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1
US10264665B2
Publication/Patent Number: US10264665B2
Publication date: 2019-04-16
Application number: 15/835,557
Filing date: 2017-12-08
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s). Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external ...more ...less
2
US10306753B1
Publication/Patent Number: US10306753B1
Publication date: 2019-05-28
Application number: 15/901,985
Filing date: 2018-02-22
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s). Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure ...more ...less
3
US10327329B2
Publication/Patent Number: US10327329B2
Publication date: 2019-06-18
Application number: 15/430,842
Filing date: 2017-02-13
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, an in-situ-formed tamper-detect sensor, and one or more flexible tamper-detect sensors. The enclosure encloses, at least in part, one or more electronic components to be protected, and the in-situ-formed tamper-detect sensor is formed in place over an inner surface of the enclosure. The flexible tamper-detect sensor(s) is disposed over the in-situ-formed tamper-detect sensor, such that the in-situ-formed tamper-detect sensor is between the inner surface of the enclosure and the flexible tamper-detect sensor(s). Together the in-situ-formed tamper-detect sensor and flexible tamper-detect sensor(s) facilitate defining, at least in part, a secure volume about the one or more electronic components. Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, an in-situ-formed tamper-detect sensor, and one or more flexible tamper-detect sensors. The enclosure encloses, at least in part, one or more electronic components to be protected ...more ...less
4
US10172232B2
Publication/Patent Number: US10172232B2
Publication date: 2019-01-01
Application number: 15/827,275
Filing date: 2017-11-30
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure. Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one ...more ...less
5
US10257924B2
Publication/Patent Number: US10257924B2
Publication date: 2019-04-09
Application number: 15/831,534
Filing date: 2017-12-05
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event. Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a ...more ...less
6
US10203220B2
Publication/Patent Number: US10203220B2
Publication date: 2019-02-12
Application number: 15/480,089
Filing date: 2017-04-05
Abstract: An interactive system for use in connection with recreational vehicle usage includes a server system, including an off-road trail database containing trail data, trail condition information, and points-of-interest information, as well as a trip mapping system accessible by any of a plurality of riders, allowing a rider to create a route based on the data in the off-road trip database. The server system further includes a trail maintenance interface accessible by users affiliated with an authorized group to edit the trail data, trail condition information, and points-of-interest information associated with the authorized group. The server system includes a location data management system configured to receive location data, allowing a rider to publish location information to one or more other riders, and a user feedback interface configured to receive trip data from riders for publication, including information describing an actual route and user data associated with that route. An interactive system for use in connection with recreational vehicle usage includes a server system, including an off-road trail database containing trail data, trail condition information, and points-of-interest information, as well as a trip mapping system accessible by any ...more ...less
7
US10038300B2
Publication/Patent Number: US10038300B2
Publication date: 2018-07-31
Application number: 15/019,611
Filing date: 2016-02-09
Abstract: Schemes are described to produce quasi-static charge separation, Terahertz radiation, and programmable magnetic field generation using linearly-polarized light in unbiased, transparent insulators. The methods exploit a recently-observed magneto-electric optical nonlinearity that produces intense magnetization in undoped, homogeneous dielectrics. Analysis reveals that strong magnetic effects can be induced at modest optical intensities even with incoherent light. Consequently, efficient solar power conversion is feasible without the semiconductor processing or electron-hole pair generation that is required in conventional photovoltaic cells. Additionally, conditions and techniques are described to generate intense THz radiation in unbiased substrates and large magnetic fields orientated transverse to the direction of propagation of light, without the need for any external permanent magnetic or electromagnetic apparatus. Schemes are described to produce quasi-static charge separation, Terahertz radiation, and programmable magnetic field generation using linearly-polarized light in unbiased, transparent insulators. The methods exploit a recently-observed magneto-electric optical nonlinearity that ...more ...less
8
US9894749B2
Publication/Patent Number: US9894749B2
Publication date: 2018-02-13
Application number: 14/865,708
Filing date: 2015-09-25
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s). Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external ...more ...less