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1
US10222248B2
Publication/Patent Number: US10222248B2
Publication date: 2019-03-05
Application number: 15/784,724
Filing date: 2017-10-16
Abstract: Internal electrodes, a protective film, and protective films covering the top parts of internal electrode sides of lead wires are formed on a top surface of a substrate of a temperature sensor element, thereby making the overall shape a quadrangular prism and the transverse cross-section nearly a square even at any portion in the axial direction. A heating part of the temperature sensor element is provided near the center along the length, the height, and the width of the element, thereby preventing deviation of heat generation and stabilizing heat release to the lead wires. This allows the temperature sensor element to suppress fluctuation in detected temperatures due to mounting angle. Internal electrodes, a protective film, and protective films covering the top parts of internal electrode sides of lead wires are formed on a top surface of a substrate of a temperature sensor element, thereby making the overall shape a quadrangular prism and the transverse ...more ...less
2
US10256014B2
Publication/Patent Number: US10256014B2
Publication date: 2019-04-09
Application number: 15/529,235
Filing date: 2015-11-16
Abstract: To provide a wire-wound resistor provided with high reliability and that retains the basic functionality of the wire-wound resistor, and a method for manufacturing the same. A wire-wound resistor in which a resistor wire is wound onto an external periphery of a core (11) obtained by bundling fibrous insulators, and a connection terminal (13) is attached to both ends of the core (11) and connected to the resistor wire (12a), wherein the core (11) is impregnated with a binder in the portion (11a) in the vicinity of the external periphery. The binder (1) is preferably not included in a center portion (11b) of the core (11). To provide a wire-wound resistor provided with high reliability and that retains the basic functionality of the wire-wound resistor, and a method for manufacturing the same. A wire-wound resistor in which a resistor wire is wound onto an external periphery of a core (11) ...more ...less
3
US20190198203A1
Publication/Patent Number: US20190198203A1
Publication date: 2019-06-27
Application number: 16/311,858
Filing date: 2017-06-02
Abstract: Provided is a surface-mountable thin film resistor network, which includes a chip, on which a thin film resistor network integrated array is formed, and a molded resin package, which encapsulate the chip. The surface-mountable thin film resistor network is provided with a chip (13) on which a thin film resistor integrated array has been formed; an island (12) on which the chip is fixed; a plurality of lead terminals (14) extending outward around periphery of the island; wires (15) connecting electrodes of resistors mounted on the chip to the lead terminals; and a molded resin package (20) that encapsulate a portion, which includes the wires; wherein a hanging lead (18) extending from the island is cut at an end surface of the molded resin package, and an electrical insulation (21) is applied to the cut section of the hanging lead. Provided is a surface-mountable thin film resistor network, which includes a chip, on which a thin film resistor network integrated array is formed, and a molded resin package, which encapsulate the chip. The surface-mountable thin film resistor network is provided with a chip ...more ...less
4
US20190066886A1
Publication/Patent Number: US20190066886A1
Publication date: 2019-02-28
Application number: 16/083,004
Filing date: 2017-02-20
Abstract: A resistor has a structure including a resistor substrate that has paired electrodes and a resistive element formed on an insulating substrate, an insulating exterior material that covers at least the upper and the side surface of the resistor substrate, and harness electric wires that have one end parts connected to the respective electrodes, pass through the exterior material, and extend outside. The paired electrodes are formed on areas other than the end parts of the insulating substrate, and junctions of the end parts of the harness electric wires and the paired electrodes are at positions where creepage distance of insulation from the junctions to the bottom ends of the insulating substrate is a predetermined distance or longer. Such structure provides the resistor having a secured creepage distance of insulation between the conductor parts of the resistor and the metal case in which the resistor is installed. A resistor has a structure including a resistor substrate that has paired electrodes and a resistive element formed on an insulating substrate, an insulating exterior material that covers at least the upper and the side surface of the resistor substrate, and harness electric ...more ...less
5
US20190172614A1
Publication/Patent Number: US20190172614A1
Publication date: 2019-06-06
Application number: 16/323,151
Filing date: 2017-06-23
Abstract: A single or multiple cutters are pressed against end surfaces of a resistive element so as to form a plurality of notches in rims of the end surfaces. At this time, notches are formed such that notch depth at the end surfaces of the resistive element toward the axis center is smaller than notch length from the end surfaces of the resistive element to the axis. This allows easy cutting and removal of the resistance wire at the resistive element ends of a coil resistor, etc., and prevention of fraying of a wound wire at the resistive element ends. A single or multiple cutters are pressed against end surfaces of a resistive element so as to form a plurality of notches in rims of the end surfaces. At this time, notches are formed such that notch depth at the end surfaces of the resistive element toward the axis center is ...more ...less
6
US20190035520A1
Publication/Patent Number: US20190035520A1
Publication date: 2019-01-31
Application number: 16/072,318
Filing date: 2017-01-23
Inventor: Hiroshima, Yasushi  
Abstract: Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film. Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the ...more ...less
7
US20190096549A1
Publication/Patent Number: US20190096549A1
Publication date: 2019-03-28
Application number: 16/083,088
Filing date: 2017-02-20
Abstract: A power resistor has paired harness electric wires that have one end parts connected to a resistor substrate, and other end parts pass through an exterior material made of insulating resin and extend outward. Crimp terminals, which are means for reinforcing affinity between the coating material of the harness electric wires and the insulating resin, i.e., the exterior material and for maintaining adhesion, are formed on predetermined portions of the harness electric wires. As a result, a short and small power resistor suitable for an in-vehicle environment is provided. A power resistor has paired harness electric wires that have one end parts connected to a resistor substrate, and other end parts pass through an exterior material made of insulating resin and extend outward. Crimp terminals, which are means for reinforcing affinity between the ...more ...less
8
US10192658B2
Publication/Patent Number: US10192658B2
Publication date: 2019-01-29
Application number: 15/562,046
Filing date: 2016-03-08
Abstract: In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating substrate 1 shaped like a cuboid; a pair of front electrodes 2 provided on lengthwise opposite edge portions of a front surface of the insulating substrate 1; a resistor body 3 provided between the front electrodes 2; an insulating protection layer 4 covering entire surfaces of the front electrodes 2 and the resistor body 3; and a pair of terminal electrodes 5 provided on lengthwise opposite end surfaces of the insulating substrate 1. The chip resistor is configured such that the front electrodes 2 sandwiched between the insulating substrate 1 and the protection layer 4 are exposed from widthwise end surfaces and the lengthwise end surfaces of the insulating substrate 1, and the terminal electrodes 5 wrap around the widthwise opposite end surfaces of the insulating substrate 1 to be thereby connected to the exposed portions of the front electrodes 2. In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating ...more ...less
9
US20190162757A1
Publication/Patent Number: US20190162757A1
Publication date: 2019-05-30
Application number: 16/313,366
Filing date: 2017-05-25
Abstract: Provided is a current measuring device for measuring current, including a conductor adapted to pass current therethrough, at least a pair of voltage sensing terminals arranged apart from each other on the conductor in the current flowing direction, and a substrate to which the voltage sensing terminals are connected. The substrate is long in the current flowing direction, and connection portion of the substrate that are connected to the voltage sensing terminals are arranged closer to one end side of the substrate in the lengthwise direction. Provided is a current measuring device for measuring current, including a conductor adapted to pass current therethrough, at least a pair of voltage sensing terminals arranged apart from each other on the conductor in the current flowing direction, and a substrate to which the ...more ...less
10
US20190170556A1
Publication/Patent Number: US20190170556A1
Publication date: 2019-06-06
Application number: 16/095,836
Filing date: 2017-02-27
Inventor: Ikeno, Tomokazu  
Abstract: To provide a flow sensor having improved responsiveness compared to the prior art, the flow sensor of the present invention includes an insulation board, a flow-rate detection resistance element, and a temperature compensation resistance element. Each of the flow-rate detection resistance element and the temperature compensation resistance element is arranged on the insulation board such that a terminal temperature of the temperature compensation resistance element approaches a terminal temperature of the flow-rate detection resistance element. Accordingly, responsiveness can be improved. To provide a flow sensor having improved responsiveness compared to the prior art, the flow sensor of the present invention includes an insulation board, a flow-rate detection resistance element, and a temperature compensation resistance element. Each of the flow-rate detection ...more ...less
11
US10276285B2
Publication/Patent Number: US10276285B2
Publication date: 2019-04-30
Application number: 15/764,570
Filing date: 2016-09-26
Inventor: Matsumoto, Kentaro  
Abstract: Provided is a chip resistor including: a rectangular parallelepiped insulating substrate which is made of ceramics; a pair of front electrodes which are provided on lengthwise opposite end portions in a front surface of the insulating substrate; a resistive element which is provided between and connected to the two front electrodes; a protective layer which is made of a resin and which entirely covers the front surface of the insulating substrate including the two front electrodes and the resistive element; and a pair of cap-shaped end-surface electrodes which are provided on the lengthwise opposite end portions of the insulating substrate to establish electrical continuity to the front electrodes respectively; wherein: a chip element assembly in which the insulating substrate and the protective layer are laminated on each other but the end-surface electrodes have not been formed yet has an external shape substantially like a square cylinder. Provided is a chip resistor including: a rectangular parallelepiped insulating substrate which is made of ceramics; a pair of front electrodes which are provided on lengthwise opposite end portions in a front surface of the insulating substrate; a resistive element which is ...more ...less
12
US10224132B2
Publication/Patent Number: US10224132B2
Publication date: 2019-03-05
Application number: 15/126,199
Filing date: 2015-03-11
Inventor: Matsumoto, Kentaro  
Abstract: A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver as a main metal component an 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer lower in specific resistance than the main electrode layer, a laminate part where the auxiliary electrode layer and the main electrode layer are laminated in order on a single surface of the insulating substrate; and an exposed part of the auxiliary electrode layer where a part of the auxiliary electrode layer is not covered with the main electrode layer on a far side from the resistor, and part that extend from a near side to the far side with respect to the resistor. A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver ...more ...less
13
US10192659B2
Publication/Patent Number: US10192659B2
Publication date: 2019-01-29
Application number: 15/572,847
Filing date: 2016-04-11
Abstract: Provided is a chip resistor in which cracks, fracture, etc. can be surely prevented from occurring due to thermal stress in solder bonding portions. The chip resistor 1 includes: a ceramic substrate 2 that is shaped like a cuboid; a pair of front electrodes 3 that are provided on lengthwise opposite end portions of a front surface of the ceramic substrate 2; a resistor body 4 that is provided between and connected to the two front electrodes 3; a protective layer 5 that covers the resistor body 4; a pair of back electrodes 6 that are provided on lengthwise opposite end portions of a back surface of the ceramic substrate 2; end-surface electrodes 7 through which the front electrodes 3 and the back electrodes 6 are electrically conductively connected to each other respectively; external electrodes 8 that cover the end-surface electrodes 7; and a pair of insulating resin layers 9 that are provided to cover edge portions of the back electrodes 6; wherein: the pair of insulating resin layers 9 are opposed to each other with interposition of a predetermined interval therebetween on the back surface of the ceramic substrate 2; and at least opposed side end portions of the insulating resin layers 9 are exposed from the external electrodes 8. Provided is a chip resistor in which cracks, fracture, etc. can be surely prevented from occurring due to thermal stress in solder bonding portions. The chip resistor 1 includes: a ceramic substrate 2 that is shaped like a cuboid; a pair of front electrodes 3 that are provided ...more ...less
14
US10157698B2
Publication/Patent Number: US10157698B2
Publication date: 2018-12-18
Application number: 15/301,578
Filing date: 2015-04-06
Abstract: In a metal plate resistor, the bonded surface between the resistance body and the electrode can be prevented from peeling off. The metal plate resistor comprises a resistance body; an electrode consisting of metal material having a higher conductivity than the resistance body, and the electrode bonded with the resistance body; a recessed portion formed in an end face of the electrode on a side bonded with the resistance body; and a fixation hole formed in the electrode for inserting a bolt; wherein an end portion of the resistance body is fitted into the recessed portion in the electrode. The recessed portion is provided with wall portions on both sides in a width direction of the resistance body, and in a direction substantially perpendicular to a penetration direction of the fixation hole. The recessed portion is opened to an end face and a first surface of the electrode. In a metal plate resistor, the bonded surface between the resistance body and the electrode can be prevented from peeling off. The metal plate resistor comprises a resistance body; an electrode consisting of metal material having a higher conductivity than the resistance body ...more ...less
15
US20180188295A1
Publication/Patent Number: US20180188295A1
Publication date: 2018-07-05
Application number: 15/739,022
Filing date: 2016-06-14
Abstract: Provided is a current sensing device including an electrical conductor made of electrically conductive metal; and voltage sensing terminals provided on the electrical conductor. Each voltage sensing terminal is formed by inserting bar-like metal into a through-hole formed in the electrical conductor, and the voltage sensing terminal includes a first terminal portion that is stored in the through-hole and a second terminal portion that protrudes from the through-hole. Provided is a current sensing device including an electrical conductor made of electrically conductive metal; and voltage sensing terminals provided on the electrical conductor. Each voltage sensing terminal is formed by inserting bar-like metal into a through-hole formed in the ...more ...less
16
US20180283919A1
Publication/Patent Number: US20180283919A1
Publication date: 2018-10-04
Application number: 15/765,051
Filing date: 2016-09-30
Inventor: Ikeno, Tomokazu  
Abstract: Provided is a flow sensor capable of suppressing deterioration in responsiveness and sensitivity to a flow of fluid even if chip resistors that are disposed on an insulating substrate are used as a heating resistor and a temperature compensating resistor. A flow sensor includes a signal processing part that processes signals from a heating resistor and a temperature compensating resistor. The heating resistor is a chip resistor disposed on a front surface of an insulating substrate made of resin, and the temperature compensating resistor is a back surface of the insulating substrate. The temperature compensating resistor is disposed on a heat radiation path of the heating resistor via the insulating substrate. The insulating substrate has reduced opportunities of contact between the temperature compensating resistor and wind than opportunities of contact between the heating resistor and the fluid. Provided is a flow sensor capable of suppressing deterioration in responsiveness and sensitivity to a flow of fluid even if chip resistors that are disposed on an insulating substrate are used as a heating resistor and a temperature compensating resistor. A flow sensor includes ...more ...less
17
US10083780B2
Publication/Patent Number: US10083780B2
Publication date: 2018-09-25
Application number: 15/593,795
Filing date: 2017-05-12
Inventor: Naito, Takashi  
Abstract: Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof. The first resistive element and the second resistive element are integrated by being covered with a sheath. The first lead wires and the second lead wires are arranged such that they protrude outward in a direction of an axis beyond the sheath. The first lead wires and the second lead wires are bent alongside surfaces and a bottom surface of the sheath. Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead ...more ...less