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1 BR0009105B1
composição de moldagem condutora.
Title (English): 1
Publication/Patent Number: BR0009105B1 Publication Date: 2012-01-24 Application Number: 0009105 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: Butler, Kurt I   IPC: C08F283/01 Abstract: 'COMPOSTOS DE MOLDAGEM ALTAMENTE CONDUTORES EPLACAS BIPOLARES DE CéLULAS DE COMBUSTìVELCOMPREENDENDO ESSES COMPOSTOS'. Um polímerocondutor é descrito
2 US2003168638A1
Highly conductive molding compounds having an increased distribution of large size graphite particles
Publication/Patent Number: US2003168638A1 Publication Date: 2003-09-11 Application Number: 10/135,955 Filing Date: 2002-04-29 Inventor: Butler, Kurt I.   Assignee: Butler, Kurt I.   IPC: H01B001/00 Abstract: The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising group II oxides, alkaline earth oxides, carbodiamides, polyisocynates, polyethylene and polytetraethylene fluoroethylene. The conductive filler is an inorganic filler which is desirably particulate graphite having a significant distribution of large particles such as for example, 95% in the range of about 150 to about 1000 microns with over about 40%, and more particularly about 50% or even 60% over 200 microns, or over 300 microns, or even over 600 microns. Conductive polymers may be used as a conductivity enhancer with the graphite. In addition, silver coated ceramic fibers can be added to improve the overall electrical properties. Fuel cell plates can be made from these compositions. Fuel cell plates can be made from these compositions. The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising ...More ...Less
3 US2002005508A1
Process of injection molding highly conductive molding compounds and an apparatus for this process
Publication/Patent Number: US2002005508A1 Publication Date: 2002-01-17 Application Number: 09/879,327 Filing Date: 2001-06-12 Inventor: Butler, Kurt I.   Thomas, Daniel G.   Assignee: Butler, Kurt I.   Thomas, Daniel G.   IPC: H01B001/06 Abstract: A technique and apparatus are disclosed for injection molding highly filled conductive resin compositions. These compositions include one or more of unsaturated polyester and vinyl ester resin; a copolymer having a terminal ethylene group; and at least about 50 weight percent of an inorganic particulate conductive filler, an initiator, and a rheological modifier to prevent phase separation between said resin and said conductive filler during molding. The method of the present invention allows these compositions to be molded into highly intricate and thin electrically and thermally conductive specimens without significant post process machining. The method involves the use of an injection molding apparatus that has a hopper with an auger having a vertical component in its positioning to feed into the feed throat of an injection molding machine which has a phenolic screw that has been modified to have a constant inner diameter and a constant flight depth. A technique and apparatus are disclosed for injection molding highly filled conductive resin compositions. These compositions include one or more of unsaturated polyester and vinyl ester resin; a copolymer having a terminal ethylene group; and at least about 50 weight percent of ...More ...Less
4 BR0009105A
composição de moldagem condutora.
Title (English): 1
Publication/Patent Number: BR0009105A Publication Date: 2001-12-18 Application Number: 0009105 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: Butler, Kurt I   IPC: C08F283/01 Abstract: 'COMPOSTOS DE MOLDAGEM ALTAMENTE CONDUTORES EPLACAS BIPOLARES DE CéLULAS DE COMBUSTìVELCOMPREENDENDO ESSES COMPOSTOS'. Um polímerocondutor é descrito
5 US2001049046A1
Highly conductive molding compounds for use as fuel cell plates and the resulting products
Publication/Patent Number: US2001049046A1 Publication Date: 2001-12-06 Application Number: 09/849,629 Filing Date: 2001-05-04 Inventor: Butler, Kurt I.   Assignee: Butler, Kurt I.   IPC: H01M008/02 Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by compression and/or injection molding techniques, into highly intricate and thin specimens without significant post machining. and which exhibit consistent conductivity, sufficient strength and flexibility, and appropriate surface characteristics. In particular the invention involves molding resin composition, which have high loadings of conductive fillers. Further the compositions may include rheological modifiers such as Group II oxides and hydroxides; carbodiamides; aziridines; polyisocyanates; polytetrafluorethylene (PTFE); perfluoropolyether (PFPE), and polyethylene. In an additional embodiment of the invention, an anti-shrink additive is added to improve the characteristics of the molded fuel cell plate. A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by ...More ...Less