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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1 US2005126681A1
Composite carpet cushion and process
Publication/Patent Number: US2005126681A1 Publication Date: 2005-06-16 Application Number: 11/040,939 Filing Date: 2005-01-21 Inventor: Morgan, Charles   Assignee: L&P Property Management Company   IPC: B32B031/26 Abstract: A composite carpet cushion incorporating a film layer, a foam layer and a fiber layer and a process of forming the composite carpet cushion. The film layer of the composite carpet cushion is a polyethylene film having a lateral dimension in the range of about 0.4 to 3 millimeters. The foam layer is urethane in an amount ranging from about 20 to 90 grams per square foot of the composite carpet cushion. The fiber layer is comprised of natural or synthetic fibers or a combination thereof having a lateral dimension in the range of about {fraction (1/16)} to {fraction (7/16)} inches. The process of forming a composite carpet cushion comprises applying an uncured urethane foam mixture uniformly on a polyethylene film layer. The combination foam and film layer is applied to a fiber layer which is proximate the foam layer. The composite layers are moved through a heated press which compresses the layers and causes the foam layer to react and cure to form a bond with the fiber layer and the film layer. A composite carpet cushion incorporating a film layer, a foam layer and a fiber layer and a process of forming the composite carpet cushion. The film layer of the composite carpet cushion is a polyethylene film having a lateral dimension in the range of about 0.4 to 3 ...More ...Less
2 US2005098262A1
Method of laminating copper foil onto a printed circuit board
Publication/Patent Number: US2005098262A1 Publication Date: 2005-05-12 Application Number: 11/015,273 Filing Date: 2004-12-16 Inventor: Lin, Chia-pin   Fan, Chih-peng   Hung, Chang-yun   Lee, Sheng-chou   Assignee: Lin, Chia-Pin   Fan, Chih-Peng   Hung, Chang-Yun   Lee, Sheng-Chou   IPC: B32B031/26 Abstract: A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be formed by roll coating, spray coating or screen printing. The thickness of the isolating layers can be controlled in accordance to the requirements of the circuits. Various types of metal foils can be laminated onto the isolating layers, followed by heating and pressurization processes to secure the metal foil onto the substrate. A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be ...More ...Less
3 US2005217792A1
Process for the manufacturing of decorative laminate
Publication/Patent Number: US2005217792A1 Publication Date: 2005-10-06 Application Number: 11/129,497 Filing Date: 2005-05-16 Inventor: Sjoberg, Ake   Johansson, Ann-charlott   Assignee: Pergo (Europe) AB   IPC: B32B031/26 Abstract: A process for the manufacturing of a decorative laminate, which laminate comprises an upper decorative and abrasion resistant thermosetting laminate layer and a carrying core. The upper side of the core is provided with the abrasion resistant thermosetting laminate with a dampening foil of an elastomer arranged between the upper side of the core and the abrasion resistant thermosetting laminate, which elastomer and which thermosetting laminate are joined with each other and with the core by means of pressing. A process for the manufacturing of a decorative laminate, which laminate comprises an upper decorative and abrasion resistant thermosetting laminate layer and a carrying core. The upper side of the core is provided with the abrasion resistant thermosetting laminate with a ...More ...Less
4 US2005257886A1
Process for producing electrical apparatus
Publication/Patent Number: US2005257886A1 Publication Date: 2005-11-24 Application Number: 10/505,342 Filing Date: 2003-02-14 Inventor: Matsushima, Takayuki   Saito, Masao   Assignee: Matsushima, Takayuki   Saito, Masao   IPC: B32B031/26 Abstract: Disclosed is a method for producing an electrical device by electrically and mechanically interconnecting two objects for bonding. When an adhesive layer (25) provided to an LCD (11) and a layer of a second curing agent (28) provided to a TCP (15) are brought into tight contact with each other and thrust in this state to each other under heating, a first curing agent in the adhesive layer (25) and a second curing agent forming the layer of the second curing agent react with each other so that the thermosetting resin in the adhesive layer is polymerized to bond the LCD (11) and the TCP (15) together to produce an electrical device. In case a metal chelate or a metal alcoholate and a silane coupling agent are used as the first and second curing agents, respectively, the silane coupling agent and the metal chelate react with each other to yield cations and, by these cations, the thermosetting resin undergoes cationic polymerization. The adhesive may be cured to bond the LCD (11) and the TCP (15) together in a shorter time at a lower temperature than in case the conventional adhesive is used. Disclosed is a method for producing an electrical device by electrically and mechanically interconnecting two objects for bonding. When an adhesive layer (25) provided to an LCD (11) and a layer of a second curing agent (28) provided to a TCP (15) are brought into tight contact ...More ...Less
5 US2005263245A1
Method of vulcanizing an object formed of unvulcanized rubber and rubber product
Publication/Patent Number: US2005263245A1 Publication Date: 2005-12-01 Application Number: 11/202,096 Filing Date: 2005-08-12 Inventor: Yanadori, Kazuhito   Ohishi, Hideyuki   Tamada, Yoshinori   Assignee: The Yokohama Rubber Co., Ltd.   IPC: B32B031/26 Abstract: A method of vulcanizing an object formed of unvulcanized rubber, in which the unvulcanized-rubber formed object is vulcanized by pressing and heating by mold means, comprises disposing a fiber sheet member on a surface of the unvulcanized-rubber formed object and vulcanizing the unvulcanized-rubber formed object by the mold means. A method of vulcanizing an object formed of unvulcanized rubber, in which the unvulcanized-rubber formed object is vulcanized by pressing and heating by mold means, comprises disposing a fiber sheet member on a surface of the unvulcanized-rubber formed object and vulcanizing the ...More ...Less
6 US2005060866A1
Method and installation for clinching pieces of sheet metal
Publication/Patent Number: US2005060866A1 Publication Date: 2005-03-24 Application Number: 10/939,724 Filing Date: 2004-09-13 Inventor: Westall, Roger   Assignee: Westall, Roger   IPC: B32B031/26 Abstract: A method for clinching pieces of metal plate, comprising the steps of: positioning two pieces of sheet metal (6a, 6b) in a clinching station (3), the two pieces of sheet metal (6a, 6b) being provided with at least one area of their edge whereon is applied a hot-curing resin, performing a clinching operation along the edge (16, 17) of said pieces (6a, 6b); and polymerising the resin by means of induction heating, in the same clinching station (3) by means of a heating device (19) which performs a localised heating of the clinched edges (16, 17). A method for clinching pieces of metal plate, comprising the steps of: positioning two pieces of sheet metal (6a, 6b) in a clinching station (3), the two pieces of sheet metal (6a, 6b) being provided with at least one area of their edge whereon is applied ...More ...Less
7 US2005056365A1
Thermal interface adhesive
Publication/Patent Number: US2005056365A1 Publication Date: 2005-03-17 Application Number: 10/663,207 Filing Date: 2003-09-15 Inventor: Chan, Albert   Assignee: Chan, Albert   IPC: B32B031/26 Abstract: A thermally conductive interface adhesive for attaching an electronic component, such as an integrated circuit chip, to a heat receiving substrate, such as a heat spreader, is disclosed. The interface adhesive comprises a mixture of solder powder, flux and a curable polymer, such as an epoxy, which form a paste. Preferably, the interface adhesive further comprises particles of a metallic filler material, such as silver or copper. Preferably, the solder has a relatively low melting point, and the polymer is thermosetting. After the adhesive paste is applied it is processed by heating it to melt the solder after which the polymer is cured, such that a metallic network is formed within the adhesive layer. The cured adhesive layer has a thermal conductivity of about 15 W/m-K or more. A thermally conductive interface adhesive for attaching an electronic component, such as an integrated circuit chip, to a heat receiving substrate, such as a heat spreader, is disclosed. The interface adhesive comprises a mixture of solder powder, flux and a curable polymer ...More ...Less
8 US2005051258A1
Method of bonding fluororesin films, and fluororesin film
Publication/Patent Number: US2005051258A1 Publication Date: 2005-03-10 Application Number: 10/943,944 Filing Date: 2004-09-20 Inventor: Tsukada, Tetsuro   Takahashi, Tomomi   Assignee: ASAHI GLASS COMPANY LIMITED   IPC: B32B031/26 Abstract: A method for bonding fluororesin films, a wide fluororesin film obtained by the method, and a covering material for agricultural use, made thereof, are presented. A method of bonding films (A), wherein two sheets of films (A) made of a fluororesin, are disposed so that their edges overlap each other, a central part (b1) of the overlapping portion (B) is press-bonded under heating at a temperature within a range of from lower by 5° C. to higher by 20° C. than the melting point of the fluororesin, and then the entire area of the portion (B) is press-bonded at a temperature within a range of from lower by 30° C. to lower by more than 5° C., than the melting point, to weld the two sheets of films (A); a wide fluororesin film obtained by the method; and a covering material for agricultural use, made thereof. A method for bonding fluororesin films, a wide fluororesin film obtained by the method, and a covering material for agricultural use, made thereof, are presented. A method of bonding films (A), wherein two sheets of films (A) made of a fluororesin, are disposed so that their ...More ...Less
9 US2005224173A1
Sealing method
Publication/Patent Number: US2005224173A1 Publication Date: 2005-10-13 Application Number: 10/506,038 Filing Date: 2003-02-11 Inventor: Kitano, Shuichi   Shinozaki, Kotaro   Hiroshige, Yuji   Assignee: Kitano, Shuichi   Shinozaki, Kotaro   Hiroshige, Yuji   IPC: B32B031/26 Abstract: A sealing method comprising affixing an adhesive tape (e.g., a pressure-sensitive adhesive tape) to an adherend to be sealed, placing a sealing article that contains a hot-melt/fluidizable thermosetting sealing material on the adhesive tape, and heating the sealing article to a temperature sufficient to allow the article hot-melt/fluidize and thermoset. The adhesive tape has a substrate that suppresses penetration of air trapped in the affixing step between the adherend and adhesive tape into the sealing article. A sealing method comprising affixing an adhesive tape (e.g., a pressure-sensitive adhesive tape) to an adherend to be sealed, placing a sealing article that contains a hot-melt/fluidizable thermosetting sealing material on the adhesive tape, and heating the sealing article to a ...More ...Less
10 US2005274447A1
Slurry processing of nanoscale materials into nanotechnology products
Publication/Patent Number: US2005274447A1 Publication Date: 2005-12-15 Application Number: 10/898,848 Filing Date: 2004-07-26 Inventor: Yadav, Tapesh   Pfaffenbach, Karl   Assignee: Yadav, Tapesh   Pfaffenbach, Karl   IPC: B32B031/26 Abstract: Methods for slurry processing of nanomaterials into products. These methods are useful for organic, inorganic, metallic, alloy, ceramic, conducting polymer, non-conducting polymer, ion conducting, non-metallic, ceramic-ceramic composite, ceramic-polymer composite, ceramic-metal composite, metal-polymer composite, polymer-polymer composite, metal-metal composite, processed materials including paper and fibers, and natural materials such as mica, dielectrics, ferrites, stoichiometric, non-stoichiometric, or a combination of one or more of these. These methods also allow the fabrication of a functionally graded products. Methods for slurry processing of nanomaterials into products. These methods are useful for organic, inorganic, metallic, alloy, ceramic, conducting polymer, non-conducting polymer, ion conducting, non-metallic, ceramic-ceramic composite, ceramic-polymer composite, ceramic-metal ...More ...Less
11 US2005051262A1
Mandrel and method for manufacturing composite structures
Publication/Patent Number: US2005051262A1 Publication Date: 2005-03-10 Application Number: 10/657,969 Filing Date: 2003-09-09 Inventor: Erickson, Dave   George, Panagiotis   Mortensen, Ryan   Smith, Stuart   Assignee: Erickson, Dave   George, Panagiotis   Mortensen, Ryan   Smith, Stuart   IPC: B32B031/26 Abstract: An apparatus and method for retaining composite structures, such as composite honeycomb structures, during manufacture are provided. The composite structure is cured on a mandrel that defines a layup surface with a grip feature. The grip feature is configured to engage the composite structure during manufacture and retain the structure in a predetermined configuration. A film adhesive can be provided between the grip feature and a tiedown ply that extends from the composite structure. An apparatus and method for retaining composite structures, such as composite honeycomb structures, during manufacture are provided. The composite structure is cured on a mandrel that defines a layup surface with a grip feature. The grip feature is configured to engage the ...More ...Less
12 US2005178501A1
Process for producing a multi-layer printer wiring board
Publication/Patent Number: US2005178501A1 Publication Date: 2005-08-18 Application Number: 11/058,700 Filing Date: 2005-02-16 Inventor: Nakamura, Shigeo   Yokota, Tadahiko   Assignee: AJINOMOTO CO., INC.   IPC: B32B031/26 Abstract: The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive. The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a ...More ...Less
13 US2005016676A1
Method and kit providing bioadhesive binding or coating with polyphenolic mussel proteins
Publication/Patent Number: US2005016676A1 Publication Date: 2005-01-27 Application Number: 10/498,793 Filing Date: 2002-12-13 Inventor: Qvist, Magnus   Assignee: Qvist, Magnus   IPC: B32B031/26 Abstract: The present invention pertains to a method for attaching two surfaces to each other or coating a surface, comprising the steps of providing a bioadhesive composition consisting of a bioadhesive polyphenolic protein derived from a byssus-forming mussel, mixing the bioadhesive protein with a strongly alkaline solution before or simultaneously as applying the composition to the surfaces which are to be attached to each other or the surface to be coated. The surfaces are then joined and left for a sufficiently long time to allow curing to occur alternatively the surface coated by the composition is left for a sufficiently long time to allow curing to occur. The invention can be provided as a kit of parts comprising the bioadhesive protein solution and a preparation of a strongly alkaline solution. The present invention pertains to a method for attaching two surfaces to each other or coating a surface, comprising the steps of providing a bioadhesive composition consisting of a bioadhesive polyphenolic protein derived from a byssus-forming mussel, mixing the bioadhesive ...More ...Less
14 US2004194870A1
Ceramic capacitor and method for the manufacture thereof
Publication/Patent Number: US2004194870A1 Publication Date: 2004-10-07 Application Number: 10/827,235 Filing Date: 2004-04-20 Inventor: Ogasawara, Jun   Mizuno, Youichi   Assignee: TAIYO YUDEN CO., LTD.   IPC: B32B015/04 Abstract: A ceramic capacitor has at least one dielectric layer and at least two electrodes having the dielectric layers therebetween. The dielectric layer includes a sintered body of ceramic grains containing a primary component of a perovskite crystal structure in a form of ABO3 and a ratio A/B of outer portions of the ceramic grains is greater than that of an inner portions thereof. A ceramic capacitor has at least one dielectric layer and at least two electrodes having the dielectric layers therebetween. The dielectric layer includes a sintered body of ceramic grains containing a primary component of a perovskite crystal structure in a form of ABO3 and a ...More ...Less
15 US2004117960A1
Method of manufacturing a multi-layered piezoelectric actuator
Publication/Patent Number: US2004117960A1 Publication Date: 2004-06-24 Application Number: 10/327,719 Filing Date: 2002-12-20 Inventor: Kelley, Kurtis C.   Maushard, Jerry P.   Waterfield, L. Glenn   Assignee: Kelley, Kurtis C.   Maushard, Jerry P.   Waterfield, L. Glenn   IPC: H01L041/083 Abstract: Method of manufacturing a piezoelectric actuator. The method includes a pre-cure step in which the adhesive is heated to a temperature below the melting point of the adhesive. A stack is formed having a piezoelectric layer and at least one supporting layer with the pre-cured adhesive therebetween. The stack is then cured to form a bonded laminate. The temperature at which the pre-cure occurs allows for the pre-stress in the piezoelectric layer to be modified without changing the material of the supporting layer. Method of manufacturing a piezoelectric actuator. The method includes a pre-cure step in which the adhesive is heated to a temperature below the melting point of the adhesive. A stack is formed having a piezoelectric layer and at least one supporting layer with the pre-cured ...More ...Less
16 US2004134606A1
METHOD OF BONDING A WATER-ACTIVATED ADHESIVE SHEET
Publication/Patent Number: US2004134606A1 Publication Date: 2004-07-15 Application Number: 10/708,218 Filing Date: 2004-02-17 Inventor: Tsutsui, Mikio   Assignee: Tsutsui, Mikio   IPC: B32B031/26 Abstract: Method of bonding a water-activated adhesive sheet to the desired surface of an object is disclosed. The adhesive sheet is made of a backing and a layer of water-activated adhesive disposed on one side of the backing. The method of the invention comprises pressing the water-activated adhesive sheet against the desired surface without moistening the water-activated adhesive layer, and simultaneously heating the adhesive sheet. The water-activated adhesive sheet is heated at a temperature of at least 100° C. for at least 0.3 second under a pressure of at least 3.2 kg/cm2. The method of the invention is applicable to jointing wood veneer sheets which are dried to such an extent that is suitable for lamination to produce plywood, laminated veneer lumber (LVL) or other wood composite materials. Method of bonding a water-activated adhesive sheet to the desired surface of an object is disclosed. The adhesive sheet is made of a backing and a layer of water-activated adhesive disposed on one side of the backing. The method of the invention comprises pressing the ...More ...Less
17 US2004011493A1
Apparatus having wear-resistant surface and method for making
Publication/Patent Number: US2004011493A1 Publication Date: 2004-01-22 Application Number: 10/176,964 Filing Date: 2002-06-21 Inventor: Maas, Reginald R.   Maslen, Thomas C.   Rulis, Dean A.   Church, Thomas D.   Assignee: CoorsTek, Inc.   IPC: D21F001/18 Abstract: Hardened wear-resistant members are secured to an underlying body member in a manner to accommodate differing coefficients of thermal expansion. In one form a connector comprising shear compliant material is secured at one of its faces to the body member and a hardened wear-resistant member is secured to the opposite face of the connector. In another embodiment, the body member has adjacent portions resiliently connected to each other and the engaging member is secured at spaced locations to the two resiliently joined portions such that different thermal expansion of the two parts will be accommodated. Hardened wear-resistant members are secured to an underlying body member in a manner to accommodate differing coefficients of thermal expansion. In one form a connector comprising shear compliant material is secured at one of its faces to the body member and a hardened ...More ...Less
18 US2004134589A1
System and method for forming wood products
Publication/Patent Number: US2004134589A1 Publication Date: 2004-07-15 Application Number: 10/728,644 Filing Date: 2003-12-05 Inventor: Hill, David A.   Assignee: Hill, David A.   IPC: G02B001/00 Abstract: A press assembly includes multiple pressing mechanisms for pressing a composite from multiple non-parallel directions simultaneously.
19 US2004231791A1
Method of joining surfaces
Publication/Patent Number: US2004231791A1 Publication Date: 2004-11-25 Application Number: 10/849,031 Filing Date: 2004-05-20 Inventor: Norling, Hakan Lars Erik   Abram, Eugeniusz   Assignee: Norling, Hakan Lars Erik   Abram, Eugeniusz   IPC: B32B031/26 Abstract: The present invention relates to a method of joining surfaces, comprising in the following order: applying an adhesive composition (A), comprising a solvent, onto a first surface, drying off the solvent, partially or completely, by forced drying, to give the adhesive composition (A) a solids content of X weight %, directly after the drying step, applying a component (C), comprising a solvent, having a solids content of Z weight %, onto a second surface, wherein Z<X, bringing together the two surfaces so that the adhesive composition (A) is in contact with the component (C), and, pressing the two surfaces against each other. It also relates to a method of producing a wood based product. The present invention relates to a method of joining surfaces, comprising in the following order: applying an adhesive composition (A), comprising a solvent, onto a first surface, drying off the solvent, partially or completely, by forced drying, to give the adhesive composition ...More ...Less
20 US2004005446A1
Isotropic pitch-based materials for thermal insulation
Publication/Patent Number: US2004005446A1 Publication Date: 2004-01-08 Application Number: 10/184,850 Filing Date: 2002-06-28 Inventor: Chiu, Charles C.   Lewis, Irwin Charles   Chang, Ching-feng   Assignee: UCAR Carbon Company Inc.   IPC: D04H001/00 Abstract: Insulation materials suited to high temperature applications, such as the insulation of furnaces, are formed from a mixture of pitch carbon fibers, such as isotropic pitch carbon fibers, and a binder comprising a solution of sugar in water. The sugar solution is preferably at a concentration of from 20-60% sucrose to yield a low density material having high flexural strength and low thermal conductivity when carbonized to a temperature of about 1800° C. Insulation materials suited to high temperature applications, such as the insulation of furnaces, are formed from a mixture of pitch carbon fibers, such as isotropic pitch carbon fibers, and a binder comprising a solution of sugar in water. The sugar solution is preferably at a ...More ...Less