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1
US10297516B2
Publication/Patent Number: US10297516B2
Publication date: 2019-05-21
Application number: 15/746,013
Filing date: 2017-03-01
Abstract: A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin covers the semiconductor element and the base, and is fixed to the base by filling the groove. A bottom of the groove includes a first recess-projection having a first amplitude and a first repetition interval along an extending direction of the groove. The first recess-projection includes a second recess-projection having a second amplitude smaller than the first amplitude and a second repetition interval shorter than the first repetition interval along the extending direction of the groove. A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin ...more ...less
2
CN107924884A
Publication/Patent Number: CN107924884A
Publication date: 2018-04-17
Application number: 201780002789
Filing date: 2017-03-01
Abstract: A semiconductor device (6) is provided with a semiconductor element (7), a base (8), and a sheathing resin (10). The base (8) has a mounting surface (8A) on which the semiconductor element (7) is mounted, and grooves (9) provided around the semiconductor element (7) on the mounting surface (8A). The sheathing resin (10) covers the semiconductor element (7) and the base (8), and fills the grooves (9) so as to be fixed to the base (8). The bottoms (11) of the grooves (9) include first recesses and projections along the extension direction of the grooves (9), said first recesses and projections having a first amplitude and a first repeating interval. The first recesses and projections include second recesses and projections along the extension direction of the grooves (9), said second recesses and projections having a second amplitude that is smaller than the first amplitude, and a second repeating interval that is shorter than the first repeating interval. A semiconductor device (6) is provided with a semiconductor element (7), a base (8), and a sheathing resin (10). The base (8) has a mounting surface (8A) on which the semiconductor element (7) is mounted, and grooves (9) provided around the semiconductor element (7) on the ...more ...less
3
US2018197802A1
Publication/Patent Number: US2018197802A1
Publication date: 2018-07-12
Application number: 15/746,013
Filing date: 2017-03-01
Abstract: A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin covers the semiconductor element and the base, and is fixed to the base by filling the groove. A bottom of the groove includes a first recess-projection having a first amplitude and a first repetition interval along an extending direction of the groove. The first recess-projection includes a second recess-projection having a second amplitude smaller than the first amplitude and a second repetition interval shorter than the first repetition interval along the extending direction of the groove. A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin ...more ...less
4
JP2017171408A
Publication/Patent Number: JP2017171408A
Publication date: 2017-09-28
Application number: 2016056074
Filing date: 2016-03-18
Abstract: PROBLEM TO BE SOLVED: To provide a ladle turning apparatus
5
JP6135888B2
Publication/Patent Number: JP6135888B2
Publication date: 2017-05-31
Application number: 2016116393
Filing date: 2016-06-10
Abstract: PROBLEM TO BE SOLVED: To provide a high-voltage chip mounting base plate made of a metal as major material capable of improving the withstand voltage.SOLUTION: A base plate is prepared by previously forming a slit between mounting areas 34 and by generating an oxide film 36 thereon including the side faces. With this PROBLEM TO BE SOLVED: To provide a high-voltage chip mounting base plate made of a metal as major material capable of improving the withstand voltage.SOLUTION: A base plate is prepared by previously forming a slit between mounting areas 34 and by generating an oxide film 36 ...more ...less
6
WO2017169485A1
Publication/Patent Number: WO2017169485A1
Publication date: 2017-10-05
Application number: 2017008069
Filing date: 2017-03-01
Abstract: A semiconductor device (6) is provided with a semiconductor element (7)
7
US9271389B2
Publication/Patent Number: US9271389B2
Publication date: 2016-02-23
Application number: 14/089,523
Filing date: 2013-11-25
Abstract: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device. A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating ...more ...less
8
US9307630B2
Publication/Patent Number: US9307630B2
Publication date: 2016-04-05
Application number: 13/768,777
Filing date: 2013-02-15
Abstract: A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions. A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the ...more ...less
9
JP5847745B2
Publication/Patent Number: JP5847745B2
Publication date: 2016-01-27
Application number: 2013036260
Filing date: 2013-02-26
Assignee: TOSHIBA CORP
Abstract: PROBLEM TO BE SOLVED: To provide an ion implanter which allows for precise determination whether or not the electrons are supplied from a plasma generation unit to a substrate normally
10
JP2016195261A
Publication/Patent Number: JP2016195261A
Publication date: 2016-11-17
Application number: 2016116393
Filing date: 2016-06-10
Abstract: PROBLEM TO BE SOLVED: To provide a high-voltage chip mounting base plate made of a metal as major material capable of improving the withstand voltage.SOLUTION: A base plate is prepared by previously forming a slit between mounting areas 34 and by generating an oxide film 36 thereon including the side faces. With this PROBLEM TO BE SOLVED: To provide a high-voltage chip mounting base plate made of a metal as major material capable of improving the withstand voltage.SOLUTION: A base plate is prepared by previously forming a slit between mounting areas 34 and by generating an oxide film 36 ...more ...less
11
US9269540B2
Publication/Patent Number: US9269540B2
Publication date: 2016-02-23
Application number: 14/024,175
Filing date: 2013-09-11
Abstract: An ion implantation apparatus according to an embodiment includes an ion implantation unit, a position detection unit, a charge supply unit, a current value detection unit, and a determination unit. The ion implantation unit scans the surface of a substrate with an ion beam containing positively charged ions and implants the ions into the substrate. The position detection unit detects the scan position of the ion beam on the substrate. The charge supply unit generates a plasma, emits electrons contained in the plasma, and supplies the electrons to the substrate. The current value detection unit detects a current value that changes in accordance with the amount of electrons emitted by the charge supply unit. The determination unit determines the charge build-up state of the substrate based on a change in the current value, the change being accompanied by a change in the scan position. An ion implantation apparatus according to an embodiment includes an ion implantation unit, a position detection unit, a charge supply unit, a current value detection unit, and a determination unit. The ion implantation unit scans the surface of a substrate with an ion beam ...more ...less
12
JP2016029478A
Publication/Patent Number: JP2016029478A
Publication date: 2016-03-03
Application number: 2015143813
Filing date: 2015-07-21
Abstract: PROBLEM TO BE SOLVED: To provide a composition capable of forming a rugged structure without the needs of: the employment of conventional methods for forming rugged structures such as etching
13
US9035454B2
Publication/Patent Number: US9035454B2
Publication date: 2015-05-19
Application number: 14/092,320
Filing date: 2013-11-27
Abstract: Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material. Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie ...more ...less
14
US9024446B2
Publication/Patent Number: US9024446B2
Publication date: 2015-05-05
Application number: 13/381,299
Filing date: 2010-06-30
Abstract: Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics. Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal ...more ...less
15
JP5483712B2
Publication/Patent Number: JP5483712B2
Publication date: 2014-05-07
Application number: 2010094464
Filing date: 2010-03-30
Abstract: PROBLEM TO BE SOLVED: To provide an inline type viscosity sensor for heavy fuel oil for ships
16
US2014078687A1
Publication/Patent Number: US2014078687A1
Publication date: 2014-03-20
Application number: 14/089,523
Filing date: 2013-11-25
Abstract: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device. A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating ...more ...less
17
JP2014116328A
Publication/Patent Number: JP2014116328A
Publication date: 2014-06-26
Application number: 2011080205
Filing date: 2011-03-31
Abstract: PROBLEM TO BE SOLVED: To provide a technology which achieves dielectric voltage performance and heat radiation performance of a component which generates heat by an electric current flowing therethrough during use.SOLUTION: An element mounting substrate 40 includes: a heat radiation substrate 10 which is formed by a material including at least one metal selected from a group composed of Al PROBLEM TO BE SOLVED: To provide a technology which achieves dielectric voltage performance and heat radiation performance of a component which generates heat by an electric current flowing therethrough during use.SOLUTION: An element mounting substrate 40 includes: a heat ...more ...less
18
US2014008679A1
Publication/Patent Number: US2014008679A1
Publication date: 2014-01-09
Application number: 13/781,611
Filing date: 2013-02-28
Abstract: An opening is provided corresponding to an installation area of a semiconductor element in an insulating resin layer for a base material. A first insulating resin layer is provided on a part of one main surface of the insulating resin layer outside the opening to surround the opening. In addition, a second insulating resin layer coats in a continuous manner: the edge portion of the opening on the one main surface of the insulating resin layer; the end face of the opening passing through the insulating resin layer; and the edge portion of the opening on the other main surface of the insulating resin layer. The upper end portion of the end face of the second insulating resin layer in contact with the one main surface of the insulating resin layer protrudes toward the first insulating resin layer. An opening is provided corresponding to an installation area of a semiconductor element in an insulating resin layer for a base material. A first insulating resin layer is provided on a part of one main surface of the insulating resin layer outside the opening to surround the ...more ...less
19
US2014084452A1
Publication/Patent Number: US2014084452A1
Publication date: 2014-03-27
Application number: 14/092,320
Filing date: 2013-11-27
Abstract: Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material. Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie ...more ...less
20
JP2014165076A
Publication/Patent Number: JP2014165076A
Publication date: 2014-09-08
Application number: 2013036260
Filing date: 2013-02-26
Assignee: TOSHIBA CORP
Abstract: PROBLEM TO BE SOLVED: To provide an ion implanter which allows for precise determination whether or not the electrons are supplied from a plasma generation unit to a substrate normally