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1
US10400347B2
Publication/Patent Number: US10400347B2
Publication date: 2019-09-03
Application number: 15/763,684
Filing date: 2016-08-05
Abstract: To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness HIT of the Ni plating layer 3 is preferably 5000 n/mm2 or less. To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic ...more ...less
2
US10266407B2
Publication/Patent Number: US10266407B2
Publication date: 2019-04-23
Application number: 14/703,237
Filing date: 2015-05-04
Abstract: An electrically conductive thin film including a compound represented by Chemical Formula 1 and having a layered crystal structure MeCha  Chemical Formula 1 wherein, Me is Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, or Lu; Ch is sulfur, selenium, or tellurium; and a is an integer ranging from 1 to 3. An electrically conductive thin film including a compound represented by Chemical Formula 1 and having a layered crystal structure MeCha  Chemical Formula 1 wherein, Me is Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, or Lu; ...more ...less
3
US10310353B2
Publication/Patent Number: US10310353B2
Publication date: 2019-06-04
Application number: 15/306,709
Filing date: 2014-04-25
Abstract: A charge-receiving layer for an e-paper assembly includes a plurality of conductive paths spaced apart throughout an insulative matrix, with each conductive path including at least one elongate pattern of conductive particles.
4
US10301484B2
Publication/Patent Number: US10301484B2
Publication date: 2019-05-28
Application number: 15/544,804
Filing date: 2016-01-19
Inventor: Higashi, Masayuki  
Abstract: Provided is a varnish for the formation of a charge-transporting thin film, said varnish including an organic solvent, a charge-transporting substance, and a 2,2,6,6-tetraalkylpiperidine-N-oxyl derivative represented by formula (T1) (in the formula, each RA independently represents a C1-20 alkyl group, and RB represents a hydrogen atom, a hydroxy group, an amino group, a carboxyl group, a cyano group, an oxo group, an isocyanato group, a C1-20 alkoxy group, a C2-20 alkylcarbonyloxy group, a C7-20 arylcarbonyloxy group, a C2-20 alkylcarbonylamino group or a C7-20 arylcarbonylamino group). Provided is a varnish for the formation of a charge-transporting thin film, said varnish including an organic solvent, a charge-transporting substance, and a 2,2,6,6-tetraalkylpiperidine-N-oxyl derivative represented by formula (T1) (in the formula, each RA ...more ...less
6
EP3467062A1
Publication/Patent Number: EP3467062A1
Publication date: 2019-04-10
Application number: 17802824.7
Filing date: 2017-05-24
Abstract: Provided is an electroconductive adhesive which is less apt to suffer cracking, chipping, etc. upon sintering and gives sintered objects having excellent mechanical strength. The electroconductive adhesive comprises metallic microparticles which include a protective layer comprising one or more amines and have an average particle diameter of 30-300 nm, the amines comprising a C5-7 monoalkylamine and/or an alkoxyamine represented by the following general formula (1). NH2-R2-O-R1 (1) In the protective layer, the ratio of the C5-7 monoalkylamine and/or alkoxyamine represented by the general formula (1) to one or more amines different therefrom is in the range of 100 : 0 to 10 : 90. [In formula (1), R1 represents a C1-4 alkyl group and R2 represents a C1-4 alkylene group.] Provided is an electroconductive adhesive which is less apt to suffer cracking, chipping, etc. upon sintering and gives sintered objects having excellent mechanical strength. The electroconductive adhesive comprises metallic microparticles which include a protective layer ...more ...less
7
EP1965397B1
Publication/Patent Number: EP1965397B1
Publication date: 2019-03-20
Application number: 06842970.3
Filing date: 2006-12-21
Abstract: Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan δ). A thermosetting conductive paste comprising: (A) metal powder having a melting point of 700°C or higher; (B) metal powder having a melting point of higher than 300 to lower than 700°C; and (C) a thermosetting resin. Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or ...more ...less
8
EP3096330B1
Publication/Patent Number: EP3096330B1
Publication date: 2019-04-10
Application number: 15737430.7
Filing date: 2015-01-09
Abstract: A composite conductive particle according to the present invention includes a first conductive particle having a particle diameter of greater than or equal to 0.1 µm and less than or equal to 50 µm; and a second conductive particle adhering to the surface of the first conductive particle and having a particle diameter of greater than or equal to 50 nm and less than or equal to 1000 nm, and the first conductive particle is composed of a first particle and a first metal coating covering the surface of the first particle, the second conductive particle is composed of a second particle and a second metal coating covering the surface of the second particle, a particle diameter of the first conductive particle is larger than a particle diameter of the second conductive particle, and an adhering rate of the second conductive particle to the first conductive particle is greater than or equal to 2% and less than or equal to 40%. As a result, it is possible to provide a composite conductive particle having high conductivity and high filling property. A composite conductive particle according to the present invention includes a first conductive particle having a particle diameter of greater than or equal to 0.1 µm and less than or equal to 50 µm; and a second conductive particle adhering to the surface of the first c ...more ...less
9
EP3527631A1
Publication/Patent Number: EP3527631A1
Publication date: 2019-08-21
Application number: 17820113.3
Filing date: 2017-06-26
Abstract: To provide a silver nanowire ink, in which a bundle aggregation of wire is difficult to occur in die coater coating, and a transparent conductor having good conductivity can be stably formed. A silver nanowire ink containing a liquid medium containing HEMC (hydroxyethyl methyl cellulose) having dispersed therein silver nanowires covered with a copolymer of vinylpyrrolidone and a hydrophilic monomer, the silver nanowire ink having a content of HEMC in the ink of from 0.01 to 1.0% by mass. To provide a silver nanowire ink, in which a bundle aggregation of wire is difficult to occur in die coater coating, and a transparent conductor having good conductivity can be stably formed. A silver nanowire ink containing a liquid medium containing HEMC (hydroxyethyl methyl ...more ...less
10
EP3153556B1
Publication/Patent Number: EP3153556B1
Publication date: 2019-10-02
Application number: 15854961.8
Filing date: 2015-08-24
Assignee: LG Chem, Ltd.
11
US10438714B2
Publication/Patent Number: US10438714B2
Publication date: 2019-10-08
Application number: 16/249,249
Filing date: 2019-01-16
Assignee: C3Nano Inc.
Abstract: Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter greater than 18 nm as well as with a blue shifted narrow absorption spectrum in a dilute solution. Methods are described to allow for the synthesis of the narrow uniform silver nanowires. Transparent conductive films formed from the thin, uniform silver nanowires can have very low levels of haze and low values of ΔL*, the diffusive luminosity, such that the transparent conductive films can provide little alteration of the appearance of a black background. Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter ...more ...less
12
US10167193B2
Publication/Patent Number: US10167193B2
Publication date: 2019-01-01
Application number: 14/863,388
Filing date: 2015-09-23
Abstract: Disclosed herein are ferroelectric agglomerates and methods related thereto. In certain aspects, the ferroelectric agglomerates can be made from particles that have been treated with SbX3 or SbX5, wherein X is a halogen. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention. Disclosed herein are ferroelectric agglomerates and methods related thereto. In certain aspects, the ferroelectric agglomerates can be made from particles that have been treated with SbX3 or SbX5, wherein X is a halogen. This abstract is intended as a scanning tool for purposes ...more ...less
13
US10229768B2
Publication/Patent Number: US10229768B2
Publication date: 2019-03-12
Application number: 14/425,112
Filing date: 2012-11-26
Inventor: Yoon, Jong-hyuk  
Abstract: A method of manufacturing graphene, the method including: preparing a carrier member on which the graphene is formed on one surface thereof; exposing the graphene to dopant vapor to dope the graphene; transferring the doped graphene onto a target member; and removing the carrier member. A method of manufacturing graphene, the method including: preparing a carrier member on which the graphene is formed on one surface thereof; exposing the graphene to dopant vapor to dope the graphene; transferring the doped graphene onto a target member; and removing the carrier ...more ...less
14
US10305052B2
Publication/Patent Number: US10305052B2
Publication date: 2019-05-28
Application number: 15/325,943
Filing date: 2015-07-15
Abstract: The present invention pertains to: a Janus-type triptycene derivative which is capable of forming a self-assembled film which does not depend on the material quality of a substrate; a self-assembled film using said Janus-type triptycene derivative; a structure having said film on a surface thereof; a method for manufacturing said film; and an electronic device using said method. The present invention pertains to: a Janus-type triptycene derivative which is capable of forming a self-assembled film which does not depend on the material quality of a substrate; a self-assembled film using said Janus-type triptycene derivative; a structure having said film ...more ...less
15
US10307825B2
Publication/Patent Number: US10307825B2
Publication date: 2019-06-04
Application number: 15/546,093
Filing date: 2016-01-26
Abstract: An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4. An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size ...more ...less
16
US10340457B2
Publication/Patent Number: US10340457B2
Publication date: 2019-07-02
Application number: 15/302,602
Filing date: 2015-03-17
Abstract: The invention relates to novel organic semiconducting compounds, which are small molecules or conjugated polymers, containing one or more fluorinated polycyclic units, to methods for their preparation and educts or intermediates used therein, to compositions, polymer blends and formulations containing them, to the use of the compounds, compositions and polymer blends as organic semiconductors in, or for the preparation of, organic electronic (OE) devices, especially organic photovoltaic (OPV) devices, organic photodetectors (OPD), organic field effect transistors (OFET) and organic light emitting diodes (OLED), and to OE, OPV, OPD, OFET and OLED devices comprising these compounds, compositions or polymer blends. The invention relates to novel organic semiconducting compounds, which are small molecules or conjugated polymers, containing one or more fluorinated polycyclic units, to methods for their preparation and educts or intermediates used therein, to compositions, polymer blends and ...more ...less
17
EP3093308B1
Publication/Patent Number: EP3093308B1
Publication date: 2019-04-24
Application number: 15768492.9
Filing date: 2015-03-19