Country
Full text data for US and EP
Status
Type
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC
No.
Publication Number
Title
Publication/Patent Number Publication/Patent Number
Publication date Publication date
Application number Application number
Filing date Filing date
Inventor Inventor
Assignee Assignee
IPC IPC
1
WO2013114528A1
Publication/Patent Number: WO2013114528A1
Publication date: 2013-08-08
Application number: 2012051959
Filing date: 2012-01-30
Abstract: There are provided: a partition means (1) for partitioning the cold aisle (6) and the hot aisle (7) in a chamber housing an information processing device (5); and a rectifying means (2)
2
WO2013018344A1
Publication/Patent Number: WO2013018344A1
Publication date: 2013-02-07
Application number: 2012004810
Filing date: 2012-07-27
Abstract: A substrate furnished with a slit (ST) between one mounting area (34) and another mounting area (34) is prepared beforehand. Forming an oxide film (36) in areas that also include side surfaces merely exposes the side surfaces at the locations corresponding to the cut cross section when the tie bar (35) is cut. The cut surface at which the metal material lies exposed can thereby be made extremely small. A substrate furnished with a slit (ST) between one mounting area (34) and another mounting area (34) is prepared beforehand. Forming an oxide film (36) in areas that also include side surfaces merely exposes the side surfaces at the locations corresponding to the cut cross ...more ...less
3
US2012098137A1
Publication/Patent Number: US2012098137A1
Publication date: 2012-04-26
Application number: 13/381,299
Filing date: 2010-06-30
Abstract: Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics. Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal ...more ...less
4
WO2012132210A1
Publication/Patent Number: WO2012132210A1
Publication date: 2012-10-04
Application number: 2012001184
Filing date: 2012-02-22
Abstract: A substrate for element mounting (40) which comprises: a heat sink base (10) constituted of a material comprising at least one metal selected from the group consisting of Al
5
WO2012029318A1
Publication/Patent Number: WO2012029318A1
Publication date: 2012-03-08
Application number: 2011004894
Filing date: 2011-08-31
Abstract: An aperture (300) is provided in an insulating resin layer (230) for a base material and corresponds to the installation region of a semiconductor element (120). A first insulating resin layer (250) is provided in part of one main surface of the insulating resin layer (230) for a base material An aperture (300) is provided in an insulating resin layer (230) for a base material and corresponds to the installation region of a semiconductor element (120). A first insulating resin layer (250) is provided in part of one main surface of the insulating resin layer (230) for ...more ...less
6
US2011100696A1
Publication/Patent Number: US2011100696A1
Publication date: 2011-05-05
Application number: 12/915,852
Filing date: 2010-10-29
Abstract: A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface. A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A ...more ...less
7
US2011174527A1
Publication/Patent Number: US2011174527A1
Publication date: 2011-07-21
Application number: 13/002,189
Filing date: 2009-06-30
Abstract: A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having the same thickness as that of a wiring layer provided in an insulating layer, a second conductor formed on the first conductor, a gold plating layer provided on the second conductor. A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having ...more ...less
8
WO2011002031A1
Publication/Patent Number: WO2011002031A1
Publication date: 2011-01-06
Application number: 2010061172
Filing date: 2010-06-30
Abstract: Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic
9
WO2011040548A1
Publication/Patent Number: WO2011040548A1
Publication date: 2011-04-07
Application number: 2010067119
Filing date: 2010-09-30
Abstract: Disclosed are a substrate for mounting an element
10
WO2011052746A1
Publication/Patent Number: WO2011052746A1
Publication date: 2011-05-05
Application number: 2010069353
Filing date: 2010-10-29
Abstract: Disclosed is an element mounting substrate (110) which is provided with: a base material (10); an insulating layer (30)
11
US2010244171A1
Publication/Patent Number: US2010244171A1
Publication date: 2010-09-30
Application number: 12/727,913
Filing date: 2010-03-19
Abstract: A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills. A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower ...more ...less
12
US2010288550A1
Publication/Patent Number: US2010288550A1
Publication date: 2010-11-18
Application number: 12/679,615
Filing date: 2008-07-28
Abstract: There has been such a problem that conventional element mounting substrates and circuit devices using such substrates are not easily thinned, as there is a wiring layer formed on each of the substrates and that a part of the wiring layer is protruded and used as a bump electrode. In an element mounting substrate of this invention and a circuit device using such substrate, a through hole is arranged on an insulating base material, and a wiring layer is protruded from the surface of the insulating base material through the through hole. The protruding section of the wiring layer is used as a bump electrode, and a semiconductor element is mounted on the insulating base material. With such structure, the element mounting substrate is thinned, and the circuit device using such substrate is also thinned. There has been such a problem that conventional element mounting substrates and circuit devices using such substrates are not easily thinned, as there is a wiring layer formed on each of the substrates and that a part of the wiring layer is protruded and used as a bump ...more ...less
13
WO2010001597A1
Publication/Patent Number: WO2010001597A1
Publication date: 2010-01-07
Application number: 2009003036
Filing date: 2009-06-30
Abstract: A semiconductor device (10) having a PoP structure wherein a first electrode part (160) formed on a first semiconductor module (100) and a second electrode part (242) formed on a second semiconductor module (200) are joined with each other by a solder ball (270).  The first electrode part has a first conductor part (162) having a thickness equal to the thickness of a wiring layer (140) formed on an insulating resin layer (130) A semiconductor device (10) having a PoP structure wherein a first electrode part (160) formed on a first semiconductor module (100) and a second electrode part (242) formed on a second semiconductor module (200) are joined with each other by a solder ball (270).  The first ...more ...less
14
JP2009055202A
Publication/Patent Number: JP2009055202A
Publication date: 2009-03-12
Application number: 2007218543
Filing date: 2007-08-24
Abstract: PROBLEM TO BE SOLVED: To provide a novel earphone which is small and light-weighted with excellent feeling in wearing
15
WO2009041159A1
Publication/Patent Number: WO2009041159A1
Publication date: 2009-04-02
Application number: 2008063924
Filing date: 2008-07-28
Abstract: There has been such a problem that conventional element mounting substrates and circuit devices using such substrates are not easily thinned