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1 US2020009208A1
COMPOSITION FOR PREVENTION AND TREATMENT OF MUSCULAR DISEASES OR FOR IMPROVEMENT OF MUSCLE FUNCTION CONTAINING 3,5-DICAFFEOYLQUINIC ACID OR CHRYSANTHEMUM EXTRACT
Publication/Patent Number: US2020009208A1 Publication Date: 2020-01-09 Application Number: 16/474,528 Filing Date: 2017-11-30 Inventor: Hwang, Jae Kwan   Yun, Jun Gon   Kim, Mi Bo   Kim, Chang Hee   Lee, Joon Hyung   Kwon, Do Wan   Choi, Su Young   Kim, Jin Hak   Jang, Ji Hwan   Geum, Jeong Ho   Kweon, Min Son   Assignee: Industry-Academic Cooperation Foundation, Yonsei University   Cosmax NBT, Inc.   Cosmax NS, Inc.   IPC: A61K36/287 Abstract: The present invention relates to a composition for preventing or treating a muscle disorder, which includes a chrysanthemum extract or 3,5-dicaffeoylquinic acid as an active ingredient, and specifically, it may be used to reduce mRNA expression of atrogin-1 and MuRF1, which are main biomarkers involved in muscle protein degradation and increase mRNA expression of the mTOR protein, which is a main biomarker involved in muscle protein formation, and myogenin and MyoD, which are biomarkers related to muscle differentiation, thereby reducing muscle loss, and thus the chrysanthemum extract or 3,5-dicaffeoylquinic acid can be used in prevention and treatment of a muscle disorder, or improvement in muscle function. In addition, the chrysanthemum extract or 3,5-dicaffeoylquinic acid increases the activity of SIRT1 and PGC-1α, which are the main biomarkers involved in exercise performance, thereby excellently enhancing exercise performance. In addition, the present invention is a natural substance and may be safely used without a side effect, and therefore may be used as a medication, food or a cosmetic. The present invention relates to a composition for preventing or treating a muscle disorder, which includes a chrysanthemum extract or 3,5-dicaffeoylquinic acid as an active ingredient, and specifically, it may be used to reduce mRNA expression of atrogin-1 and MuRF1, which are ...More ...Less
2 US2019121235A1
PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Publication/Patent Number: US2019121235A1 Publication Date: 2019-04-25 Application Number: 15/983,787 Filing Date: 2018-05-18 Inventor: Yun, Geum-hee   Lee, Hwa-young   Chong, Seol-ah   Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.   IPC: G03F7/038 Abstract: A photo-curable and thermo-curable resin composition includes an epoxy resin including an epoxy group; a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein a value of an equivalent number of the epoxy group/an equivalent number of the carboxyl group is from more than 1 to less than 2. A photo-curable and thermo-curable resin composition includes an epoxy resin including an epoxy group; a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein a value of an equivalent number of the epoxy group/an equivalent number ...More ...Less
3 US10283426B2
Fan-out semiconductor package and photosensitive resin composition
Publication/Patent Number: US10283426B2 Publication Date: 2019-05-07 Application Number: 15/637,725 Filing Date: 2017-06-29 Inventor: Yun, Geum Hee   Lee, Hwa Young   Lee, Su Yeon   Park, Yong Jin   Yoon, Soo Young   Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.   IPC: H01L23/29 Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package. A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection ...More ...Less
4 KR20180020070A
Auto-sprayer plants
Publication/Patent Number: KR20180020070A Publication Date: 2018-02-27 Application Number: 20160105489 Filing Date: 2016-08-17 Inventor: Yang, Eun Ji   Eom, Sol Hee   Yun, Geum A   Assignee: YANG, EUN JI   EOM, SOL HEE   YUN, GEUM A   IPC: B05B12/12 Abstract: The present invention relates to an automatic plant sprayer comprising: a sprayer body (10) for enabling a user to automatically spray water; a case (20) for covering the body to match well with charcoal craft and tray landscape; a humidity sensing switch (30) attached to the case (20) to sense moisture of a plant; a timer switch (40) attached to the case (20) to supply moisture every time; a nozzle (50) attached to the body (10) to sprinkle water from a water container to the outside; and a battery (60) attached to the body (10) to operate the automatic sprayer. The present invention allows a conventional sprayer to automatically spray water to eliminate the inconvenience of users who travel or go on vacation. Particularly, the present invention can automatically adjust the humidity and time, such that it is possible to eliminate the existing inconvenience of use for users with physical discomfort or users who are frequently not at home. The present invention relates to an automatic plant sprayer comprising: a sprayer body (10) for enabling a user to automatically spray water; a case (20) for covering the body to match well with charcoal craft and tray landscape; a humidity sensing switch (30) attached to the ...More ...Less
5 KR20180064241A
Photo-curable and Thermo-curable resin composition dry film and circuit board using the same
Publication/Patent Number: KR20180064241A Publication Date: 2018-06-14 Application Number: 20160164654 Filing Date: 2016-12-05 Inventor: Park, Yong Jin   Shim, Ji Hye   Lee, Hwa Young   Yun, Geum Hee   Ogi, Satoshi   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: G03F7/20 Abstract: 본 발명은 수지 조성물의 전체 중량을 기준으로, 0.5 내지 3 중량부의 벤조인계 광중합 개시제; 0.5 내지 3 중량부의 벤조페논계 광흡수제; 및 50 내지 80 중량부의 무기 필러를 포함하는, 광경화성 및 열경화성 수지 조성물의 제공에 관한 것이다. 상기 조성물은 기계적 물성 및 금속과의 밀착력이 우수한 효과가 있다.
6 KR20180039462A
- FAN-OUT SEMICONDUCTOR PACKAGE AND PHOTOSENSITIVE RESIN COMPOSITION
Publication/Patent Number: KR20180039462A Publication Date: 2018-04-18 Application Number: 20160130797 Filing Date: 2016-10-10 Inventor: Park, Yong Jin   Lee, Su Yeon   Yoon, Soo Young   Lee, Hwa Young   Yun, Geum Hee   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: G03F7/004 Abstract: The present disclosure relates to a fan-out semiconductor package and a photosensitive resin composition used for the same. The fan-out semiconductor package includes a semiconductor chip including an active surface on which a connection pad is arranged and an inactive surface arranged on the opposite side of the active surface, a sealing material for sealing at least a part of the semiconductor chip, and a first connection member arranged on the active surface of the semiconductor chip, wherein the sealing material is a cured material of the photosensitive resin composition including a thermosetting resin, a carboxyl group-containing resin, an ethylenically unsaturated compound, and a reinforcing agent. Accordingly, the present invention can reduce the occurrence of warpage and prevent the reduction of photosensitivity and developability. The present disclosure relates to a fan-out semiconductor package and a photosensitive resin composition used for the same. The fan-out semiconductor package includes a semiconductor chip including an active surface on which a connection pad is arranged and an inactive surface ...More ...Less
7 US2018102297A1
FAN-OUT SEMICONDUCTOR PACKAGE AND PHOTOSENSITIVE RESIN COMPOSITION
Publication/Patent Number: US2018102297A1 Publication Date: 2018-04-12 Application Number: 15/637,725 Filing Date: 2017-06-29 Inventor: Yoon, Soo Young   Park, Yong Jin   Lee, Su Yeon   Lee, Hwa Young   Yun, Geum Hee   Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.   IPC: H01L23/00 Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package. A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection ...More ...Less
8 KR20180046141A
MULTI-LAYER PHOTOSENSITIVE FILM
Publication/Patent Number: KR20180046141A Publication Date: 2018-05-08 Application Number: 20160141032 Filing Date: 2016-10-27 Inventor: Lee, Hwa Young   Yun, Geum Hee   Ogi, Satoshi   Shin, Sang Eun   Kim, Sang Ah   Chong, Seol Ah   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: G03F7/213 Abstract: 본 발명은 제1층; 및 제1층의 상면에 형성되는 제2층을 포함하고, 상기 제1층 및 제2층은 광개시제(PI), 광흡수제(PA) 및 무기충전제를 포함하는 광경화성 수지 조성물로 형성되고, 상기 제1층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.2 내지 0.7 중량부로 포함하고, 상기 제2층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.1 내지 0.3 중량부로 포함하고, 상기 제1층의 광개시제의 함량이 제2층의 광개시제의 함량보다 큰, 감광성 필름에 관한 것이다. 본 발명에 의한 감광성 필름은 다량의 필러를 포함하여도 비아 형성 시 오프셋(offset)을 방지할 수 있어 박막에서도 미세 비아 및 미세 피치 형성이 가능하고, 다량의 필러를 포함하여도 비아 형성 시 언더컷(undercut)을 방지할 수 있어 휨에 강하고 신뢰성이 우수한 감광성 필름을 제공하는 효과가 있다. 본 발명은 제1층; 및 제1층의 상면에 형성되는 제2층을 포함하고, 상기 제1층 및 제2층은 광개시제(PI), 광흡수제(PA) 및 무기충전제를 포함하는 광경화성 수지 조성물로 형성되고, 상기 제1층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.2 내지 0.7 중량부로 포함하고, 상기 제2층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.1 내지 0.3 중량부로 포함하고, 상기 제1층의 광개시제의 함량이 제2층의 광개시제의 함량보다 큰, ...More ...Less
9 KR20180050197A
PHOTO CURABLE AND THERMO CURABLE RESIN COMPOSITION FOR HIGH RESOLUTION
Publication/Patent Number: KR20180050197A Publication Date: 2018-05-14 Application Number: 20170054852 Filing Date: 2017-04-28 Inventor: Park, Yong Jin   Lee, Su Yeon   Lee, Hwa Young   Yun, Geum Hee   Ogi, Satoshi   Chong, Seol Ah   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: C08J5/18 Abstract: 본 발명은 광개시제(PI); 광흡수제(PA); 열 경화가 가능한 열경화성 바인더; 및수지 조성물 전체 중량을 기준으로 60 내지 80중량부의 무기충전제를 포함하는, 고해상력 광경화성 및 열경화성 수지 조성물에 관한 것이다. 본 발명에 의하면, 비아의 언더컷 및 오프셋을 제어하여 미세 비아 및 미세 피치 형성이 가능한 고해상력 광경화성 및 열경화성 수지 조성물을 제공할 수 있다.
10 KR20180064927A
COMPOSITION FOR FLEXIBLE PRINTED CIRCUIT BOARD AND CURED PRODUCT THEREOF
Publication/Patent Number: KR20180064927A Publication Date: 2018-06-15 Application Number: 20160165382 Filing Date: 2016-12-06 Inventor: Shim, Ji Hye   Lee, Hwa Young   Yun, Geum Hee   Yoo, Seong Hyun   Chong, Seol Ah   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: H05K1/03 Abstract: 본 발명은 플렉서블 회로기판용 조성물 및 이의 경화물에 관한 것이다. 본 발명에 의한 조성물은 우수한 굴곡성, 기계적 특성 및 접착력을 가지며, 저온경화가 가능하여, 고가의 폴리이미드를 대체할 수 있고 별도의 접착층을 형성할 필요가 없어, 경박단소화된 플렉서블 회로기판을 경제적이고 효율적으로 제공할 수 있다.
11 US2018305509A1
LIGHT SHIELDING RESIN COMPOSITIONS
Publication/Patent Number: US2018305509A1 Publication Date: 2018-10-25 Application Number: 15/827,008 Filing Date: 2017-11-30 Inventor: Yun, Geum-hee   Chong, Seol-ah   Lee, Hwa-young   Shim, Ji-hye   Shin, Sang-eun   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: C08J5/18 Abstract: A molded product includes a body comprising a light-shielding photosensitive resin. The light-shielding photosensitive resin has a tinting strength having an L value equal than or less than 40, an a* value of −40 to −10, and a b* value less than or equal to 5 in the L*a*b* color space (CIE colorimetric system), and the light-shielding photosensitive resin has a directed transmittance (% T) of less than 10% at a wavelength band of 200 nm to 700 nm. A molded product includes a body comprising a light-shielding photosensitive resin. The light-shielding photosensitive resin has a tinting strength having an L value equal than or less than 40, an a* value of −40 to −10, and a b* value less than or equal to 5 in ...More ...Less
12 JP2018064085A
FAN-OUT SEMICONDUCTOR PACKAGE AND PHOTOSENSITIVE RESIN COMPOSITION
Publication/Patent Number: JP2018064085A Publication Date: 2018-04-19 Application Number: 2017123743 Filing Date: 2017-06-23 Inventor: Yoon, Soo Young   Park, Yong Jin   Yun, Geum Hee   Lee, Hwa Young   Lee, Sue Yoen   Assignee: SAMSUNG ELECTRO-MECHANICS CO LTD   IPC: C08L101/00 Abstract: PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition which never causes the worsening of photosensitivity and developability while having superior rigidity, which is less in the occurrence of a warp (Warpage) because of its superiority in hardened film flexibility, and which is superior in packability in a hole or cavity because of its excellent fluidity; and a fan-out semiconductor package in which the photosensitive resin composition can be used as a sealant.SOLUTION: The present invention relates to a fan-out semiconductor package and a photosensitive resin composition which can be used therefor. The fan-out semiconductor package comprises: a semiconductor chip having an active face where a connection pad is disposed thereon, and an inactive face disposed on a side opposite to the active face; a sealant for sealing at least a part of the semiconductor chip; and a first connecting member disposed on the active face of the semiconductor chip. The sealant is a cured product of the photosensitive resin composition comprising a thermosetting resin, a carboxyl group-containing resin, an unsaturated ethylene compound, and a reinforcing agent.SELECTED DRAWING: Figure 9 PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition which never causes the worsening of photosensitivity and developability while having superior rigidity, which is less in the occurrence of a warp (Warpage) because of its superiority in hardened film ...More ...Less
13 KR101697179B1
-1 A composition containing Scolopendrasin-1 peptide for the prevention and treatment of Atopic Dermatitis
Publication/Patent Number: KR101697179B1 Publication Date: 2017-01-18 Application Number: 20140158877 Filing Date: 2014-11-14 Inventor: Kim, In Woo   Ahn, Mi Young   Hwang, Jae Sam   Yun, Eun Young   Kang, Tae Jin   Nam, Sung Hee   Kim, Mi Ae   Lee, Ki Man   Lee, Joon Ha   Lee, Geum Seon   Kim, Sagn Hee   Assignee: REPUBLIC OF KOREA(MANAGEMENT : RURAL DEVELOPMENT ADMINISTRATION)   SAHMYOOK UNIVERSITY INDUSTRY-ACADEMIC COOPERATIONFOUNDATION   IPC: A61K38/10 Abstract: The present invention relates to a composition comprising sclolopendrasin-1 peptide as an active ingredient for preventing and treating atopic dermatitis. The present invention provides a pharmaceutical composition for preventing and treating atopic dermatitis
14 JP6042309B2
MULTILAYER INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: JP6042309B2 Publication Date: 2016-12-14 Application Number: 2013225062 Filing Date: 2013-10-30 Inventor: Kim, Jin Young   Park, Moon Soo   Yun, Geum Hee   Lee, Sa Yong   Lee, Kun Yong   Assignee: SAMSUNG ELECTRO-MECHANICS CO LTD   IPC: H01F17/00 Abstract: PROBLEM TO BE SOLVED: To provide a multilayer inductor obtained by stacking laminates each including a substrate having internal electrode coil patterns formed thereon and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed
15 KR101685321B1
Applied to the dental chair unit for water pipe sterilization device
Publication/Patent Number: KR101685321B1 Publication Date: 2016-12-13 Application Number: 20160000761 Filing Date: 2016-01-05 Inventor: Jung, Da Woon   Choi, Bo Geum   Bae, Il Kwon   Bae, Yun Jeong   Lee, You Jeong   Jeong, Bo Hee   Assignee: SILLA UNIVERSITY   IPC: A61C1/00 Abstract: The present invention relates to a water pipe sterilization device and
16 KR20160100702A
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD
Publication/Patent Number: KR20160100702A Publication Date: 2016-08-24 Application Number: 20150023517 Filing Date: 2015-02-16 Inventor: Kim, Jin Young   Yun, Geum Hee   Yoo, Seong Hyun   Jo, Dae Hui   Sohn, Keung Jjin   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: C08K5/00 Abstract: The present invention relates to a resin composition for a printed circuit board
17 US2016237303A1
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND PRINTED CIRCUIT BOARD USING THE SAME
Publication/Patent Number: US2016237303A1 Publication Date: 2016-08-18 Application Number: 14/951,045 Filing Date: 2015-11-24 Inventor: Yun, Geum-hee   Jo, Dae-hui   Yoo, Seong-hyun   Sohn, Keung-jin   Kim, Jin-young   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: C09D163/00 Abstract: A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not include a hardening agent. A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not ...More ...Less
18 KR20160058315A
-1 A composition containing Scolopendrasin-1 peptide for the prevention and treatment of Atopic Dermatitis
Publication/Patent Number: KR20160058315A Publication Date: 2016-05-25 Application Number: 20140158877 Filing Date: 2014-11-14 Inventor: Kim, In Woo   Ahn, Mi Young   Hwang, Jae Sam   Yun, Eun Young   Kang, Tae Jin   Nam, Sung Hee   Kim, Mi Ae   Lee, Ki Man   Lee, Joon Ha   Lee, Geum Seon   Kim, Sagn Hee   Assignee: REPUBLIC OF KOREA(MANAGEMENT : RURAL DEVELOPMENT ADMINISTRATION)   SAHMYOOK UNIVERSITY INDUSTRY-ACADEMIC COOPERATIONFOUNDATION   IPC: A61K38/10 Abstract: The present invention relates to a composition comprising sclolopendrasin-1 peptide as an active ingredient for preventing and treating atopic dermatitis. The present invention provides a pharmaceutical composition for preventing and treating atopic dermatitis
19 JP2015034282A
COMPOSITE MATERIAL FOR CIRCUIT BOARD PRODUCTION
Publication/Patent Number: JP2015034282A Publication Date: 2015-02-19 Application Number: 2014077687 Filing Date: 2014-04-04 Inventor: Kim, Jin Young   Yun, Geum Hee   Yoon, Sang Hyun   Lee, Kun Yong   Assignee: SAMSUNG ELECTRO-MECHANICS CO LTD   IPC: C08G63/682 Abstract: PROBLEM TO BE SOLVED: To provide a composite material for circuit board production
20 US9035738B2
Multilayer inductor and method for manufacturing the same
Publication/Patent Number: US9035738B2 Publication Date: 2015-05-19 Application Number: 13/842,187 Filing Date: 2013-03-15 Inventor: Lee, Sa Yong   Kim, Jin Young   Lee, Keun Yong   Yun, Geum Hee   Park, Moon Soo   Assignee: Samsung Electro-Mechanics Co., Ltd.   IPC: H01F5/00 Abstract: Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured. Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the ...More ...Less