Country
Full text data for US and EP
Status
Type
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC
No.
Publication Number
Title
Publication/Patent Number Publication/Patent Number
Publication date Publication date
Application number Application number
Filing date Filing date
Inventor Inventor
Assignee Assignee
IPC IPC
1
US10305620B2
Publication/Patent Number: US10305620B2
Publication date: 2019-05-28
Application number: 14/268,739
Filing date: 2014-05-02
Inventor: Yu, Jianjun   Tang, Jin  
Abstract: Blind polarization demultiplexing algorithms based on complex independent component analysis (ICA) by negentropy maximization for quadrature amplitude modulation (QAM) coherent optical systems are disclosed. The polarization demultiplexing is achieved by maximizing the signal's non-Gaussianity measured by the information theoretic quantity of negentropy. An adaptive gradient optimization algorithm and a Quasi-Newton algorithm with accelerated convergence are employed to maximize the negentropy. Certain approximate nonlinear functions can be substitutes for the negentropy which is strictly derived from the probability density function (PDF) of the received noisy QAM signal with phase noise, and this reduces the computational complexity. The numerical simulation and experimental results of polarization division multiplexing (PDM)-quadrature phase shift keying (QPSK) and PDM-16QAM reveal that the ICA demultiplexing algorithms are feasible and effective in coherent systems and the simplified ones can also achieve equivalent performance. Blind polarization demultiplexing algorithms based on complex independent component analysis (ICA) by negentropy maximization for quadrature amplitude modulation (QAM) coherent optical systems are disclosed. The polarization demultiplexing is achieved by maximizing the signal's ...more ...less
2
US10200506B2
Publication/Patent Number: US10200506B2
Publication date: 2019-02-05
Application number: 14/698,301
Filing date: 2015-04-28
Abstract: A method, system and device for monitoring data. A server receives service running data of a service transmitted from a client. The server acquires a first abnormal strategy corresponding to the service and provides an alarm for the service when the first abnormal strategy is matched according to the service running data. The server can determine for which service running on the client the abnormality occurs and an alarm is provided. A method, system and device for monitoring data. A server receives service running data of a service transmitted from a client. The server acquires a first abnormal strategy corresponding to the service and provides an alarm for the service when the first abnormal strategy is ...more ...less
3
US2019066334A1
Publication/Patent Number: US2019066334A1
Publication date: 2019-02-28
Application number: 15/966,345
Filing date: 2018-04-30
Inventor: Gu, Yu   Tang, Xiaojun  
Abstract: Described herein are a method, apparatus, terminal, and system for measuring a trajectory tracking accuracy of a target. Using each method, apparatus, terminal, and system to measure the trajectory tracking accuracy of the target includes determining a location information of the actual tracking trajectory of the target; comparing the location information of the actual tracking trajectory with a location information of the target trajectory to determine a variance between the location information of the actual tracking trajectory and the location information of the target trajectory; and determining the tracking accuracy of the target based on the variance. Described herein are a method, apparatus, terminal, and system for measuring a trajectory tracking accuracy of a target. Using each method, apparatus, terminal, and system to measure the trajectory tracking accuracy of the target includes determining a location information of ...more ...less
4
EP3508521A1
Publication/Patent Number: EP3508521A1
Publication date: 2019-07-10
Application number: 17844931.0
Filing date: 2017-05-23
Inventor: Yu, Jiabao   Tang, Yun  
Abstract: Disclosed is a method for preparing thermoplastic polymer foamed beads, comprising the following steps: 1) putting polymer particles into a sealed container heated to a foaming temperature, and putting the sealed container in a vacuum environment; 2) introducing a supercritical fluid into the sealed container, and performing swelling diffusion; 3) after 5-60 minutes of swelling diffusion of the supercritical fluid, releasing the pressure of the sealed container to discharge the supercritical fluid, and inducing nucleation and growth of foam pores by controlling the pressure release velocity so as to enable the polymer beads to swell and grow; 4) leading the polymer beads inside the sealed container into a vacuum environment to further swell and grow, finally obtaining the polymer foamed beads with a high foaming ratio. The foaming temperature in step 1) is a temperature where the polymer particles can undergo plastic deformation but cannot flow yet; the foaming temperature is within Tg to Tg+40°C for an amorphous polymer, and Tg is a glass transition temperature of the amorphous polymer; for a crystalline polymer, the foaming temperature is within Tm-20°C to Tm, and Tm is the melting point of the crystalline polymer. Disclosed is a method for preparing thermoplastic polymer foamed beads, comprising the following steps: 1) putting polymer particles into a sealed container heated to a foaming temperature, and putting the sealed container in a vacuum environment; 2) introducing a supercritical ...more ...less
5
US10232429B1
Publication/Patent Number: US10232429B1
Publication date: 2019-03-19
Application number: 16/005,804
Filing date: 2018-06-12
Assignee: Lin, Yu-Tang
Abstract: A mandrel-pulling distance sensing assembly of an electric rivet gun is mounted in a barrel of a housing and has a stationary seat, a moving seat, two magnetic elements separately fixed on the stationary seat, and a Hall effect sensor fixed on the moving seat. The moving seat is driven by a driving assembly of the electric rivet gun and is movable relative to the stationary seat. While the Hall effect sensor moves along with the moving seat between the two magnetic elements, the Hall effect sensor detects a changing magnetic field and produces and outputs a changing voltages to a control unit to allow the control unit to operate the driving assembly according to the changing voltages. Thus, the moving seat can be accurately positioned and moving ranges of a snapping device that is driven by the driving assembly can be accurately controlled. A mandrel-pulling distance sensing assembly of an electric rivet gun is mounted in a barrel of a housing and has a stationary seat, a moving seat, two magnetic elements separately fixed on the stationary seat, and a Hall effect sensor fixed on the moving seat. The moving seat is ...more ...less
6
EP3434244A1
Publication/Patent Number: EP3434244A1
Publication date: 2019-01-30
Application number: 17201745.1
Filing date: 2017-11-14
Abstract: An auxiliary power device includes a base (11) connected to a wheelchair and a central shaft (12) rotatably mounted to the base (11) about a rotating axis (LI). A guiding portion (16) is disposed on a bottom side of the base (11) and is spaced from the rotating axis (LI). A wheel bracket (21) is pivotably connected to the central shaft (12). An auxiliary wheel (25) is rotatably mounted to the wheel bracket (21). A rotary member (29) abuts the guiding portion (16). When the auxiliary wheel (25) deviates from the moving direction while moving on the ground (G), the wheel bracket (21) and the central shaft (12) together rotate about the rotating axis (L1). The rotary member (29) moves along and presses against the guiding portion (16), and the auxiliary wheel (25) is imparted with a returning force (F) to move back to the moving direction. An auxiliary power device includes a base (11) connected to a wheelchair and a central shaft (12) rotatably mounted to the base (11) about a rotating axis (LI). A guiding portion (16) is disposed on a bottom side of the base (11) and is spaced from the rotating axis (LI). A ...more ...less
7
EP3231608B1
Publication/Patent Number: EP3231608B1
Publication date: 2019-06-12
Application number: 15867820.1
Filing date: 2015-04-16
8
US10269732B2
Publication/Patent Number: US10269732B2
Publication date: 2019-04-23
Application number: 15/283,604
Filing date: 2016-10-03
Abstract: In some embodiments, a semiconductor package includes a die surrounded by a molding material, a redistribution layer over the die and the molding material, the redistribution layer electrically coupled to the die, and a first conductive structure in the molding material and electrically coupled to the die, the first conductive structure being an inductor or an antenna. In some embodiments, a semiconductor package includes a die surrounded by a molding material, a redistribution layer over the die and the molding material, the redistribution layer electrically coupled to the die, and a first conductive structure in the molding material and ...more ...less
9
US2019157209A1
Publication/Patent Number: US2019157209A1
Publication date: 2019-05-23
Application number: 15/905,722
Filing date: 2018-02-26
Abstract: A chip package includes a redistribution layer, at least one first semiconductor chip, an integrated fan-out package, and an insulating encapsulation. The at least one first semiconductor chip and the integrated fan-out package are electrically connected to the redistribution layer, wherein the at least one first semiconductor chip and the integrated fan-out package are located on a surface of the redistribution layer and electrically communicated to each other through the redistribution layer, and wherein the integrated fan-out package includes at least one second semiconductor chip. The insulating encapsulation encapsulates the at least one first semiconductor chip and the integrated fan-out package. A chip package includes a redistribution layer, at least one first semiconductor chip, an integrated fan-out package, and an insulating encapsulation. The at least one first semiconductor chip and the integrated fan-out package are electrically connected to the redistribution ...more ...less
10
US2019189562A9
Publication/Patent Number: US2019189562A9
Publication date: 2019-06-20
Application number: 15/650,495
Filing date: 2017-07-14
Abstract: A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The method also includes forming a first passive device in the isolation material. A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The ...more ...less
11
EP2564874B1
Publication/Patent Number: EP2564874B1
Publication date: 2019-08-14
Application number: 11774359.1
Filing date: 2011-04-22
12
US10182224B2
Publication/Patent Number: US10182224B2
Publication date: 2019-01-15
Application number: 15/252,240
Filing date: 2016-08-31
Assignee: Theia Limited
Abstract: A method for creating 3D image is provided. First, capture device, subject to be captured, and lenticular array are provided. Lenticular array comprises strip-shaped lenticular lenses, subject is disposed between capture device and lenticular array, length of a bottom of each lenticular lens is 2L, and center of the bottom is set as 0. Lens of the capture device is aimed at a top of one of lenticular lenses and −xL of bottom coordinate of lenticular lens, and the value of x is smaller than 1 but greater than 0. Capture device is turned with top of lenticular lens as center to capture the subject until lens of capture device is aimed at xL of bottom coordinate of lenticular lens. Pixel from −L to −xL and from L to xL of bottom coordinate is mapped with pixel from −xL to 0 and from xL to 0 captured by capture device. A method for creating 3D image is provided. First, capture device, subject to be captured, and lenticular array are provided. Lenticular array comprises strip-shaped lenticular lenses, subject is disposed between capture device and lenticular array, length of a bottom of each ...more ...less
13
US10223334B1
Publication/Patent Number: US10223334B1
Publication date: 2019-03-05
Application number: 15/655,813
Filing date: 2017-07-20
Abstract: A native tensor processor calculates tensor contractions using a sum of outer products. In one implementation, the native tensor processor preferably is implemented as a single integrated circuit and includes an input buffer and a contraction engine. The input buffer buffers tensor elements retrieved from off-chip and transmits the elements to the contraction engine as needed. The contraction engine calculates the tensor contraction by executing calculations from an equivalent matrix multiplications, as if the tensors were unfolded into matrices, but avoiding the overhead of expressly unfolding the tensors. The contraction engine includes a plurality of outer product units that calculate matrix multiplications by a sum of outer products. By using outer products, the equivalent matrix multiplications can be partitioned into smaller matrix multiplications, each of which is localized with respect to which tensor elements are required. A native tensor processor calculates tensor contractions using a sum of outer products. In one implementation, the native tensor processor preferably is implemented as a single integrated circuit and includes an input buffer and a contraction engine. The input buffer buffers ...more ...less
14
US2019019756A1
Publication/Patent Number: US2019019756A1
Publication date: 2019-01-17
Application number: 15/650,495
Filing date: 2017-07-14
Abstract: A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The method also includes forming a first passive device in the isolation material. A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The ...more ...less