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1
US20180267417A1
Publication/Patent Number: US20180267417A1
Publication date: 2018-09-20
Application number: 15/904,551
Filing date: 2018-02-26
Abstract: Provided is a toner including at least: a non-crystalline polyester resin; and a crystalline polyester resin, wherein when a cross-section of the toner is observed, the crystalline polyester resin has a maximum length of 100 nm or greater but less than 500 nm, and a ratio Dv/Dn of a volume average diameter Dv of the crystalline polyester resin to a number average diameter Dn of the crystalline polyester resin is less than 1.20. Provided is a toner including at least: a non-crystalline polyester resin; and a crystalline polyester resin, wherein when a cross-section of the toner is observed, the crystalline polyester resin has a maximum length of 100 nm or greater but less than 500 nm, and a ratio Dv/Dn ...more ...less
2
US09879207B2
Publication/Patent Number: US09879207B2
Publication date: 2018-01-30
Application number: 15/046,201
Filing date: 2016-02-17
Abstract: A cleaning filling liquid for inkjet device including water; 10.0% by mass to 45% by mass per whole amount of the cleaning filling liquid of an amide compound having following formula (1).
3
JP6216683B2
Publication/Patent Number: JP6216683B2
Publication date: 2017-10-18
Application number: 2014101057
Filing date: 2014-05-15
Abstract: PROBLEM TO BE SOLVED: To provide structure capable of easily and reliably attaching a reinforcement member to a metallic or steel material lower structure.SOLUTION: A bridge seat member is formed of plural vertical beams 3a extending in a bridge axial direction and plural transverse beams 3b extending perpendicularly to a bridge axis in combination. Plural adhesive agent filling concaves 15 with a bottom PROBLEM TO BE SOLVED: To provide structure capable of easily and reliably attaching a reinforcement member to a metallic or steel material lower structure.SOLUTION: A bridge seat member is formed of plural vertical beams 3a extending in a bridge axial direction and plural ...more ...less
4
JP6138070B2
Publication/Patent Number: JP6138070B2
Publication date: 2017-05-31
Application number: 2014033915
Filing date: 2014-02-25
Abstract: PROBLEM TO BE SOLVED: To provide a fixture mounting structure of a bridge
5
US2017374111A1
Publication/Patent Number: US2017374111A1
Publication date: 2017-12-28
Application number: 20/171,570
Filing date: 2017-09-11
Abstract: A communication control apparatus control establishment of sessions for transmitting content data between communication terminals in a communication system having relay management apparatuses for relaying the content data transmitted from the communication terminals
6
JP2016055226A
Publication/Patent Number: JP2016055226A
Publication date: 2016-04-21
Application number: 2014182239
Filing date: 2014-09-08
Inventor: Inoue, Hiroshi  
Assignee: INOUE HIROSHI
Abstract: PROBLEM TO BE SOLVED: To provide a horizontal type vibrating sieve capable of reducing the weight of the main part of an exciter and the driving power of a driving source.SOLUTION: In the horizontal type vibrating sieve
7
JP2016055227A
Publication/Patent Number: JP2016055227A
Publication date: 2016-04-21
Application number: 2014182240
Filing date: 2014-09-08
Inventor: Inoue, Hiroshi  
Assignee: INOUE HIROSHI
Abstract: PROBLEM TO BE SOLVED: To provide a tilting type vibrating sieve capable of reducing the weight of the main part of an exciter and the driving power of a driving source.SOLUTION: In the tilting type vibrating sieve
8
JP2016185539A
Publication/Patent Number: JP2016185539A
Publication date: 2016-10-27
Application number: 2016024263
Filing date: 2016-02-11
Inventor: Taira, Yoshifumi  
Abstract: PROBLEM TO BE SOLVED: To efficiently remove water from an object to be subjected to water removal
9
US20160160161A1
Publication/Patent Number: US20160160161A1
Publication date: 2016-06-09
Application number: 15/046,201
Filing date: 2016-02-17
Abstract: A cleaning filling liquid for inkjet device comprising: Water; 10.0% by mass to 45% by mass per whole amount of the cleaning filling liquid of an amide compound having following structural formula (1).
11
WO2016147826A1
Publication/Patent Number: WO2016147826A1
Publication date: 2016-09-22
Application number: 2016055547
Filing date: 2016-02-25
Abstract: [Problem] To select a most suitable transmission path in a communication system having a relay device for relaying information between communication terminals. [Solution] A communication system provided with a plurality of relay management devices for relaying content data transmitted from a communication terminal [Problem] To select a most suitable transmission path in a communication system having a relay device for relaying information between communication terminals. [Solution] A communication system provided with a plurality of relay management devices for relaying content data ...more ...less
12
JP2015150473A
Publication/Patent Number: JP2015150473A
Publication date: 2015-08-24
Application number: 2014024301
Filing date: 2014-02-12
Inventor: Inoue, Hiroshi  
Assignee: INOUE HIROSHI
Abstract: PROBLEM TO BE SOLVED: To sort weakly-magnetic stainless and non-magnetic material
13
JP2015232245A
Publication/Patent Number: JP2015232245A
Publication date: 2015-12-24
Application number: 2014119851
Filing date: 2014-06-10
Abstract: PROBLEM TO BE SOLVED: To provide a sediment dredging flocculation treatment system that dredges a floating mud layer and a deposit surface layer by using a pump without disrupting a deposit and generating turbidity with the work
14
JP5707051B2
Publication/Patent Number: JP5707051B2
Publication date: 2015-04-22
Application number: 2010094929
Filing date: 2010-04-16
Abstract: PROBLEM TO BE SOLVED: To provide a waste material treating facility that can remarkably reduce space required for installation and sort out building waste materials with multiple kinds of waste materials mixed therein with more accuracy also for recycling.SOLUTION: The waste material treating facility 11 includes size sorters 20 PROBLEM TO BE SOLVED: To provide a waste material treating facility that can remarkably reduce space required for installation and sort out building waste materials with multiple kinds of waste materials mixed therein with more accuracy also for recycling.SOLUTION: The waste ...more ...less
15
JP2015218454A
Publication/Patent Number: JP2015218454A
Publication date: 2015-12-07
Application number: 2014101057
Filing date: 2014-05-15
Abstract: PROBLEM TO BE SOLVED: To provide structure capable of easily and reliably attaching a reinforcement member to a metallic or steel material lower structure.SOLUTION: A bridge seat member is formed of plural vertical beams 3a extending in a bridge axial direction and plural transverse beams 3b extending perpendicularly to a bridge axis in combination. Plural adhesive agent filling concaves 15 with a bottom PROBLEM TO BE SOLVED: To provide structure capable of easily and reliably attaching a reinforcement member to a metallic or steel material lower structure.SOLUTION: A bridge seat member is formed of plural vertical beams 3a extending in a bridge axial direction and plural ...more ...less
16
US20150243632A1
Publication/Patent Number: US20150243632A1
Publication date: 2015-08-27
Application number: 14/190,885
Filing date: 2014-02-26
Abstract: A semiconductor device, having an insulating substrate; a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards; a first insulating material layer which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto; a first metal thin film wire layer which is provided on the first insulating material layer (A) and a portion of which is exposed to an external surface; a first insulating material layer (B) which is provided on the first metal thin film wire layer; a second insulating material layer which is provided on a main surface of the insulating substrate where the semiconductor element is not mounted; and a second metal thin film wire layer which is provided inside the second insulating material layer. A semiconductor device, having an insulating substrate; a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards; a first insulating material layer which ...more ...less
17
US20150332937A1
Publication/Patent Number: US20150332937A1
Publication date: 2015-11-19
Application number: 14/807,193
Filing date: 2015-07-23
Abstract: A method of manufacturing a semiconductor device having an insulating substrate, a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards, a first insulating material layer (A) which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto, a first metal thin film wire layer provided on the first insulating material layer (A) and a portion of which is exposed to an external surface, a first insulating material layer (B) provided on the first metal thin film wire layer, a second insulating material layer provided on a main surface of the insulating substrate where the semiconductor element is not mounted, a second metal thin film wire layer provided inside the second insulating material layer. A method of manufacturing a semiconductor device having an insulating substrate, a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards, a first insulating ...more ...less
18
JP2015158106A
Publication/Patent Number: JP2015158106A
Publication date: 2015-09-03
Application number: 2014033915
Filing date: 2014-02-25
Abstract: PROBLEM TO BE SOLVED: To provide a fixture mounting structure of a bridge
19
JP5513286B2
Publication/Patent Number: JP5513286B2
Publication date: 2014-06-04
Application number: 2010154387
Filing date: 2010-07-07
Inventor: Inoue, Hiroshi  
Assignee: INOUE HIROSHI
Abstract: PROBLEM TO BE SOLVED: To provide a pin attaching/detaching tool for attaching/detaching a pin without applying impact.SOLUTION: The tool is used for fitting a cylindrical part 3 to a shaft part 2 and fixing with a pin 4
20
US20140134461A1
Publication/Patent Number: US20140134461A1
Publication date: 2014-05-15
Application number: 14/130,063
Filing date: 2012-06-05
Abstract: A secondary battery having high heat dissipation ability is provided. A secondary battery including a plurality of positive electrodes and a plurality of negative electrodes in an outer package, wherein the plurality of positive electrodes are connected to each other outside the outer package without being connected to each other inside the outer package, or wherein the plurality of negative electrodes are connected to each other outside the outer package without being connected to each other inside the outer package, or wherein the plurality of positive electrodes are connected to each other outside the outer package without being connected to each other inside the outer package and the plurality of negative electrodes are connected to each other outside the outer package without being connected to each other inside the outer package. In addition, the secondary battery, wherein the plurality of positive electrodes are connected to each other outside the outer package without being connected to each other inside the outer package, the outer package includes an electrolytic solution containing an additive, the plurality of positive electrodes contain lithium, and the plurality of positive electrodes are connected to each other outside the outer package after a potential is applied to at least one positive electrode between the plurality of positive electrodes until a potential equal to or less than a potential at which the additive is reductively decomposed is reached. A secondary battery having high heat dissipation ability is provided. A secondary battery including a plurality of positive electrodes and a plurality of negative electrodes in an outer package, wherein the plurality of positive electrodes are connected to each other outside the ...more ...less