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1
US20050051262A1
Publication/Patent Number: US20050051262A1
Publication date: 2005-03-10
Application number: 10/657,969
Filing date: 2003-09-09
Abstract: An apparatus and method for retaining composite structures, such as composite honeycomb structures, during manufacture are provided. The composite structure is cured on a mandrel that defines a layup surface with a grip feature. The grip feature is configured to engage the composite structure during manufacture and retain the structure in a predetermined configuration. A film adhesive can be provided between the grip feature and a tiedown ply that extends from the composite structure. An apparatus and method for retaining composite structures, such as composite honeycomb structures, during manufacture are provided. The composite structure is cured on a mandrel that defines a layup surface with a grip feature. The grip feature is configured to engage the ...more ...less
2
US20050060866A1
Publication/Patent Number: US20050060866A1
Publication date: 2005-03-24
Application number: 10/939,724
Filing date: 2004-09-13
Inventor: Westall, Roger  
Abstract: A method for clinching pieces of metal plate, comprising the steps of: positioning two pieces of sheet metal (6a, 6b) in a clinching station (3), the two pieces of sheet metal (6a, 6b) being provided with at least one area of their edge whereon is applied a hot-curing resin, performing a clinching operation along the edge (16, 17) of said pieces (6a, 6b); and polymerising the resin by means of induction heating, in the same clinching station (3) by means of a heating device (19) which performs a localised heating of the clinched edges (16, 17). A method for clinching pieces of metal plate, comprising the steps of: positioning two pieces of sheet metal (6a, 6b) in a clinching station (3), the two pieces of sheet metal (6a, 6b) being provided with at least one area of their edge whereon is applied ...more ...less
3
US20050263245A1
Publication/Patent Number: US20050263245A1
Publication date: 2005-12-01
Application number: 11/202,096
Filing date: 2005-08-12
Abstract: A method of vulcanizing an object formed of unvulcanized rubber, in which the unvulcanized-rubber formed object is vulcanized by pressing and heating by mold means, comprises disposing a fiber sheet member on a surface of the unvulcanized-rubber formed object and vulcanizing the unvulcanized-rubber formed object by the mold means. A method of vulcanizing an object formed of unvulcanized rubber, in which the unvulcanized-rubber formed object is vulcanized by pressing and heating by mold means, comprises disposing a fiber sheet member on a surface of the unvulcanized-rubber formed object and vulcanizing the ...more ...less
4
US20050217792A1
Publication/Patent Number: US20050217792A1
Publication date: 2005-10-06
Application number: 11/129,497
Filing date: 2005-05-16
Abstract: A process for the manufacturing of a decorative laminate, which laminate comprises an upper decorative and abrasion resistant thermosetting laminate layer and a carrying core. The upper side of the core is provided with the abrasion resistant thermosetting laminate with a dampening foil of an elastomer arranged between the upper side of the core and the abrasion resistant thermosetting laminate, which elastomer and which thermosetting laminate are joined with each other and with the core by means of pressing. A process for the manufacturing of a decorative laminate, which laminate comprises an upper decorative and abrasion resistant thermosetting laminate layer and a carrying core. The upper side of the core is provided with the abrasion resistant thermosetting laminate with a ...more ...less
5
US20050274447A1
Publication/Patent Number: US20050274447A1
Publication date: 2005-12-15
Application number: 10/898,848
Filing date: 2004-07-26
Abstract: Methods for slurry processing of nanomaterials into products. These methods are useful for organic, inorganic, metallic, alloy, ceramic, conducting polymer, non-conducting polymer, ion conducting, non-metallic, ceramic-ceramic composite, ceramic-polymer composite, ceramic-metal composite, metal-polymer composite, polymer-polymer composite, metal-metal composite, processed materials including paper and fibers, and natural materials such as mica, dielectrics, ferrites, stoichiometric, non-stoichiometric, or a combination of one or more of these. These methods also allow the fabrication of a functionally graded products. Methods for slurry processing of nanomaterials into products. These methods are useful for organic, inorganic, metallic, alloy, ceramic, conducting polymer, non-conducting polymer, ion conducting, non-metallic, ceramic-ceramic composite, ceramic-polymer composite, ceramic-metal ...more ...less
6
US20050051258A1
Publication/Patent Number: US20050051258A1
Publication date: 2005-03-10
Application number: 10/943,944
Filing date: 2004-09-20
Abstract: A method for bonding fluororesin films, a wide fluororesin film obtained by the method, and a covering material for agricultural use, made thereof, are presented. A method of bonding films (A), wherein two sheets of films (A) made of a fluororesin, are disposed so that their edges overlap each other, a central part (b1) of the overlapping portion (B) is press-bonded under heating at a temperature within a range of from lower by 5° C. to higher by 20° C. than the melting point of the fluororesin, and then the entire area of the portion (B) is press-bonded at a temperature within a range of from lower by 30° C. to lower by more than 5° C., than the melting point, to weld the two sheets of films (A); a wide fluororesin film obtained by the method; and a covering material for agricultural use, made thereof. A method for bonding fluororesin films, a wide fluororesin film obtained by the method, and a covering material for agricultural use, made thereof, are presented. A method of bonding films (A), wherein two sheets of films (A) made of a fluororesin, are disposed so that their ...more ...less
7
US20050016676A1
Publication/Patent Number: US20050016676A1
Publication date: 2005-01-27
Application number: 10/498,793
Filing date: 2002-12-13
Inventor: Qvist, Magnus  
Assignee: Qvist, Magnus
Abstract: The present invention pertains to a method for attaching two surfaces to each other or coating a surface, comprising the steps of providing a bioadhesive composition consisting of a bioadhesive polyphenolic protein derived from a byssus-forming mussel, mixing the bioadhesive protein with a strongly alkaline solution before or simultaneously as applying the composition to the surfaces which are to be attached to each other or the surface to be coated. The surfaces are then joined and left for a sufficiently long time to allow curing to occur alternatively the surface coated by the composition is left for a sufficiently long time to allow curing to occur. The invention can be provided as a kit of parts comprising the bioadhesive protein solution and a preparation of a strongly alkaline solution. The present invention pertains to a method for attaching two surfaces to each other or coating a surface, comprising the steps of providing a bioadhesive composition consisting of a bioadhesive polyphenolic protein derived from a byssus-forming mussel, mixing the bioadhesive ...more ...less
8
US20050224173A1
Publication/Patent Number: US20050224173A1
Publication date: 2005-10-13
Application number: 10/506,038
Filing date: 2003-02-11
Abstract: A sealing method comprising affixing an adhesive tape (e.g., a pressure-sensitive adhesive tape) to an adherend to be sealed, placing a sealing article that contains a hot-melt/fluidizable thermosetting sealing material on the adhesive tape, and heating the sealing article to a temperature sufficient to allow the article hot-melt/fluidize and thermoset. The adhesive tape has a substrate that suppresses penetration of air trapped in the affixing step between the adherend and adhesive tape into the sealing article. A sealing method comprising affixing an adhesive tape (e.g., a pressure-sensitive adhesive tape) to an adherend to be sealed, placing a sealing article that contains a hot-melt/fluidizable thermosetting sealing material on the adhesive tape, and heating the sealing article to a ...more ...less
9
US20050178501A1
Publication/Patent Number: US20050178501A1
Publication date: 2005-08-18
Application number: 11/058,700
Filing date: 2005-02-16
Abstract: The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive. The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a ...more ...less
10
US20050257886A1
Publication/Patent Number: US20050257886A1
Publication date: 2005-11-24
Application number: 10/505,342
Filing date: 2003-02-14
Abstract: Disclosed is a method for producing an electrical device by electrically and mechanically interconnecting two objects for bonding. When an adhesive layer (25) provided to an LCD (11) and a layer of a second curing agent (28) provided to a TCP (15) are brought into tight contact with each other and thrust in this state to each other under heating, a first curing agent in the adhesive layer (25) and a second curing agent forming the layer of the second curing agent react with each other so that the thermosetting resin in the adhesive layer is polymerized to bond the LCD (11) and the TCP (15) together to produce an electrical device. In case a metal chelate or a metal alcoholate and a silane coupling agent are used as the first and second curing agents, respectively, the silane coupling agent and the metal chelate react with each other to yield cations and, by these cations, the thermosetting resin undergoes cationic polymerization. The adhesive may be cured to bond the LCD (11) and the TCP (15) together in a shorter time at a lower temperature than in case the conventional adhesive is used. Disclosed is a method for producing an electrical device by electrically and mechanically interconnecting two objects for bonding. When an adhesive layer (25) provided to an LCD (11) and a layer of a second curing agent (28) provided to a TCP (15) are brought into tight contact ...more ...less
11
US20050056365A1
Publication/Patent Number: US20050056365A1
Publication date: 2005-03-17
Application number: 10/663,207
Filing date: 2003-09-15
Inventor: Chan, Albert  
Assignee: Chan, Albert
Abstract: A thermally conductive interface adhesive for attaching an electronic component, such as an integrated circuit chip, to a heat receiving substrate, such as a heat spreader, is disclosed. The interface adhesive comprises a mixture of solder powder, flux and a curable polymer, such as an epoxy, which form a paste. Preferably, the interface adhesive further comprises particles of a metallic filler material, such as silver or copper. Preferably, the solder has a relatively low melting point, and the polymer is thermosetting. After the adhesive paste is applied it is processed by heating it to melt the solder after which the polymer is cured, such that a metallic network is formed within the adhesive layer. The cured adhesive layer has a thermal conductivity of about 15 W/m-K or more. A thermally conductive interface adhesive for attaching an electronic component, such as an integrated circuit chip, to a heat receiving substrate, such as a heat spreader, is disclosed. The interface adhesive comprises a mixture of solder powder, flux and a curable polymer ...more ...less
12
US20050126681A1
Publication/Patent Number: US20050126681A1
Publication date: 2005-06-16
Application number: 11/040,939
Filing date: 2005-01-21
Inventor: Morgan, Charles  
Abstract: A composite carpet cushion incorporating a film layer, a foam layer and a fiber layer and a process of forming the composite carpet cushion. The film layer of the composite carpet cushion is a polyethylene film having a lateral dimension in the range of about 0.4 to 3 millimeters. The foam layer is urethane in an amount ranging from about 20 to 90 grams per square foot of the composite carpet cushion. The fiber layer is comprised of natural or synthetic fibers or a combination thereof having a lateral dimension in the range of about {fraction (1/16)} to {fraction (7/16)} inches. The process of forming a composite carpet cushion comprises applying an uncured urethane foam mixture uniformly on a polyethylene film layer. The combination foam and film layer is applied to a fiber layer which is proximate the foam layer. The composite layers are moved through a heated press which compresses the layers and causes the foam layer to react and cure to form a bond with the fiber layer and the film layer. A composite carpet cushion incorporating a film layer, a foam layer and a fiber layer and a process of forming the composite carpet cushion. The film layer of the composite carpet cushion is a polyethylene film having a lateral dimension in the range of about 0.4 to 3 ...more ...less
13
US20050098262A1
Publication/Patent Number: US20050098262A1
Publication date: 2005-05-12
Application number: 11/015,273
Filing date: 2004-12-16
Abstract: A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be formed by roll coating, spray coating or screen printing. The thickness of the isolating layers can be controlled in accordance to the requirements of the circuits. Various types of metal foils can be laminated onto the isolating layers, followed by heating and pressurization processes to secure the metal foil onto the substrate. A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be ...more ...less
14
US20040231790A1
Publication/Patent Number: US20040231790A1
Publication date: 2004-11-25
Application number: 10/485,449
Filing date: 2004-06-25
Abstract: A process for bonding a semi-crystalline or crystalline thermoplastic polymer to a thermosetting polymer component, the process including selecting compatible semi-crystalline thermoplastic polymer and uncured thermosetting polymer components wherein the curing temperature of the uncured thermosetting polymer components is above the melting temperature of the semi-crystalline thermoplastic polymer. The process includes locating the thermoplastic polymer in contact with the uncured thermosetting polymer component and heating the thermoplastic polymer and uncured thermosetting polymer or thermosetting polymer composite component to the curing temperature of the thermosetting polymer, where the uncured thermosetting polymer components and the thermoplastic polymer are able to at least partly interpenetrate before the thermosetting polymer cures. The thermoplastic polymer and cured thermosetting polymer component are then cooled such that the thermoplastic polymer is very strongly bonded to the cured thermosetting polymer component. A process for bonding a semi-crystalline or crystalline thermoplastic polymer to a thermosetting polymer component, the process including selecting compatible semi-crystalline thermoplastic polymer and uncured thermosetting polymer components wherein the curing temperature of ...more ...less
15
US20040204520A1
Publication/Patent Number: US20040204520A1
Publication date: 2004-10-14
Application number: 10/437,545
Filing date: 2003-05-13
Abstract: A storage stable adhesive paste composition is described. It contains a plurality of first solid particles comprising a surface protected polyisocyanate and a plurality of second solid particles of polymer having functional groups that react with the polyisocyanate. The particles may be protected by encapsulation in a layer of a material that is not reactive to the polyisocyanate. Preferably, the protective layer also is not reactive to the polymer having functional groups that react with the polyisocyanate. The polyisocyanate particles also can be protected by a layer formed by chemically reacting said polyisocyanate particles with isocyanate reactive compounds to form a protective surface layer around said polyisocyanate particles. A storage stable adhesive paste composition is described. It contains a plurality of first solid particles comprising a surface protected polyisocyanate and a plurality of second solid particles of polymer having functional groups that react with the polyisocyanate. The ...more ...less
16
US20040103988A1
Publication/Patent Number: US20040103988A1
Publication date: 2004-06-03
Application number: 10/622,633
Filing date: 2003-07-21
Inventor: Wiley, Patrick Carl  
Abstract: This application relates to a method and apparatus for heating a surface marking, such as a thermoplastic pattern in an asphalt substrate. The marking may be selected for functional or decorative purposes. The method involves gradually applying heat to the marking to avoid scorching and to ensure a consistent bond with the underlying substrate, even in the case of markings having a very large surface area. In one embodiment the method a portable heating apparatus is provided having infrared heaters mounted for reciprocal movement in a travel path periodically passing over the marking and the underlying substrate. The heating method permits direct visual monitoring of the work site to achieve optimum adhesion of the marking to the asphalt or other substrate. This application relates to a method and apparatus for heating a surface marking, such as a thermoplastic pattern in an asphalt substrate. The marking may be selected for functional or decorative purposes. The method involves gradually applying heat to the marking to avoid ...more ...less
17
US20040005446A1
Publication/Patent Number: US20040005446A1
Publication date: 2004-01-08
Application number: 10/184,850
Filing date: 2002-06-28
Abstract: Insulation materials suited to high temperature applications, such as the insulation of furnaces, are formed from a mixture of pitch carbon fibers, such as isotropic pitch carbon fibers, and a binder comprising a solution of sugar in water. The sugar solution is preferably at a concentration of from 20-60% sucrose to yield a low density material having high flexural strength and low thermal conductivity when carbonized to a temperature of about 1800° C. Insulation materials suited to high temperature applications, such as the insulation of furnaces, are formed from a mixture of pitch carbon fibers, such as isotropic pitch carbon fibers, and a binder comprising a solution of sugar in water. The sugar solution is preferably at a ...more ...less
18
US20040005449A1
Publication/Patent Number: US20040005449A1
Publication date: 2004-01-08
Application number: 10/609,475
Filing date: 2003-07-01
Abstract: The present invention provides a foamed resin laminate sound insulation board capable of exhibiting sound proofing performance, which is free from restrictions of shape, applicable place and weight, thinned as the whole laminated plate to enhance plastic workability such as press work, and provided with sufficient vibration damping performance in a final using state after heating foaming process. This foamed resin laminate sound insulation board 1 is a laminated plate comprising at least an unfoamed foamable resin 3a to be foamed at a foaming temperature by heating and a hard plate 2. The present invention provides a foamed resin laminate sound insulation board capable of exhibiting sound proofing performance, which is free from restrictions of shape, applicable place and weight, thinned as the whole laminated plate to enhance plastic workability such as ...more ...less
19
US20040250940A1
Publication/Patent Number: US20040250940A1
Publication date: 2004-12-16
Application number: 10/763,728
Filing date: 2004-01-23
Abstract: A three dimensional soft magnetic metal mass suitable for milling is formed wrapping soft magnetic metal ribbon into a three dimensional shape and then applying adhesive to the three dimensional shape. The adhesive permeates the three dimensional shape. The adhesive is then cured. If the soft magnetic metal mass is made as a toroid, then it could be processed into an electromechanical component. The electromechanical component would then be suitable for use in very high frequency electric motors. A three dimensional soft magnetic metal mass suitable for milling is formed wrapping soft magnetic metal ribbon into a three dimensional shape and then applying adhesive to the three dimensional shape. The adhesive permeates the three dimensional shape. The adhesive is then ...more ...less
20
US20040134589A1
Publication/Patent Number: US20040134589A1
Publication date: 2004-07-15
Application number: 10/728,644
Filing date: 2003-12-05
Inventor: Hill, David A.  
Abstract: A press assembly includes multiple pressing mechanisms for pressing a composite from multiple non-parallel directions simultaneously.