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1
US2019121235A1
Publication/Patent Number: US2019121235A1
Publication date: 2019-04-25
Application number: 15/983,787
Filing date: 2018-05-18
Abstract: A photo-curable and thermo-curable resin composition includes an epoxy resin including an epoxy group; a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein a value of an equivalent number of the epoxy group/an equivalent number of the carboxyl group is from more than 1 to less than 2. A photo-curable and thermo-curable resin composition includes an epoxy resin including an epoxy group; a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein a value of an equivalent number of the epoxy group/an equivalent number ...more ...less
2
US10283426B2
Publication/Patent Number: US10283426B2
Publication date: 2019-05-07
Application number: 15/637,725
Filing date: 2017-06-29
Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package. A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection ...more ...less
3
KR20180020070A
Publication/Patent Number: KR20180020070A
Publication date: 2018-02-27
Application number: 20160105489
Filing date: 2016-08-17
Abstract: The present invention relates to an automatic plant sprayer comprising: a sprayer body (10) for enabling a user to automatically spray water; a case (20) for covering the body to match well with charcoal craft and tray landscape; a humidity sensing switch (30) attached to the case (20) to sense moisture of a plant; a timer switch (40) attached to the case (20) to supply moisture every time; a nozzle (50) attached to the body (10) to sprinkle water from a water container to the outside; and a battery (60) attached to the body (10) to operate the automatic sprayer. The present invention allows a conventional sprayer to automatically spray water to eliminate the inconvenience of users who travel or go on vacation. Particularly, the present invention can automatically adjust the humidity and time, such that it is possible to eliminate the existing inconvenience of use for users with physical discomfort or users who are frequently not at home. The present invention relates to an automatic plant sprayer comprising: a sprayer body (10) for enabling a user to automatically spray water; a case (20) for covering the body to match well with charcoal craft and tray landscape; a humidity sensing switch (30) attached to the ...more ...less
4
US2018102297A1
Publication/Patent Number: US2018102297A1
Publication date: 2018-04-12
Application number: 15/637,725
Filing date: 2017-06-29
Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package. A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection ...more ...less
5
US2018305509A1
Publication/Patent Number: US2018305509A1
Publication date: 2018-10-25
Application number: 15/827,008
Filing date: 2017-11-30
Abstract: A molded product includes a body comprising a light-shielding photosensitive resin. The light-shielding photosensitive resin has a tinting strength having an L value equal than or less than 40, an a* value of −40 to −10, and a b* value less than or equal to 5 in the L*a*b* color space (CIE colorimetric system), and the light-shielding photosensitive resin has a directed transmittance (% T) of less than 10% at a wavelength band of 200 nm to 700 nm. A molded product includes a body comprising a light-shielding photosensitive resin. The light-shielding photosensitive resin has a tinting strength having an L value equal than or less than 40, an a* value of −40 to −10, and a b* value less than or equal to 5 in ...more ...less
6
JP2018064085A
Publication/Patent Number: JP2018064085A
Publication date: 2018-04-19
Application number: 2017123743
Filing date: 2017-06-23
Abstract: PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition which never causes the worsening of photosensitivity and developability while having superior rigidity, which is less in the occurrence of a warp (Warpage) because of its superiority in hardened film flexibility, and which is superior in packability in a hole or cavity because of its excellent fluidity; and a fan-out semiconductor package in which the photosensitive resin composition can be used as a sealant.SOLUTION: The present invention relates to a fan-out semiconductor package and a photosensitive resin composition which can be used therefor. The fan-out semiconductor package comprises: a semiconductor chip having an active face where a connection pad is disposed thereon, and an inactive face disposed on a side opposite to the active face; a sealant for sealing at least a part of the semiconductor chip; and a first connecting member disposed on the active face of the semiconductor chip. The sealant is a cured product of the photosensitive resin composition comprising a thermosetting resin, a carboxyl group-containing resin, an unsaturated ethylene compound, and a reinforcing agent.SELECTED DRAWING: Figure 9 PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition which never causes the worsening of photosensitivity and developability while having superior rigidity, which is less in the occurrence of a warp (Warpage) because of its superiority in hardened film ...more ...less
7
KR20180064927A
Publication/Patent Number: KR20180064927A
Publication date: 2018-06-15
Application number: 20160165382
Filing date: 2016-12-06
Abstract: 본 발명은 플렉서블 회로기판용 조성물 및 이의 경화물에 관한 것이다. 본 발명에 의한 조성물은 우수한 굴곡성, 기계적 특성 및 접착력을 가지며, 저온경화가 가능하여, 고가의 폴리이미드를 대체할 수 있고 별도의 접착층을 형성할 필요가 없어, 경박단소화된 플렉서블 회로기판을 경제적이고 효율적으로 제공할 수 있다. 본 발명은 플렉서블 회로기판용 조성물 및 이의 경화물에 관한 것이다. 본 발명에 의한 조성물은 우수한 굴곡성, 기계적 특성 및 접착력을 가지며, 저온경화가 가능하여, 고가의 폴리이미드를 대체할 수 있고 별도의 접착층을 형성할 필요가 없어, 경박단소화된 플렉서블 회로기판을 경제적이고 효율적으로 제공할 수 있다. ...more ...less
8
KR20180064241A
Publication/Patent Number: KR20180064241A
Publication date: 2018-06-14
Application number: 20160164654
Filing date: 2016-12-05
Abstract: 본 발명은 수지 조성물의 전체 중량을 기준으로, 0.5 내지 3 중량부의 벤조인계 광중합 개시제; 0.5 내지 3 중량부의 벤조페논계 광흡수제; 및 50 내지 80 중량부의 무기 필러를 포함하는, 광경화성 및 열경화성 수지 조성물의 제공에 관한 것이다. 상기 조성물은 기계적 물성 및 금속과의 밀착력이 우수한 효과가 있다. 본 발명은 수지 조성물의 전체 중량을 기준으로, 0.5 내지 3 중량부의 벤조인계 광중합 개시제; 0.5 내지 3 중량부의 벤조페논계 광흡수제; 및 50 내지 80 중량부의 무기 필러를 포함하는, 광경화성 및 열경화성 수지 조성물의 제공에 관한 것이다. 상기 조성물은 기계적 물성 및 금속과의 밀착력이 우수한 효과가 있다. ...more ...less
9
KR20180039462A
Publication/Patent Number: KR20180039462A
Publication date: 2018-04-18
Application number: 20160130797
Filing date: 2016-10-10
Abstract: The present disclosure relates to a fan-out semiconductor package and a photosensitive resin composition used for the same. The fan-out semiconductor package includes a semiconductor chip including an active surface on which a connection pad is arranged and an inactive surface arranged on the opposite side of the active surface, a sealing material for sealing at least a part of the semiconductor chip, and a first connection member arranged on the active surface of the semiconductor chip, wherein the sealing material is a cured material of the photosensitive resin composition including a thermosetting resin, a carboxyl group-containing resin, an ethylenically unsaturated compound, and a reinforcing agent. Accordingly, the present invention can reduce the occurrence of warpage and prevent the reduction of photosensitivity and developability. The present disclosure relates to a fan-out semiconductor package and a photosensitive resin composition used for the same. The fan-out semiconductor package includes a semiconductor chip including an active surface on which a connection pad is arranged and an inactive surface ...more ...less
10
KR20180046141A
Publication/Patent Number: KR20180046141A
Publication date: 2018-05-08
Application number: 20160141032
Filing date: 2016-10-27
Abstract: 본 발명은 제1층; 및 제1층의 상면에 형성되는 제2층을 포함하고, 상기 제1층 및 제2층은 광개시제(PI), 광흡수제(PA) 및 무기충전제를 포함하는 광경화성 수지 조성물로 형성되고, 상기 제1층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.2 내지 0.7 중량부로 포함하고, 상기 제2층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.1 내지 0.3 중량부로 포함하고, 상기 제1층의 광개시제의 함량이 제2층의 광개시제의 함량보다 큰, 감광성 필름에 관한 것이다. 본 발명에 의한 감광성 필름은 다량의 필러를 포함하여도 비아 형성 시 오프셋(offset)을 방지할 수 있어 박막에서도 미세 비아 및 미세 피치 형성이 가능하고, 다량의 필러를 포함하여도 비아 형성 시 언더컷(undercut)을 방지할 수 있어 휨에 강하고 신뢰성이 우수한 감광성 필름을 제공하는 효과가 있다. 본 발명은 제1층; 및 제1층의 상면에 형성되는 제2층을 포함하고, 상기 제1층 및 제2층은 광개시제(PI), 광흡수제(PA) 및 무기충전제를 포함하는 광경화성 수지 조성물로 형성되고, 상기 제1층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.2 내지 0.7 중량부로 포함하고, 상기 제2층의 상기 광개시제의 함량은 광경화성 수지 조성물 전체 중량을 기준으로 0.1 내지 0.3 중량부로 포함하고, 상기 제1층의 광개시제의 함량이 제2층의 광개시제의 함량보다 큰, ...more ...less
11
KR20180050197A
Publication/Patent Number: KR20180050197A
Publication date: 2018-05-14
Application number: 20170054852
Filing date: 2017-04-28
Abstract: 본 발명은 광개시제(PI); 광흡수제(PA); 열 경화가 가능한 열경화성 바인더; 및수지 조성물 전체 중량을 기준으로 60 내지 80중량부의 무기충전제를 포함하는, 고해상력 광경화성 및 열경화성 수지 조성물에 관한 것이다. 본 발명에 의하면, 비아의 언더컷 및 오프셋을 제어하여 미세 비아 및 미세 피치 형성이 가능한 고해상력 광경화성 및 열경화성 수지 조성물을 제공할 수 있다. 본 발명은 광개시제(PI); 광흡수제(PA); 열 경화가 가능한 열경화성 바인더; 및수지 조성물 전체 중량을 기준으로 60 내지 80중량부의 무기충전제를 포함하는, 고해상력 광경화성 및 열경화성 수지 조성물에 관한 것이다. 본 발명에 의하면, 비아의 언더컷 및 오프셋을 제어하여 미세 비아 및 미세 피치 형성이 가능한 고해상력 광경화성 및 열경화성 수지 조성물을 제공할 수 있다. ...more ...less
12
KR101697179B1
Publication/Patent Number: KR101697179B1
Publication date: 2017-01-18
Application number: 20140158877
Filing date: 2014-11-14
Abstract: The present invention relates to a composition comprising sclolopendrasin-1 peptide as an active ingredient for preventing and treating atopic dermatitis. The present invention provides a pharmaceutical composition for preventing and treating atopic dermatitis
13
JP6042309B2
Publication/Patent Number: JP6042309B2
Publication date: 2016-12-14
Application number: 2013225062
Filing date: 2013-10-30
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer inductor obtained by stacking laminates each including a substrate having internal electrode coil patterns formed thereon and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed
14
US2016237303A1
Publication/Patent Number: US2016237303A1
Publication date: 2016-08-18
Application number: 14/951,045
Filing date: 2015-11-24
Abstract: A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not include a hardening agent. A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not ...more ...less
15
KR20160100702A
Publication/Patent Number: KR20160100702A
Publication date: 2016-08-24
Application number: 20150023517
Filing date: 2015-02-16
Abstract: The present invention relates to a resin composition for a printed circuit board
16
KR101685321B1
Publication/Patent Number: KR101685321B1
Publication date: 2016-12-13
Application number: 20160000761
Filing date: 2016-01-05
Abstract: The present invention relates to a water pipe sterilization device and
17
KR20160058315A
Publication/Patent Number: KR20160058315A
Publication date: 2016-05-25
Application number: 20140158877
Filing date: 2014-11-14
Abstract: The present invention relates to a composition comprising sclolopendrasin-1 peptide as an active ingredient for preventing and treating atopic dermatitis. The present invention provides a pharmaceutical composition for preventing and treating atopic dermatitis
18
US2015057393A1
Publication/Patent Number: US2015057393A1
Publication date: 2015-02-26
Application number: 14/095,864
Filing date: 2013-12-03
Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same. Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having ...more ...less
19
CN104419156A
Publication/Patent Number: CN104419156A
Publication date: 2015-03-18
Application number: 201310717241
Filing date: 2013-12-23
Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same
20
KR20150024153A
Publication/Patent Number: KR20150024153A
Publication date: 2015-03-06
Application number: 20130101246
Filing date: 2013-08-26
Abstract: Provided in the present invention are an insulating resin composition for a printed circuit board and a product using the same. Specifically