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1
US20190027558A1
Publication/Patent Number: US20190027558A1
Publication date: 2019-01-24
Application number: 16/142,869
Filing date: 2018-09-26
Abstract: A method includes forming isolation regions extending from a top surface of a semiconductor substrate into the semiconductor substrate, and forming a hard mask strip over the isolation regions and a semiconductor strip, wherein the semiconductor strip is between two neighboring ones of the isolation regions. A dummy gate strip is formed over the hard mask strip, wherein a lengthwise direction of the dummy gate strip is perpendicular to a lengthwise direction of the semiconductor strip, and wherein a portion of the dummy gate strip is aligned to a portion of the semiconductor strip. The method further includes removing the dummy gate strip, removing the hard mask strip, and recessing first portions of the isolation regions that are overlapped by the removed hard mask strip. A portion of the semiconductor strip between and contacting the removed first portions of the isolation regions forms a semiconductor fin. A method includes forming isolation regions extending from a top surface of a semiconductor substrate into the semiconductor substrate, and forming a hard mask strip over the isolation regions and a semiconductor strip, wherein the semiconductor strip is between two neighboring ...more ...less
2
EP2573708B8
Publication/Patent Number: EP2573708B8
Publication date: 2019-03-20
Application number: 12181018.8
Filing date: 2012-08-20
Abstract: Disclosed are a method and a system for detecting a vehicle position by employing a polarization image. The method comprises a step of capturing a polarization image by using a polarization camera; a step of acquiring two road shoulders in the polarization image based on a difference between a road surface and each of the two road shoulders in the polarization image, and determining a part between the two road shoulders as the road surface; a step of detecting at least one vehicle bottom from the road surface based on a significant pixel value difference between each wheel and the road surface in the polarization image; and a step of generating a vehicle position from the vehicle bottom based on a pixel value difference between a vehicle outline corresponding to the vehicle bottom and background in the polarization image. Disclosed are a method and a system for detecting a vehicle position by employing a polarization image. The method comprises a step of capturing a polarization image by using a polarization camera; a step of acquiring two road shoulders in the polarization image based on a ...more ...less
3
US20190204581A1
Publication/Patent Number: US20190204581A1
Publication date: 2019-07-04
Application number: 16/118,908
Filing date: 2018-08-31
Abstract: The present disclosure provides a pixel structure, a method of driving a pixel structure, an array substrate, and a display device. The pixel structure includes a fixed substrate, an electrically conductive layer at a side of the fixed substrate, a movable shield at another side of the fixed substrate, and an electrically conductive film. The fixed substrate includes a transparent substrate and a dielectric layer. The electrically conductive layer and the dielectric layer are configured to form one or more interference air gaps according to a pixel voltage applied between the electrically conductive layer and the electrically conductive film. The movable shield is configured to change an amount of incident light irradiating the electrically conductive layer. The present disclosure provides a pixel structure, a method of driving a pixel structure, an array substrate, and a display device. The pixel structure includes a fixed substrate, an electrically conductive layer at a side of the fixed substrate, a movable shield at another side ...more ...less
4
US10173407B2
Publication/Patent Number: US10173407B2
Publication date: 2019-01-08
Application number: 15/135,403
Filing date: 2016-04-21
Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole. A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing ...more ...less
5
US20190061332A1
Publication/Patent Number: US20190061332A1
Publication date: 2019-02-28
Application number: 15/956,770
Filing date: 2018-04-19
Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line. A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a ...more ...less
6
US20190057974A1
Publication/Patent Number: US20190057974A1
Publication date: 2019-02-21
Application number: 16/046,852
Filing date: 2018-07-26
Abstract: Embodiments of through array contact structures of a 3D memory device and fabricating method thereof are disclosed. The memory device includes an alternating layer stack disposed on a first substrate. The alternating layer stack includes a first region including an alternating dielectric stack, and a second region including an alternating conductor/dielectric stack. The memory device further includes a barrier structure extending vertically through the alternating layer stack to laterally separate the first region from the second region, multiple through array contacts in the first region, each through array contact extending vertically through the alternating dielectric stack, an array interconnection layer in contact with the through array contacts, a peripheral circuit formed on a second substrate. and a peripheral interconnection layer on the peripheral circuit. The array interconnection layer is bonded on the peripheral interconnection layer, such that the peripheral circuit is electrically connected with at least one through array contact. Embodiments of through array contact structures of a 3D memory device and fabricating method thereof are disclosed. The memory device includes an alternating layer stack disposed on a first substrate. The alternating layer stack includes a first region including an alternating ...more ...less
7
US20190011748A1
Publication/Patent Number: US20190011748A1
Publication date: 2019-01-10
Application number: 15/921,751
Filing date: 2018-03-15
Abstract: A display panel includes an array substrate, and a plurality of display units disposed on the array substrate each of which includes a display sub-pixel for receiving sunlight radiation and performing display, a solar cell disposed adjacent to the display sub-pixel and configured to receive sunlight radiation and perform photoelectric transformation, a micro-electromechanical optical valve disposed above and movable over the display sub-pixel and the solar cell to control a light transmittance of the display sub-pixel, and a blocking structure disposed at an edge of the display unit to limit the movement of the micro-electromechanical optical valve within the display unit. A display panel includes an array substrate, and a plurality of display units disposed on the array substrate each of which includes a display sub-pixel for receiving sunlight radiation and performing display, a solar cell disposed adjacent to the display sub-pixel and ...more ...less
8
US20190123027A1
Publication/Patent Number: US20190123027A1
Publication date: 2019-04-25
Application number: 16/221,790
Filing date: 2018-12-17
Abstract: Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs. Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to ...more ...less
9
US20190139845A1
Publication/Patent Number: US20190139845A1
Publication date: 2019-05-09
Application number: 15/874,890
Filing date: 2018-01-19
Abstract: A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove. A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein ...more ...less
10
US20190131254A1
Publication/Patent Number: US20190131254A1
Publication date: 2019-05-02
Application number: 16/233,667
Filing date: 2018-12-27
Abstract: A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate. A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A ...more ...less
11
US10170434B2
Publication/Patent Number: US10170434B2
Publication date: 2019-01-01
Application number: 15/948,247
Filing date: 2018-04-09
Abstract: A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate. A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A ...more ...less
12
US10325853B2
Publication/Patent Number: US10325853B2
Publication date: 2019-06-18
Application number: 14/696,198
Filing date: 2015-04-24
Abstract: A semiconductor device and method for forming the semiconductor device is provided. The semiconductor device includes an integrated circuit having through vias adjacent to the integrated circuit die, wherein a molding compound is interposed between the integrated circuit die and the through vias. The through vias have a projection extending through a patterned layer, and the through vias may be offset from a surface of the patterned layer. The recess may be formed by selectively removing a seed layer used to form the through vias. A semiconductor device and method for forming the semiconductor device is provided. The semiconductor device includes an integrated circuit having through vias adjacent to the integrated circuit die, wherein a molding compound is interposed between the integrated circuit die and ...more ...less
13
US20190050470A1
Publication/Patent Number: US20190050470A1
Publication date: 2019-02-14
Application number: 16/159,054
Filing date: 2018-10-12
Abstract: A system, method and computer program product configured for processing database data in a distributed database system, wherein the distributed database system comprises a plurality of computing nodes communicatively coupled via computer networks, the method comprising: creating a plurality of different data replicas wherein each of the data replicas is created in the following way: sorting the database data according to at least one data attribute; generating a row key based on the at least one data attribute; and using the sorted database data with the row key as the data replica, storing different data replicas in different computing nodes; and creating an index for each of the data replicas according to its row key. A system, method and computer program product configured for processing database data in a distributed database system, wherein the distributed database system comprises a plurality of computing nodes communicatively coupled via computer networks, the method comprising: creating ...more ...less
14
US10269798B2
Publication/Patent Number: US10269798B2
Publication date: 2019-04-23
Application number: 16/036,888
Filing date: 2018-07-16
Abstract: In a method of manufacturing a semiconductor device, a separation wall made of a dielectric material is formed between two fin structures. A dummy gate structure is formed over the separation wall and the two fin structures. An interlayer dielectric (ILD) layer is formed over the dummy gate structure. An upper portion of the ILD layer is removed, thereby exposing the dummy gate structure. The dummy gate structure is replaced with a metal gate structure. A planarization operation is performed to expose the separation wall, thereby dividing the metal gate structure into a first gate structure and a second gate structure. The first gate structure and the second gate structure are separated by the separation wall. In a method of manufacturing a semiconductor device, a separation wall made of a dielectric material is formed between two fin structures. A dummy gate structure is formed over the separation wall and the two fin structures. An interlayer dielectric (ILD) layer is formed over ...more ...less