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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1 BR0009105B1
composição de moldagem condutora.
Title (English): 1
Publication/Patent Number: BR0009105B1 Publication Date: 2012-01-24 Application Number: 0009105 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: Butler, Kurt I   IPC: C08F283/01 Abstract: 'COMPOSTOS DE MOLDAGEM ALTAMENTE CONDUTORES EPLACAS BIPOLARES DE CéLULAS DE COMBUSTìVELCOMPREENDENDO ESSES COMPOSTOS'. Um polímerocondutor é descrito
2 JP2011099108A
HIGHLY CONDUCTIVE MOLDING COMPOUND
Publication/Patent Number: JP2011099108A Publication Date: 2011-05-19 Application Number: 2010288956 Filing Date: 2010-12-24 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES INC   IPC: C08F283/01 Abstract: PROBLEM TO BE SOLVED: To provide a highly conductive polymer to be suitably used as a bipolar plate of an electrochemical cell. SOLUTION: The conductive polymer is disclosed which is suitable for use in applications requiring corrosion resistance when subjected to acidic flow at temperature ranging from -40 to 140°F and which can be molded into highly intricate and thin specimens that exhibit consistent conductivity PROBLEM TO BE SOLVED: To provide a highly conductive polymer to be suitably used as a bipolar plate of an electrochemical cell. SOLUTION: The conductive polymer is disclosed which is suitable for use in applications requiring corrosion resistance when subjected to acidic flow at ...More ...Less
3 DE60044640D1
HOCHLEITFÄHIGE FORMMASSE UND BIPOLARE PLATTEN FÜR BRENNSTOFFZELLEN AUS DIESEN FORMMASSEN
Title (English): The claimant also alleges that, in the United States and Regulation No. 4,
Publication/Patent Number: DE60044640D1 Publication Date: 2010-08-19 Application Number: 60044640 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES INC.   IPC: C08F283/01
4 EP1171925B1
HIGHLY CONDUCTIVE MOLDING COMPOUNDS AND FUEL CELL BIPOLAR PLATES COMPRISING THESE COMPOUNDS
Publication/Patent Number: EP1171925B1 Publication Date: 2010-07-07 Application Number: 00919431.7 Filing Date: 2000-03-17 Inventor: Butler, Kurt I.   Assignee: Quantum Composites, Inc.   IPC: H01M6/18
5 US7579574B2
Molding compounds for use in induction heating applications and heating elements molded from these compounds
Publication/Patent Number: US7579574B2 Publication Date: 2009-08-25 Application Number: 11/644,533 Filing Date: 2006-12-22 Inventor: Butler, Kurt I.   Assignee: Premix Inc.   IPC: H05B3/10 Abstract: The invention provides molding compounds that are particularly suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article. These compounds are generally liquid thermosetting molding resins which comprise a thermoset resin matrix such as a terephthalate polyester which can include blends of polyester and/or vinyl ester with a significant loading of conductive inorganic filler, typically graphite. The compositions also include flame and sound retardant additives, and glass fibers. They are further formulated to meet the desired molding characteristics; to withstand the operating temperatures to which they will be exposed; and to have a predetermined strength and a desirable user interface including appearance, and odor. Typically, the compounds will have a glass transition temperature from about 160° C. (320° F.) to about 195° C. (383° F.). The invention provides molding compounds that are particularly suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article. These compounds are generally liquid thermosetting molding ...More ...Less
6 US7359629B2
Molding compounds for use in furnace blower housings and blower housings molded from these compounds
Publication/Patent Number: US7359629B2 Publication Date: 2008-04-15 Application Number: 11/114,833 Filing Date: 2005-04-26 Inventor: Butler, Kurt I.   Searl, Steven T.   Assignee: Premix Inc.   IPC: F24H3/06 Abstract: The invention provides blower housings for air handlers and hot air furnaces which are made from molding compounds that allow for wide flexibility in molding complex configurations so as to improve blower efficiency, which improve manufacturing efficiency and safety and provide suitable mechanical properties, safety in use, and sound dampening. These compounds are generally liquid thermosetting molding resins which comprise a thermoset resin matrix such as a isophthalate polyester having a specific loading of glass reinforcing fibers. The compositions also include flame retardant additives. They are further formulated to meet the desired molding characteristics; to withstand the operating temperatures to which they will be exposed; and to have a predetermined strength and a desirable user interface including appearance, and odor. Typically, the compounds will have a glass transition temperature from about 160° C. (320° F.) to about 185° C. (365° F.). The invention provides blower housings for air handlers and hot air furnaces which are made from molding compounds that allow for wide flexibility in molding complex configurations so as to improve blower efficiency, which improve manufacturing efficiency and safety and provide ...More ...Less
7 US7170038B2
Molding compounds for use in induction heating applications and heating elements molded from these compounds
Publication/Patent Number: US7170038B2 Publication Date: 2007-01-30 Application Number: 11/114,703 Filing Date: 2005-04-26 Inventor: Butler, Kurt I.   Assignee: Premix Inc.   IPC: H05B6/10 Abstract: The invention provides molding compounds that are particularly suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article. These compounds are generally liquid thermosetting molding resins which comprise a thermoset resin matrix such as a terephthalate polyester which can include blends of polyester and/or vinyl ester with a significant loading of conductive inorganic filler, typically graphite. The compositions also include flame and sound retardant additives, and glass fibers. They are further formulated to meet the desired molding characteristics; to withstand the operating temperatures to which they will be exposed; and to have a predetermined strength and a desirable user interface including appearance, and odor. Typically, the compounds will have a glass transition temperature from about 160° C. (320° F.) to about 195° C. (383° F.). The invention provides molding compounds that are particularly suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article. These compounds are generally liquid thermosetting molding ...More ...Less
8 JP2007196689A
PROCESS FOR INJECTION-MOLDING HIGHLY CONDUCTIVE RESIN COMPOSITION AND APPARATUS FOR THE PROCESS
Publication/Patent Number: JP2007196689A Publication Date: 2007-08-09 Application Number: 2007075623 Filing Date: 2007-03-22 Inventor: Butler, Kurt I   Thomas, Daniel G   Assignee: QUANTUM COMPOSITES INC   IPC: B29C45/00 Abstract: PROBLEM TO BE SOLVED: To provide a method which allows the compositions to be molded into highly intricate and thin electrically and thermally conductive specimens without significant post process machining. SOLUTION: A technique and an apparatus are disclosed for injection molding highly filled conductive resin compositions. These compositions include one or more of unsaturated polyester and vinyl ester resin PROBLEM TO BE SOLVED: To provide a method which allows the compositions to be molded into highly intricate and thin electrically and thermally conductive specimens without significant post process machining. SOLUTION: A technique and an apparatus are disclosed for injection ...More ...Less
9 CA2367350C
HIGHLY CONDUCTIVE MOLDING COMPOUNDS AND FUEL CELL BIPOLAR PLATES COMPRISING THESE COMPOUNDS
Publication/Patent Number: CA2367350C Publication Date: 2006-08-08 Application Number: 2367350 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES, INC.   IPC: C08F283/01 Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from -40 to 140 degrees Fahrenheit and which can be molded into highly intricate and thin specimens which exhibit consistent conductivity A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from -40 to 140 degrees Fahrenheit and which can be molded into highly intricate ...More ...Less
10 US6752937B2
Highly conductive molding compounds having an increased distribution of large size graphite particles
Publication/Patent Number: US6752937B2 Publication Date: 2004-06-22 Application Number: 10/135,955 Filing Date: 2002-04-29 Inventor: Butler, Kurt I.   Assignee: Quantum Composites, Inc.   IPC: H01B120 Abstract: The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising group II oxides, alkaline earth oxides, carbodiamides, polyisocynates, polyethylene and polytetraethylene fluoroethylene. The conductive filler is an inorganic filler which is desirably particulate graphite having a significant distribution of large particles such as for example, 95% in the range of about 150 to about 1000 microns with over about 40%, and more particularly about 50% or even 60% over 200 microns, or over 300 microns, or even over 600 microns. Conductive polymers may be used as a conductivity enhancer with the graphite. In addition, silver coated ceramic fibers can be added to improve the overall electrical properties. Fuel cell plates can be made from these compositions. Fuel cell plates can be made from these compositions. The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising ...More ...Less
11 US2003042468A1
Highly conductive molding compounds for use as fuel cell plates and the resulting products
Publication/Patent Number: US2003042468A1 Publication Date: 2003-03-06 Application Number: 10/108,840 Filing Date: 2002-03-27 Inventor: Butler, Kurt I.   Assignee: QUANTUM COMPOSITES INC.   IPC: H01B001/00 Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by compression and/or injection molding techniques, into highly intricate and thin specimens without significant post machining. and which exhibit consistent conductivity, sufficient strength and flexibility, and appropriate surface characteristics. In particular the invention involves molding resin composition, which have high loadings of conductive fillers. Further the compositions may include rheological modifiers such as Group II oxides and hydroxides; carbodiamides; aziridines; polyisocyanates; polytetrafluorethylene (PTFE); perfluoropolyether (PFPE), and polyethylene. In an additional embodiment of the invention, an anti-shrink additive is added to improve the characteristics of the molded fuel cell plate. A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by ...More ...Less
12 AU2002359682A1
HIGHLY CONDUCTIVE MOLDING COMPOUNDS HAVING AN INCREASED DISTRIBUTION OF LARGE SIZE GRAPHITE PARTICLES
Publication/Patent Number: AU2002359682A1 Publication Date: 2003-06-30 Application Number: 2002359682 Filing Date: 2002-12-12 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES INC.   IPC: C08F283/01
13 AU761468B2
Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
Publication/Patent Number: AU761468B2 Publication Date: 2003-06-05 Application Number: 4012400 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES, INC.   IPC: C08F283/01
14 MXPA01009407A
HIGHLY CONDUCTIVE MOLDING COMPOUNDS AND FUEL CELL BIPOLAR PLATES COMPRISING THESE COMPOUNDS.
Publication/Patent Number: MXPA01009407A Publication Date: 2003-06-06 Application Number: PA01009407 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES, INC.   IPC: C08F283/01 Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from -40 to 140 degrees Fahrenheit and which can be molded into highly intricate and thin specimens which exhibit consistent conductivity A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from -40 to 140 degrees Fahrenheit and which can be molded into highly intricate ...More ...Less
15 WO03051992A1
HIGHLY CONDUCTIVE MOLDING COMPOUNDS HAVING AN INCREASED DISTRIBUTION OF LARGE SIZE GRAPHITE PARTICLES
Publication/Patent Number: WO03051992A1 Publication Date: 2003-06-26 Application Number: 0239728 Filing Date: 2002-12-12 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES INC.   IPC: C08F283/01 Abstract: The invention provides a resin matrix with high loadings of a conductive filler; various additional additives
16 US2003168638A1
Highly conductive molding compounds having an increased distribution of large size graphite particles
Publication/Patent Number: US2003168638A1 Publication Date: 2003-09-11 Application Number: 10/135,955 Filing Date: 2002-04-29 Inventor: Butler, Kurt I.   Assignee: Butler, Kurt I.   IPC: H01B001/00 Abstract: The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising group II oxides, alkaline earth oxides, carbodiamides, polyisocynates, polyethylene and polytetraethylene fluoroethylene. The conductive filler is an inorganic filler which is desirably particulate graphite having a significant distribution of large particles such as for example, 95% in the range of about 150 to about 1000 microns with over about 40%, and more particularly about 50% or even 60% over 200 microns, or over 300 microns, or even over 600 microns. Conductive polymers may be used as a conductivity enhancer with the graphite. In addition, silver coated ceramic fibers can be added to improve the overall electrical properties. Fuel cell plates can be made from these compositions. Fuel cell plates can be made from these compositions. The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising ...More ...Less
17 EP1292439A2
PROCESS OF INJECTION MOLDING HIGHLY CONDUCTIVE RESIN COMPOSITIONS AND APPARATUS FOR THAT
Publication/Patent Number: EP1292439A2 Publication Date: 2003-03-19 Application Number: 01944556.8 Filing Date: 2001-06-14 Inventor: Butler, Kurt I.   Thomas, Daniel G.   Assignee: Quantum Composites, Inc.   IPC: B29C45/00
18 US6436315B2
Highly conductive molding compounds for use as fuel cell plates and the resulting products
Publication/Patent Number: US6436315B2 Publication Date: 2002-08-20 Application Number: 09/849,629 Filing Date: 2001-05-04 Inventor: Butler, Kurt I.   Assignee: Quantum Composites Inc.   IPC: H01B124 Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by compression and/or injection molding techniques, into highly intricate and thin specimens without significant post machining. and which exhibit consistent conductivity, sufficient strength and flexibility, and appropriate surface characteristics. In particular the invention involves molding resin composition, which have high loadings of conductive fillers. Further the compositions may include rheological modifiers such as Group II oxides and hydroxides; carbodiamides; aziridines; polyisocyanates; polytetrafluorethylene (PTFE); perfluoropolyether (PFPE), and polyethylene. In an additional embodiment of the invention, an anti-shrink additive is added to improve the characteristics of the molded fuel cell plate. A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by ...More ...Less
19 EP1171925A1
HIGHLY CONDUCTIVE MOLDING COMPOUNDS AND FUEL CELL BIPOLAR PLATES COMPRISING THESE COMPOUNDS
Publication/Patent Number: EP1171925A1 Publication Date: 2002-01-16 Application Number: 00919431.7 Filing Date: 2000-03-17 Inventor: Butler, Kurt I.   Assignee: Quantum Composites, Inc.   IPC: H01M6/18
20 CZ20013124A3
Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
Publication/Patent Number: CZ20013124A3 Publication Date: 2002-01-16 Application Number: 20013124 Filing Date: 2000-03-17 Inventor: Butler, Kurt I   Assignee: QUANTUM COMPOSITES, INC.   IPC: C08F283/01