN112331754A
光扩散剂及其制备方法、光扩散剂的应用
Public
Publication/Patent Number: CN112331754A Publication Date: 2021-02-05 Application Number: 202011247981.1 Filing Date: 2020-11-10 Inventor: 陈飞   王新星   李文峰   王磊   Assignee: 深圳市中科创激光技术有限公司   IPC: H01L33/46 Abstract: 本申请属于LED技术领域,尤其涉及一种光扩散剂及其制备方法,以及一种光扩散剂的应用。其中,光扩散剂包括重量份的原料组分:扩散粉体1~10份,透明胶水5~50份,所述扩散粉体和所述透明胶水的重量比为1:(2~10)。本申请光扩散剂对LED屏幕灯珠的出光起到均化作用,降低LED屏幕显示时的颗粒感,防止LED灯珠间发生光串扰,确保屏幕像素对比度和显示的图像的质量,提升用户的视觉感受。
9
US2021005794A1
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING DISPLAY PANEL USING THE SAME
Publication/Patent Number: US2021005794A1 Publication Date: 2021-01-07 Application Number: 16/716,752 Filing Date: 2019-12-17 Inventor: Sakong, Tan   Kim, Juhyun   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: H01L33/56 Abstract: A method of manufacturing a light emitting device package and a method of manufacturing a display panel, the method of manufacturing a light emitting device package including forming a semiconductor laminate on a substrate such that the semiconductor laminate has a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; separating the semiconductor laminate into semiconductor light emitters, separated from each other, by forming a trench having a predetermined depth in the substrate by etching through the semiconductor laminate in a direction of the first surface of the substrate; forming a molding that fills the trench and insulates the semiconductor light emitters from each other by applying a flexible insulating material to cover the semiconductor light emitters; forming grooves separated from each other by the molding and overlying to the semiconductor light emitters, respectively, by removing the substrate; and forming wavelength converters in the grooves.
10
US10886426B2
Method for producing an electronic device and electronic device
Publication/Patent Number: US10886426B2 Publication Date: 2021-01-05 Application Number: 16/087,646 Filing Date: 2017-03-22 Inventor: Dirscherl, Georg   Herrmann, Siegfried   Assignee: OSRAM OLED GMBH   IPC: H01L33/00 Abstract: A method for producing an electronic device and an electronic device are disclosed. In an embodiment a method for producing an electronic device includes attaching semiconductor chips on a carrier, applying a fluoropolymer to main surfaces of the semiconductor chips facing away from the carrier and a main surface of the carrier facing the semiconductor chip thereby forming an encapsulation layer including a fluoropolymer, structuring the encapsulation layer thereby forming cavities in the encapsulation layer and applying a metal layer in the cavities.
11
CN212461719U
一种直插式红外发射管
Grant
Publication/Patent Number: CN212461719U Publication Date: 2021-02-02 Application Number: 202021707382.9 Filing Date: 2020-08-14 Inventor: 邱添祥   高美法   Assignee: 厦门市迅光电子有限公司   IPC: H01L33/48 Abstract: 本申请涉及一种直插式红外发射管,其包括金属支架,所述金属支架上设置有发射碗,所述发射碗底部设置有发光芯片,所述发射碗内填充有硅胶,所述金属支架和发射碗外部封装有环氧树脂。本申请具有提高发射管使用寿命的效果。
12
CN112289916A
一种LED灯丝的封装方法
Public
Publication/Patent Number: CN112289916A Publication Date: 2021-01-29 Application Number: 202011322381.7 Filing Date: 2020-11-23 Inventor: 严钱军   郑昭章   马玲莉   Assignee: 杭州杭科光电集团股份有限公司   IPC: H01L33/64 Abstract: 本发明公开了一种LED灯丝的封装方法,包括如下步骤:获取基板,于所述基板正面点涂多个固晶胶,形成单个或多个固晶胶阵列;在每一固晶胶阵点上放置LED芯片,并加热所述固晶胶阵列;连接相邻LED芯片输入和输出端,使得每一LED芯片导通;在所述固晶胶阵列和基板背面涂覆混合荧光粉的胶水,干燥后形成覆盖于所述固晶阵列和基板背面的荧光胶层;在所述基板正面和背面的荧光胶层表面分别涂覆石墨烯胶,干燥后形成石墨烯胶层,所述封装方法将通过在荧光胶层外部和基板底部涂覆石墨烯胶水形成石墨烯胶层,所述石墨烯胶层为单色胶层,从而可以提高灯丝的导热性,并且得到想要的灯丝外观颜色,对外形成稳定美观的灯丝。
13
US2021035960A1
LIGHT-EMITTING DEVICE ARRAY WITH INDIVIDUAL CELLS
Publication/Patent Number: US2021035960A1 Publication Date: 2021-02-04 Application Number: 16/997,691 Filing Date: 2020-08-19 Inventor: Helbing, Rene Peter   Xu, Tao   Assignee: BRIDGELUX, INC.   IPC: H01L25/075 Abstract: A light-emitting device and a method for manufacturing the light-emitting device is disclosed. Such a light-emitting device comprises a substrate, a plurality of cells disposed on the substrate, and a plurality of semiconductor dice, wherein each of the plurality of cells accommodates at least one of the plurality of dice. Each of the plurality of cells may be filled with an encapsulant, phosphor or a mixture of an encapsulant with phosphor to control light characteristics of the light-emitting device. In an alternative aspect, cells may be filled with an encapsulant, and comprise a transparent cover coated with or filled with phosphors to control light characteristics of the light-emitting device.
14
CN109054732B
一种粘结性能优异的LED封装硅胶及其制备方法
Grant Assignment
Publication/Patent Number: CN109054732B Publication Date: 2021-02-09 Application Number: 201811086890.7 Filing Date: 2018-09-18 Inventor: 王亚婷   陈维   Assignee: 烟台德邦科技股份有限公司   IPC: C09J183/07 Abstract: 本发明涉及一种粘结性能优异的LED封装硅胶及其制备方法,包括A组分和B组分,二者的质量比为(1~5):1;其中,按重量份数计,A组分包括:甲基乙烯基MDT硅树脂45~55份、甲基乙烯基硅油25~45份、铂催化剂0.1~0.5份、增粘剂2~6份;B组分包括:甲基乙烯基MDT硅树脂45~55份、甲基乙烯基硅油26~50份、交联剂1~5份、抑制剂0.2~0.4份;所述增粘剂的具体结构如结构式一或结构式二所示。本发明的封装硅胶采用特定结构的增粘剂,该增粘剂的加入大大提高了硅胶对基材的附着力,甲基乙烯基硅油的加入提供了可以参与反应的乙烯基,并降低了体系的粘度,提高了体系的韧性。
15
CN110197865B
一种液体封装的深紫外LED封装器件及其制备方法
Grant
Publication/Patent Number: CN110197865B Publication Date: 2021-02-12 Application Number: 201910397729.X Filing Date: 2019-05-14 Inventor: 葛鹏   梁仁瓅   邓玉仓   Assignee: 湖北深紫科技有限公司   IPC: H01L33/48 Abstract: 本发明提供了一种液体封装的深紫外LED封装器件及制备方法,所述深紫外LED封器件包括基板、支架、深紫外LED芯片、透镜、以及硅油;所述支架位于所述基板上,所述支架的底部设有所述深紫外LED芯片,所述透镜位于所述支架上,且所述支架与所述透镜围合成一密闭空间,所述深紫外LED芯片位于所述密闭空间内且所述密闭空间内填充有硅油;本发明提供的液体封装的深紫外LED封器件,可以提高芯片光提取效率,且硅油材料本身在深紫外LED波段具有折射率匹配,透过率高,可靠性良好的性能。制作工艺流程简单,使用方便,适用于规模生产,在深紫外LED灯珠的封装中具有非常广阔的应用前景。
16
CN112382716A
一种LED发光装置及其制造方法
Public
Publication/Patent Number: CN112382716A Publication Date: 2021-02-19 Application Number: 202011169442.0 Filing Date: 2020-10-28 Inventor: 江宾   林素慧   曾炜竣   彭康伟   曾明俊   何安和   刘小亮   Assignee: 厦门三安光电有限公司   IPC: H01L33/56 Abstract: 本发明提供一种LED发光装置及其制造方法,该LED发光装置包括基板,所述基板具有相对设置的第一表面和第二表面,所述第一表面上设置有导电线路层;LED芯片,所述LED芯片通过所述导电线路层固定在所述基板的第一表面上;无机密封层,所述无机密封层覆盖所述LED芯片的表面、侧壁以及所述基板的第一表面。上述无机密封层可以是SiO和/或HfO等一层或多层氧化物层。该无机密封层对UV或者UVC具有较高的透过率,并且即使长时间在UV或者UVC的照射下,也不会出现老化或龟裂等问题。本发明在LED芯片的表面、侧壁以及基板的第一表面上同时形成上述无机密封层,能够同时有效保护LED芯片及基板。
17
CN212571029U
一种紫外LED封装结构
Grant
Publication/Patent Number: CN212571029U Publication Date: 2021-02-19 Application Number: 202021376565.7 Filing Date: 2020-07-14 Inventor: 颜才满   丁鑫锐   余树东   李家声   梁观伟   钱瑞祥   Assignee: 华南理工大学   IPC: H01L33/48 Abstract: 本实用新型属于半导体封装技术领域,公开一种紫外LED封装结构,包括:LED支架、紫外LED芯片、粘合层和无机玻璃,通过粘合层将LED支架与无机玻璃相连接实现密封功能。其中:粘合层包括:有机粘合剂模块、紫外吸光剂模块和干燥剂模块,有机粘合剂模块将LED支架与无机玻璃相连接,紫外吸光剂模块用于阻隔紫外LED芯片发出的紫外光线对有机粘合剂的老化衰退影响,干燥剂模块用于阻隔外部空气环境的水汽成分,保护紫外LED芯片不受其影响。本实用新型解决了紫外LED封装结构中有机粘合剂易受紫外光照射的老化问题和紫外LED芯片易受空气水汽干扰的失效问题,有效提高了紫外LED的稳定性。
18
CN212412078U
一种发光二极管
Grant
Publication/Patent Number: CN212412078U Publication Date: 2021-01-26 Application Number: 202021558145.0 Filing Date: 2020-07-30 Inventor: 罗云   Assignee: 罗云   IPC: H01L33/48 Abstract: 本实用新型公开了一种发光二极管,包括封装胶体、芯片和一根以上的引脚,所述封装胶体一分为三,分别为外保护套、底座和中心块,芯片注塑安装于中心块内部,外保护套的底面上设有一安装槽,中心块插入安装槽中,底座的表面上设有一装配槽,装配槽的底面上设有一个以上的定位槽,定位槽的底面上均设有一通孔,引脚一端均穿过通孔延伸至定位槽中,并均向外扩大形成一定位部,外保护套和中心块下端均插入装配槽中。本实用新型结构简单,将发光二极管分成独立的多个部件,只要更换损坏的部件就可,且引脚与芯片之间通过底座与外保护套的压合固定,两者之间不固定,造成更换较为便捷,同时外保护套和底座之间的安装牢固,拆卸方便。
19
CN112234134A
一种无荧光粉多基色LED封装结构及其封装方法
Substantial Examination
Publication/Patent Number: CN112234134A Publication Date: 2021-01-15 Application Number: 202011050672.5 Filing Date: 2020-09-29 Inventor: 郭醒   朱昕   罗昕   徐龙权   王光绪   张建立   江风益   Assignee: 南昌大学   南昌硅基半导体科技有限公司   IPC: H01L33/56 Abstract: 本发明公开了一种无荧光粉多基色LED封装结构及其封装方法,该封装结构包括封装基板、若干颗间隔放置的LED芯片、固晶层、引线和复合封装胶结构;封装基板上有通过固晶层键合的若干LED芯片,LED芯片通过引线和基板电路连接,多基色LED芯片上有复合封装胶结构,复合封装胶结构由纯封装胶的第一封装胶层和掺有微纳米散射颗粒掺杂的第二封装胶层组成,并且第二封装胶层位于第一封装胶层周围。如此保证大部分光线直接从第一封装胶层出射,而大角度的光线在微米纳米颗粒掺杂的第二封装胶层内与微米纳米颗粒发生散射作用,从而改善不同LED芯片出光的各向均匀性,实现大视角的混光,同时保证高光提取效率。
20
CN112271246A
一种新型LED灯珠封装方式方法
Substantial Examination
Publication/Patent Number: CN112271246A Publication Date: 2021-01-26 Application Number: 202011156525.6 Filing Date: 2020-10-26 Inventor: 李仁   Assignee: 江西瑞晟光电科技有限公司   IPC: H01L33/64 Abstract: 本发明公开了一种新型LED灯珠封装方式方法,其特征在于,包括:S1:将LED芯片固定在LED支架上表面,LED支架上表面预先涂有绝缘胶;S2:使用导热胶将散热片固定在所述LED支架的散热空腔内;S3:将LED芯片通过焊锡和电极连接;S4:在LED支架的涂设散热胶之后,在LED支架的内腔安装反光块;S5:在LED芯片表面铺设荧光粉层;S6:在荧光粉层上使用透明树脂封装,完成所述LED灯珠的封装。通过设置有设置的凸面透明树脂,使得LED芯片散发的光更加的集中,通过设置有的散热片和排热通道,使得LED芯片的热量能够更快的排出,避免热量堆积,低的LED的光通量得到提升。
Total 500 pages