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1
US20190204379A1
Publication/Patent Number: US20190204379A1
Publication date: 2019-07-04
Application number: 15/862,172
Filing date: 2018-01-04
Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes. An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test ...more ...less
2
US20190206750A1
Publication/Patent Number: US20190206750A1
Publication date: 2019-07-04
Application number: 15/862,218
Filing date: 2018-01-04
Abstract: A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe holes having a uniform cross-sectional dimension, and a plurality of probes respectively received in the probe holes and extending respectively in the probe holes along axes of the probe holes; and electrically connecting the contact electrodes to the probes. A distance between the axes of two adjacent ones of the probe holes is equal to a smallest spacing between two adjacent ones of the contact electrodes and is not greater than 0.5 mm. A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe ...more ...less
3
US10224245B2
Publication/Patent Number: US10224245B2
Publication date: 2019-03-05
Application number: 15/076,762
Filing date: 2016-03-22
Abstract: A method includes forming first and second fins of a finFET extending above a semiconductor substrate, with a shallow trench isolation (STI) region in between, and a distance between a top surface of the STI region and top surfaces of the first and second fins. First and second fin extensions are provided on top and side surfaces of the first and second fins above the top surface of the STI region. Material is removed from the STI region, to increase the distance between the top surface of the STI region and top surfaces of the first and second fins. A conformal stressor dielectric material is deposited over the fins and STI region. The conformal dielectric stressor material is reflowed, to flow into a space between the first and second fins above a top surface of the STI region, to apply stress to a channel of the finFET. A method includes forming first and second fins of a finFET extending above a semiconductor substrate, with a shallow trench isolation (STI) region in between, and a distance between a top surface of the STI region and top surfaces of the first and second fins. First and second ...more ...less
4
US20190181048A1
Publication/Patent Number: US20190181048A1
Publication date: 2019-06-13
Application number: 16/271,522
Filing date: 2019-02-08
Abstract: A method includes forming first and second fins of a finFET extending above a semiconductor substrate, with a shallow trench isolation (STI) region in between, and a distance between a top surface of the STI region and top surfaces of the first and second fins. First and second fin extensions are provided on top and side surfaces of the first and second fins above the top surface of the STI region. Material is removed from the STI region, to increase the distance between the top surface of the STI region and top surfaces of the first and second fins. A conformal stressor dielectric material is deposited over the fins and STI region. The conformal dielectric stressor material is reflowed, to flow into a space between the first and second fins above a top surface of the STI region, to apply stress to a channel of the finFET. A method includes forming first and second fins of a finFET extending above a semiconductor substrate, with a shallow trench isolation (STI) region in between, and a distance between a top surface of the STI region and top surfaces of the first and second fins. First and second ...more ...less
6
US10191614B2
Publication/Patent Number: US10191614B2
Publication date: 2019-01-29
Application number: 15/051,635
Filing date: 2016-02-23
Abstract: A panel displaying method for an electronic device is provided. The electronic device includes a display module and has a plurality of first icons corresponding to a plurality of objects. The panel displaying method includes: determining an environment of the electronic device; automatically choosing an operation mode based on the environment of the electronic device. The operation mode is displayed in a widget area of a first panel and includes at least one widget icon. A portion of the first icons is chosen and updated as the widget icon based on numbers of clicks of the first icons in the chosen operation mode. Moreover, a portable electronic device and a recording medium using the method are also provided. A panel displaying method for an electronic device is provided. The electronic device includes a display module and has a plurality of first icons corresponding to a plurality of objects. The panel displaying method includes: determining an environment of the electronic device; ...more ...less
7
US20190017802A1
Publication/Patent Number: US20190017802A1
Publication date: 2019-01-17
Application number: 15/811,285
Filing date: 2017-11-13
Abstract: An optical sensing device for a wheel set is provided. The optical sensing device comprises a first grating, a second grating, an elastic object and two optical sensors. The first grating is set in a first wheel of the wheel set. The second grating is set in a second wheel of the wheel set. The elastic object is connected between the first wheel and the second wheel, and is adapted to sustain a force applied when an angle difference is formed by a rotation of the second wheel with respect to the first wheel. The two optical sensors are set in a power module of the wheel set and provided respectively in correspondence to the first and the second gratings. The two optical sensors receive two optical signals reflected by the first and the second gratings, and the two optical sensors are used to calculate the angle difference. An optical sensing device for a wheel set is provided. The optical sensing device comprises a first grating, a second grating, an elastic object and two optical sensors. The first grating is set in a first wheel of the wheel set. The second grating is set in a second wheel of ...more ...less
8
US20190018222A1
Publication/Patent Number: US20190018222A1
Publication date: 2019-01-17
Application number: 16/044,254
Filing date: 2018-07-24
Abstract: An optical system includes a fixed module, a movable module and a driving assembly. The movable module moves relative to the fixed module, and the movable module includes a lens unit which includes a first lens, a second lens, a first side wall and a second side wall. The first side wall has a first surface, which directly contacts the second lens, and the second side wall directly contacts the first lens. A portion of the driving assembly is directly disposed on the lens unit, configured to drive the lens unit to move along an optical axis of the first lens. The first side wall further has a second surface opposite to the first surface, and the second surface directly contacts the portion of the driving assembly. The thickness of the first side wall is different from the thickness of the second side wall. An optical system includes a fixed module, a movable module and a driving assembly. The movable module moves relative to the fixed module, and the movable module includes a lens unit which includes a first lens, a second lens, a first side wall and a second side wall. The first ...more ...less
9
US20190081047A1
Publication/Patent Number: US20190081047A1
Publication date: 2019-03-14
Application number: 16/052,636
Filing date: 2018-08-02
Abstract: A semiconductor device and method of manufacturing the same is provided in the present invention. The method includes the step of forming first mask patterns on a substrate, wherein the first mask patterns extend in a second direction and are spaced apart in a first direction to expose a portion of first insulating layer, removing the exposed first insulating layer to form multiple recesses in the first insulating layer, performing a surface treatment to the recess surface, filling up the recesses with a second insulating layer and exposing a portion of the first insulating layer, removing the exposed first insulating layer to form a mesh-type isolation structure, and forming storage node contact plugs in the openings of mesh-type isolation structure. A semiconductor device and method of manufacturing the same is provided in the present invention. The method includes the step of forming first mask patterns on a substrate, wherein the first mask patterns extend in a second direction and are spaced apart in a first direction to ...more ...less
10
US20190080890A1
Publication/Patent Number: US20190080890A1
Publication date: 2019-03-14
Application number: 15/855,221
Filing date: 2017-12-27
Abstract: A vacuum deposition composite target includes a plurality of target blocks each including a target body, an insulating layer and a high-resistance-conductive layer. The target body has a top surface, a bottom surface and a peripheral surface connected between the top and bottom surfaces. The insulating layer is formed on the peripheral surface. The high-resistance-conductive layer is formed on the bottom surface of the target body and has a resistance higher than that of the target body. The target blocks are juxtaposed to each other. Each of the target blocks has a modulated resistance. A modulated resistance difference between any two adjacent ones of the target blocks is not greater than 5%. A vacuum deposition composite target includes a plurality of target blocks each including a target body, an insulating layer and a high-resistance-conductive layer. The target body has a top surface, a bottom surface and a peripheral surface connected between the top and bottom ...more ...less
11
US20190088582A1
Publication/Patent Number: US20190088582A1
Publication date: 2019-03-21
Application number: 15/707,301
Filing date: 2017-09-18
Abstract: A semiconductor device includes a dielectric interposer, a first interconnection layer, an electronic component, a plurality of electrical conductors and a plurality of conductive structures. The dielectric interposer has a first surface and a second surface opposite to the first surface. The first interconnection layer is over the first surface of the dielectric interposer. The electronic component is over and electrically connected to the first interconnection layer. The electrical conductors are over the second surface of the dielectric interposer. The conductive structures are through the dielectric interposer, wherein the conductive structures are electrically connected to the first interconnection layer and the electrical conductors. A semiconductor device includes a dielectric interposer, a first interconnection layer, an electronic component, a plurality of electrical conductors and a plurality of conductive structures. The dielectric interposer has a first surface and a second surface opposite to the ...more ...less
12
EP3432130A1
Publication/Patent Number: EP3432130A1
Publication date: 2019-01-23
Application number: 18187190.6
Filing date: 2017-09-08
Abstract: A portable electronic device, an operating method for the same, and a non-transitory computer readable recording medium are provided. The portable electronic device includes a body, a touch display screen and an edge sensor. The touch display screen is disposed on the body. The edge sensor is disposed adjacent to an edge of the body. The operating method includes the following step. When an event is generated according to a first action sensed by the edge sensor, a touch function of a region of the touch display screen or the whole touch display screen is disabled. A portable electronic device, an operating method for the same, and a non-transitory computer readable recording medium are provided. The portable electronic device includes a body, a touch display screen and an edge sensor. The touch display screen is disposed on the body. The ...more ...less
13
US20190066988A1
Publication/Patent Number: US20190066988A1
Publication date: 2019-02-28
Application number: 15/940,609
Filing date: 2018-03-29
Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution. A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality ...more ...less
14
US10332889B2
Publication/Patent Number: US10332889B2
Publication date: 2019-06-25
Application number: 15/951,194
Filing date: 2018-04-12
Abstract: A method of manufacturing a semiconductor device is provided, which includes the steps of providing a capacitor structure, forming a conductive layer on the capacitor structure, performing a hydrogen doping process to the conductive layer, forming a metal layer on the conductive layer after the hydrogen doping process, and patterning the metal layer and the conductive layer to forma top electrode plate. A method of manufacturing a semiconductor device is provided, which includes the steps of providing a capacitor structure, forming a conductive layer on the capacitor structure, performing a hydrogen doping process to the conductive layer, forming a metal layer on the conductive ...more ...less
15
US20190198483A1
Publication/Patent Number: US20190198483A1
Publication date: 2019-06-27
Application number: 15/935,069
Filing date: 2018-03-26
Abstract: A display device including a circuit substrate, a plurality of pixels, and a light-shielding layer is provided. The pixels include a plurality of light-emitting elements. The light-emitting elements are disposed on the circuit substrate and are electrically connected to the circuit substrate. The light-emitting elements in the pixels are arranged along an arrangement direction. The light-shielding layer is disposed on the circuit substrate and has a plurality of pixel apertures. The pixels are disposed in a corresponding pixel aperture. The light-shielding layer includes a plurality of first light-shielding patterns extending in the arrangement direction and a plurality of second light-shielding patterns connected to the first light-shielding patterns. The extending direction of the second light-shielding patterns is different from the extending direction of the first light-shielding patterns. A thickness of the first light-shielding patterns is greater than or substantially equal to a thickness of the second light-shielding patterns. A display device including a circuit substrate, a plurality of pixels, and a light-shielding layer is provided. The pixels include a plurality of light-emitting elements. The light-emitting elements are disposed on the circuit substrate and are electrically connected to the ...more ...less