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1
US20190053355A1
Publication/Patent Number: US20190053355A1
Publication date: 2019-02-14
Application number: 16/053,034
Filing date: 2018-08-02
Abstract: Lighting system includes luminaires and operating device that associates identification information held by each of the luminaires with layout information of the luminaires. The operating device includes a display that displays, based on the layout information, marks each corresponding to one of the luminaires and a mark group including, among the marks, at least two marks corresponding one-to-one to at least two luminaires among the luminaires. The mark group is displayed in a distinguishable manner from one or more marks not included in the mark group. Lighting system includes luminaires and operating device that associates identification information held by each of the luminaires with layout information of the luminaires. The operating device includes a display that displays, based on the layout information, marks each ...more ...less
2
US20190041470A1
Publication/Patent Number: US20190041470A1
Publication date: 2019-02-07
Application number: 16/043,396
Filing date: 2018-07-24
Abstract: [Object] Provided is a magnetic sensor testing device capable of preventing performance of an electromagnet from greatly changing due to heat applied to a magnetic sensor. [Solving Means] A magnetic sensor testing device includes electromagnets 50 and 60 that apply a magnetic field to a magnetic sensor, temperature regulators 30 and 40 that regulate a temperature of the magnetic sensor by locally applying heat to the magnetic sensor, and a controller that controls the electromagnets 50 and 60 and the temperature regulators 30 and 40, in which the controller tests the magnetic sensor in a state in which the magnetic field is applied to the magnetic sensor by the electromagnets 50 and 60 while the heat is applied to the magnetic sensor by the temperature regulators 30 and 40. [Object] Provided is a magnetic sensor testing device capable of preventing performance of an electromagnet from greatly changing due to heat applied to a magnetic sensor. [Solving Means] A magnetic sensor testing device includes electromagnets 50 and 60 that apply a magnetic ...more ...less
3
US10257928B2
Publication/Patent Number: US10257928B2
Publication date: 2019-04-09
Application number: 15/472,684
Filing date: 2017-03-29
Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties. Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or ...more ...less
4
US10195626B2
Publication/Patent Number: US10195626B2
Publication date: 2019-02-05
Application number: 15/522,415
Filing date: 2015-11-11
Abstract: A trigger-type liquid dispenser that, even when lateral force is applied to a trigger, prevents liquid leakage. The trigger-type liquid dispenser includes a pump, which includes: a cylinder, which includes an inner tubular wall and an outer tubular wall; a piston, which has a front-side end portion; a front-side sealing piece and a rear-side sealing piece; an outer-circumferential-side support portion; and an inner-circumferential-side support portion. The outer-circumferential-side support portion is provided with an annular cut-off portion, which forms a gap between the outer-circumferential-side support portion and an outer circumferential surface of the piston. A trigger-type liquid dispenser that, even when lateral force is applied to a trigger, prevents liquid leakage. The trigger-type liquid dispenser includes a pump, which includes: a cylinder, which includes an inner tubular wall and an outer tubular wall; a piston, which has a ...more ...less
5
US20190200455A1
Publication/Patent Number: US20190200455A1
Publication date: 2019-06-27
Application number: 16/286,237
Filing date: 2019-02-26
Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties. Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or ...more ...less
6
EP3112286B1
Publication/Patent Number: EP3112286B1
Publication date: 2019-04-24
Application number: 15754873.6
Filing date: 2015-02-25
7
US20190196704A1
Publication/Patent Number: US20190196704A1
Publication date: 2019-06-27
Application number: 16/224,453
Filing date: 2018-12-18
Abstract: A setting device includes: a communication circuit which communicates with a target lighting fixture in which a communication configuration is to be set up among lighting fixtures; a display which displays layout information of the lighting fixtures; a detector which detects a direction of movement of the setting device inside of a building, and an amount of the movement of the setting device; and a controller which causes the display to display, on the layout information, a position of the setting device derived based on the direction and the amount of the movement of the setting device. The controller determines whether the position of the setting device is within a predefined area, based on a location of the target lighting fixture, and sets up the communication configuration in the target lighting fixture via the communication circuit when the position of the setting device is within the predefined area. A setting device includes: a communication circuit which communicates with a target lighting fixture in which a communication configuration is to be set up among lighting fixtures; a display which displays layout information of the lighting fixtures; a detector which detects a ...more ...less
8
US20190045347A1
Publication/Patent Number: US20190045347A1
Publication date: 2019-02-07
Application number: 16/039,390
Filing date: 2018-07-19
Abstract: Luminaires in a lighting system have mutually different addresses. A setting device includes a communication unit that transmits an address request signal at a first transmission power level and a control unit that determines whether a total number of the addresses transmitted from one or more of the luminaires in response to receiving the address request signal is within a target range. The control unit instructs the communication unit to transmit the address request signal at a transmission power level different from the first transmission power level when the total number of the addresses is outside the target range, and executes pairing of the one or more of the luminaires that responded to the address request signal with a wireless controller when the total number of the addresses is within the target range. Luminaires in a lighting system have mutually different addresses. A setting device includes a communication unit that transmits an address request signal at a first transmission power level and a control unit that determines whether a total number of the addresses transmitted ...more ...less
9
US10174787B2
Publication/Patent Number: US10174787B2
Publication date: 2019-01-08
Application number: 15/560,051
Filing date: 2016-03-10
Assignee: THK CO., LTD.
Abstract: A motion guide apparatus ensures that a retaining portion retains a rolling element. A rolling element retainer having retaining portions that prevent a rolling element from falling out of a movable body, the retaining portions extending along a loaded rolling element rolling portion, is incorporated in the movable body of the motion guide apparatus. End plates are formed integrally with the retaining portions. Fall prevention portions to reduce the widths of openings between the retaining portions are provided to center parts of the retaining portions in a length direction thereof. The fall prevention portions are padding portions integrated with the retaining portions, the padding portions rising in such a manner as to reduce the widths of the openings, and/or projections integrated with the retaining portions, the projections touching the movable body in such a manner that the center parts of the retaining portions bend toward a track member. A motion guide apparatus ensures that a retaining portion retains a rolling element. A rolling element retainer having retaining portions that prevent a rolling element from falling out of a movable body, the retaining portions extending along a loaded rolling element rolling ...more ...less
10
TW201805325A
Publication/Patent Number: TW201805325A
Publication date: 2018-02-16
Application number: 106109571
Filing date: 2017-03-22
Inventor: Nakamura, Shigeo  
Abstract: To provide a thermosetting resin that offers an insulating layer being bendable and having excellent dimensional accuracy and reflow resistance in the production of a wiring board comprising an embedded wire layer. A thermosetting resin comprises (a) epoxy resin, (b) a compound having an optionally hydrogenated butadiene structure and a phenolic hydroxyl group, (c) phenoxy resin, and (d) inorganic filler. A part or all of the (a) epoxy resin and/or (c) phenoxy resin is a compound having a flexible structure selected from a C2 to 20 alkylene structure and a C2 to 20 alkylene structure having an ether linkage. The (d) inorganic filler is 30 mass% or more when a nonvolatile component of the resin composition is 100 mass%. The elastic modulus, breaking strength, and fracture elongation of the cured product at 23 DEG C are 1 Gpa or more and 6 Gpa or less, 10 Mpa or more, and 6% or more, respectively. To provide a thermosetting resin that offers an insulating layer being bendable and having excellent dimensional accuracy and reflow resistance in the production of a wiring board comprising an embedded wire layer. A thermosetting resin comprises (a) epoxy resin, (b) a compound ...more ...less
11
KR101816503B1
Publication/Patent Number: KR101816503B1
Publication date: 2018-01-09
Application number: 20100126804
Filing date: 2010-12-13
Inventor: Nakamura, Shigeo  
Abstract: PURPOSE: A resin composition is provided to form a plated conductor layer having a sufficient peel strength in a wet roughing step and to ensure excellent dielectric characteristics and coefficient of thermal expansion. CONSTITUTION: A resin composition comprises (A) a cyanate ester resin and (B) a naphthylene ether type epoxy resin. When a non-volatile matter content in the resin composition is defined as 100% by mass PURPOSE: A resin composition is provided to form a plated conductor layer having a sufficient peel strength in a wet roughing step and to ensure excellent dielectric characteristics and coefficient of thermal expansion. CONSTITUTION: A resin composition comprises (A) a cyanate ...more ...less
12
JP2018002886A
Publication/Patent Number: JP2018002886A
Publication date: 2018-01-11
Application number: 2016131902
Filing date: 2016-07-01
Inventor: Nakamura, Shigeo  
Abstract: 【課題】難燃性、導体層とのピール強度及びリフロー耐性に優れる絶縁層が得られる樹脂組成物;それを用いた樹脂シート、回路基板、半導体チップパッケージ、及び半導体装置の提供。【解決手段】(a)(i)水素添加されていてもよいブタジエン構造単位、並びに(ii)ビフェニレン型フェノール構造単位及びナフトールアラルキル構造単位からなる群から選択される1種以上の構造単位を有する化合物、(b)1分子中に、2以上のエポキシ基及び1以上の芳香環を有するエポキシ樹脂、並びに(c)無機充填材を含む樹脂組成物であって、(c)無機充填材が、樹脂組成物の不揮発成分を100質量%とした場合、30質量%以上である、樹脂組成物。【選択図】なし 【課題】難燃性、導体層とのピール強度及びリフロー耐性に優れる絶縁層が得られる樹脂組成物;それを用いた樹脂シート、回路基板、半導体チップパッケージ、及び半導体装置の提供。【解決手段】(a)(i)水素添加されていてもよいブタジエン構造単位、並びに(ii)ビフェニレン型フェノール構造単位及びナフトールアラルキル構造単位からなる群から選択される1種以上の構造単位を有する化合物、(b)1分子中に、2以上のエポキシ基及び1以上の芳香環を有するエポキシ樹脂、並びに(c)無機充填材を含む樹脂組成物であって、(c)無機充填材が、樹脂組成物の不揮発成分を100質量%とした場 ...more ...less
13
KR20180004014A
Publication/Patent Number: KR20180004014A
Publication date: 2018-01-10
Application number: 20170082081
Filing date: 2017-06-28
Inventor: Nakamura, Shigeo  
Abstract: [과제] 난연성
14
JP2018056572A
Publication/Patent Number: JP2018056572A
Publication date: 2018-04-05
Application number: 2017211578
Filing date: 2017-11-01
Abstract: PROBLEM TO BE SOLVED: To provide sheet material capable of forming on a glass substrate a conductive layer with a method that is versatile and cost-effective and particularly suitable for being used as a core substrate of a multilayer printed wiring board.SOLUTION: Sheet material includes on both surfaces of a glass substrate a thermosetting resin composition layer having, as essential components, epoxy resin, a hardening agent, and surface-treated silica processed with and a silane compound. An absolute value of difference between a linear thermal expansion coefficient (C1) of the glass substrate at 25 to 150°C and a linear thermal expansion coefficient (C2) of a cured object of the thermosetting resin composition layer at 25 to 150°C is 30 ppm/°C or lower.SELECTED DRAWING: None PROBLEM TO BE SOLVED: To provide sheet material capable of forming on a glass substrate a conductive layer with a method that is versatile and cost-effective and particularly suitable for being used as a core substrate of a multilayer printed wiring board.SOLUTION: Sheet ...more ...less
15
KR20180030946A
Publication/Patent Number: KR20180030946A
Publication date: 2018-03-26
Application number: 20187007458
Filing date: 2008-11-21
Abstract: 무기 충전재를 35질량% 이상 함유하는 절연층에 대해, 비어 주변의 절연층 표면에 큰 요철을 발생시키지 않고, 비어 바닥 직경과 톱 직경의 차가 작은 양호한 구멍 형상의 블라인드 비어를 형성하는 공정을 포함하는 것을 특징으로 하는 다층 프린트 배선판의 제조방법. 무기 충전재를 35질량% 이상 함유하는 절연층에 대해, 비어 주변의 절연층 표면에 큰 요철을 발생시키지 않고, 비어 바닥 직경과 톱 직경의 차가 작은 양호한 구멍 형상의 블라인드 비어를 형성하는 공정을 포함하는 것을 특징으로 하는 다층 프린트 배선판의 제조방법. ...more ...less
16
JP2018027703A
Publication/Patent Number: JP2018027703A
Publication date: 2018-02-22
Application number: 2017218259
Filing date: 2017-11-13
Abstract: PROBLEM TO BE SOLVED: To provide an insulative resin sheet, capable of improving a mechanical strength when forming an insulation layer, excellent in processability in formation of a via hole or the like, and capable of forming a favorable via hole by restraining distortion of a via form even in a small diameter via hole, compared to when a glass cloth is used.SOLUTION: There is provided an insulative resin sheet having a heat-resistant film and the thermosetting resin composition layers formed on both faces of the film. The ratio E1/E2 of the etching amount per unit area (E1) of the heat-resistant film to that amount per unit area (E2) of the hardened material of the thermosetting resin composition layer is 0.5 to 3.SELECTED DRAWING: None PROBLEM TO BE SOLVED: To provide an insulative resin sheet, capable of improving a mechanical strength when forming an insulation layer, excellent in processability in formation of a via hole or the like, and capable of forming a favorable via hole by restraining distortion of a ...more ...less
17
TW201801589A
Publication/Patent Number: TW201801589A
Publication date: 2018-01-01
Application number: 106103497
Filing date: 2017-02-02
Abstract: Provided are: a resin sheet attached with a support for reducing the insertion loss and suppressing the deviation of the insertion loss; a printed wiring board; and a semiconductor device. The resin sheet attached with the support comprises the support and the resin sheet provided on the support, wherein the resin sheet comprises a first resin composition layer formed by a first resin composition provided on the support side, and a second resin composition layer formed by the second resin composition provided on the side opposite to the support side, wherein the composition of the first and second resin compositions are different from each other and the dielectric constants of thermosetting products of the first resin composition and the second resin composition are all 3.6 or less, and the thermosetting product of the first and second resin compositions has a dielectric loss tangent of 0.01 or less and a difference in dielectric loss tangent of 0.005 or less. Provided are: a resin sheet attached with a support for reducing the insertion loss and suppressing the deviation of the insertion loss; a printed wiring board; and a semiconductor device. The resin sheet attached with the support comprises the support and the resin sheet ...more ...less
18
TW201802153A
Publication/Patent Number: TW201802153A
Publication date: 2018-01-16
Application number: 106105756
Filing date: 2017-02-21
Abstract: The subject of the present invention is to provide a resin sheet capable of imparting a thin insulating layer for suppressing a reflow warpage and providing an excellent insulating performance. To solve the problem, there is provided a resin sheet having a resin composition layer including an epoxy resin (A), a curing agent (B) and an inorganic filling material (C). When a nonvolatile component in the resin composition layer is taken as 100 mass%, the inorganic filling material (C) is more than 50 mass%. On conditions of vibration frequency of 1 Hz and strain of 1 deg, a lowest melting viscosity obtained by performing dynamic viscoelasticity measurement of the resin composition layer is more than 8000 poise. On conditions of vibration frequency of 1 Hz and strain of 5 deg, a lowest melting viscosity obtained by performing dynamic viscoelasticity measurement of the resin composition layer is less than 8000 poise. The subject of the present invention is to provide a resin sheet capable of imparting a thin insulating layer for suppressing a reflow warpage and providing an excellent insulating performance. To solve the problem, there is provided a resin sheet having a resin composition ...more ...less
19
JP6267140B2
Publication/Patent Number: JP6267140B2
Publication date: 2018-01-24
Application number: 2015040262
Filing date: 2015-03-02
Abstract: PROBLEM TO BE SOLVED: To provide a resin composition suitable for forming an insulating layer of a circuit board
20
JP2018008386A
Publication/Patent Number: JP2018008386A
Publication date: 2018-01-18
Application number: 2016137103
Filing date: 2016-07-11
Abstract: 【課題】第二のデザインを形成、印刷するためにゴム層にブランク部が形成されたブランケットであっても、塗料や洗浄時の溶剤成分がゴム層と基材層の層間や、基材層、接着層などに浸透することがなく、ブランク部周辺のゴム層が劣化しにくく、ブランケットホイールへの装着位置がずれにくいブランケット、および、これを用いたオフセット印刷装置を提供すること。【解決手段】外表面に印刷面を備えたゴム層111と、ゴム層111の内面側に基材層113と、を有するオフセット印刷用のブランケット110であって、ゴム層111は、外表面に凹状のブランク部112を有し、基材層113を外表面側から隙間なく覆っていることを特徴とするオフセット印刷用のブランケット110、および、これを用いたオフセット印刷装置100。【選択図】図1 【課題】第二のデザインを形成、印刷するためにゴム層にブランク部が形成されたブランケットであっても、塗料や洗浄時の溶剤成分がゴム層と基材層の層間や、基材層、接着層などに浸透することがなく、ブランク部周辺のゴム層が劣化しにくく、ブランケットホイールへの装着位置がずれにくいブランケット、および、これを用いたオフセット印刷装置を提供すること。【解決手段】外表面に印刷面を備えたゴム層111と、ゴム層111の内面側に基材層113と、を有するオフセット印刷用のブランケット110であって、ゴム層111は、外表面に凹状のブランク部112を有し、基材層113を外表面側から隙 ...more ...less