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1
WO2013124983A1
Publication/Patent Number: WO2013124983A1
Publication date: 2013-08-29
Application number: 2012054259
Filing date: 2012-02-22
Abstract: A water jacket core (10) includes a base part (11) and is provided with an intermediate female thread part (15) in that base within a region surrounded by tangent lines (18
2
WO2012117536A1
Publication/Patent Number: WO2012117536A1
Publication date: 2012-09-07
Application number: 2011054751
Filing date: 2011-03-02
Abstract: The present invention enables the sharing of files using information held in terminal devices. A first storage unit (2a) stores shared files. A second storage unit (2b) stores authentication data that authenticates a specific user. A reception unit (2c) receives sharing setting data (6) via a network (5). A determination unit (2d) determines whether or not authentication data (6a) contained in the sharing setting data (6) matches the authentication data stored in the second storage unit (2b). When it has been determined by the determination unit (2b) that there is a match The present invention enables the sharing of files using information held in terminal devices. A first storage unit (2a) stores shared files. A second storage unit (2b) stores authentication data that authenticates a specific user. A reception unit (2c) receives sharing setting ...more ...less
3
WO2012035393A1
Publication/Patent Number: WO2012035393A1
Publication date: 2012-03-22
Application number: 2011002062
Filing date: 2011-09-07
Abstract: Provided is a hybrid relay provided with a first mechanical contact switch
4
WO2012120821A1
Publication/Patent Number: WO2012120821A1
Publication date: 2012-09-13
Application number: 2012001317
Filing date: 2012-02-27
Abstract: Provided is a battery assembly comprising: a plurality of batteries (30) which comprise an external terminal including a negative-pole terminal (50) and a positive-pole terminal; a bus bar (40) for connecting the external terminals of two adjacent batteries (30); a conductive linking member (70) which is welded to the external terminal and bus bar (40) to link the external terminal and bus bar (40); a weld (80) where the bus bar (40) and linking member (70) are welded; and a weld (82) where the external terminal and linking member (70) are welded. The linking member (70) comprises an intermediate section (70b) connected to the weld (80) Provided is a battery assembly comprising: a plurality of batteries (30) which comprise an external terminal including a negative-pole terminal (50) and a positive-pole terminal; a bus bar (40) for connecting the external terminals of two adjacent batteries (30); a conductive ...more ...less
5
WO2012140965A1
Publication/Patent Number: WO2012140965A1
Publication date: 2012-10-18
Application number: 2012055048
Filing date: 2012-02-29
Abstract: Disclosed is a cast pin equipped with circular grooves which are provided at any location. The cast pin (10) is equipped with: an outer tube (11) in the shape of a hollow body the tip of which is closed; an inner tube (20) inserted into the outer tube (11); and a cooling medium pipe (30) that is inserted into the inner tube (20) and supplies a cooling medium to the interior of the inner tube (20). Three circular grooves (22) are formed at prescribed intervals in the longitudinal direction Disclosed is a cast pin equipped with circular grooves which are provided at any location. The cast pin (10) is equipped with: an outer tube (11) in the shape of a hollow body the tip of which is closed; an inner tube (20) inserted into the outer tube (11); and a cooling medium ...more ...less
6
US20110174527A1
Publication/Patent Number: US20110174527A1
Publication date: 2011-07-21
Application number: 13/002,189
Filing date: 2009-06-30
Abstract: A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having the same thickness as that of a wiring layer provided in an insulating layer, a second conductor formed on the first conductor, a gold plating layer provided on the second conductor. A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having ...more ...less
7
US20110100696A1
Publication/Patent Number: US20110100696A1
Publication date: 2011-05-05
Application number: 12/915,852
Filing date: 2010-10-29
Abstract: A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface. A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A ...more ...less
8
BR9915401B1
Publication/Patent Number: BR9915401B1
Publication date: 2011-04-19
Application number: 9915401
Filing date: 1999-11-15
Abstract: Patente de Invenção: 'DERIVADOS DE PIRIMIDINILBENZIMIDAZOL E TRIAZINILBENZIMIDAZOL E FUNGICIDA AGRìCOLA/HORTìCOLA'. Derivado de pirimidinilbenzimidazol ou triazinilbenzimidazol [I] representados pela fórmula geral: bactericidas agrícolas/hortícolas contendo os mesmos como os ingredientes ativos e intermediários na produção dos mesmos representados pela fórmula geral [XV]. A representa N ou CR³; R¹ e R² representar cada independentemente hidrogênio Patente de Invenção: 'DERIVADOS DE PIRIMIDINILBENZIMIDAZOL E TRIAZINILBENZIMIDAZOL E FUNGICIDA AGRìCOLA/HORTìCOLA'. Derivado de pirimidinilbenzimidazol ou triazinilbenzimidazol [I] representados pela fórmula geral: bactericidas agrícolas/hortícolas contendo os mesmos como os ing ...more ...less
9
WO2011040548A1
Publication/Patent Number: WO2011040548A1
Publication date: 2011-04-07
Application number: 2010067119
Filing date: 2010-09-30
Abstract: Disclosed are a substrate for mounting an element
10
WO2011052746A1
Publication/Patent Number: WO2011052746A1
Publication date: 2011-05-05
Application number: 2010069353
Filing date: 2010-10-29
Abstract: Disclosed is an element mounting substrate (110) which is provided with: a base material (10); an insulating layer (30)
11
WO2011027590A1
Publication/Patent Number: WO2011027590A1
Publication date: 2011-03-10
Application number: 2010057593
Filing date: 2010-04-28
Abstract: Disclosed is a backlight device which comprises a substrate (2)
12
US20100264552A1
Publication/Patent Number: US20100264552A1
Publication date: 2010-10-21
Application number: 12/673,409
Filing date: 2008-08-08
Abstract: A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved. A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the ...more ...less
13
WO2010001597A1
Publication/Patent Number: WO2010001597A1
Publication date: 2010-01-07
Application number: 2009003036
Filing date: 2009-06-30
Abstract: A semiconductor device (10) having a PoP structure wherein a first electrode part (160) formed on a first semiconductor module (100) and a second electrode part (242) formed on a second semiconductor module (200) are joined with each other by a solder ball (270).  The first electrode part has a first conductor part (162) having a thickness equal to the thickness of a wiring layer (140) formed on an insulating resin layer (130) A semiconductor device (10) having a PoP structure wherein a first electrode part (160) formed on a first semiconductor module (100) and a second electrode part (242) formed on a second semiconductor module (200) are joined with each other by a solder ball (270).  The first ...more ...less
14
US7834135B2
Publication/Patent Number: US7834135B2
Publication date: 2010-11-16
Application number: 84/770,307
Filing date: 2007-08-30
Abstract: To provide a light emitting device capable of emitting light with high efficiency and of being formed by a coating process
16
US7855452B2
Publication/Patent Number: US7855452B2
Publication date: 2010-12-21
Application number: 02/286,508
Filing date: 2008-01-30
Abstract: An electrode for a semiconductor device is formed on the mounting surface (particularly
17
WO2010035082A3
Publication/Patent Number: WO2010035082A3
Publication date: 2010-05-27
Application number: 2009006248
Filing date: 2009-09-23
Abstract: A hybrid relay includes a first mechanical contact switch opened and closed by a first driving unit
18
WO2010035082A2
Publication/Patent Number: WO2010035082A2
Publication date: 2010-04-01
Application number: 2009006248
Filing date: 2009-09-23
Abstract: A hybrid relay includes a first mechanical contact switch opened and closed by a first driving unit
19
US20090250251A1
Publication/Patent Number: US20090250251A1
Publication date: 2009-10-08
Application number: 12/085,822
Filing date: 2006-11-30
Abstract: In a circuit device where a wiring layer, an insulating resin and a circuit element are stacked together in such a manner as to embed a bump structure into the insulating resin, the connection reliability between the bump structure and the circuit element is enhanced. A circuit device (10) has a structure where a wiring layer (20), an insulating resin layer (30) and a circuit element (40) are stacked in this order by a pressure bonding. The wiring layer (20) is provided with bump electrodes (22) in positions that correspond respectively to element electrodes of a circuit element (40). The insulating resin layer (30) is formed of a material that develops plastic flow when pressurized. The bump electrode (22) penetrates the insulating resin layer (30) and is electrically connected to a corresponding element electrode (42). In a circuit device where a wiring layer, an insulating resin and a circuit element are stacked together in such a manner as to embed a bump structure into the insulating resin, the connection reliability between the bump structure and the circuit element is enhanced. A circuit ...more ...less
20
US20090087719A1
Publication/Patent Number: US20090087719A1
Publication date: 2009-04-02
Application number: 12/297,345
Filing date: 2007-05-09
Abstract: A noise eliminator for a fuel cell has a noise elimination chamber that is filled with a noise elimination material, and also has discharge gas flow piping penetrating the noise elimination chamber and having holes in the peripheral wall of the piping and through which gas charged from the fuel cell flows. An electrically conductive material is added to the noise elimination material. The construction suppresses electrostatic charging even if discharge gas flows in the discharge gas flow piping. A noise eliminator for a fuel cell has a noise elimination chamber that is filled with a noise elimination material, and also has discharge gas flow piping penetrating the noise elimination chamber and having holes in the peripheral wall of the piping and through which gas ...more ...less