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1
US10199707B2
Publication/Patent Number: US10199707B2
Publication date: 2019-02-05
Application number: 15/292,824
Filing date: 2016-10-13
Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide. A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a ...more ...less
2
US10181411B2
Publication/Patent Number: US10181411B2
Publication date: 2019-01-15
Application number: 14/950,180
Filing date: 2015-11-24
Abstract: An insulating second element is provided and overlies a surface of a first element which consists essentially of a material having a CTE of less than 10 ppm/° C. and has a first thickness in a first direction normal to the surface. Openings extend in the first direction through the second element. The first element is abraded to produce a thinned first element having a second thickness less than the first thickness. Conductive elements are formed at a first side of the interposer coincident with or adjacent to a surface of the thinned first element remote from the second element. A conductive structure extends through the openings in the second element, wherein the conductive elements are electrically connected with terminals of the interposer through the conductive structure, and the terminals are disposed at a second side of the interposer opposite from the first side. An insulating second element is provided and overlies a surface of a first element which consists essentially of a material having a CTE of less than 10 ppm/° C. and has a first thickness in a first direction normal to the surface. Openings extend in the first direction ...more ...less
3
US10181438B2
Publication/Patent Number: US10181438B2
Publication date: 2019-01-15
Application number: 14/523,733
Filing date: 2014-10-24
Abstract: A semiconductor substrate and a manufacturing method thereof are provided. The semiconductor substrate includes a dielectric layer, a circuit layer, a first protection layer and a plurality of conductive posts. The dielectric layer has a first surface and a second surface that are opposite to each other. The circuit layer is embedded in the dielectric layer and is exposed from the first surface. The first protection layer covers a portion of the first circuit layer and defines a plurality of holes that expose a remaining portion of the first circuit layer. The conductive posts are formed in the holes. A semiconductor substrate and a manufacturing method thereof are provided. The semiconductor substrate includes a dielectric layer, a circuit layer, a first protection layer and a plurality of conductive posts. The dielectric layer has a first surface and a second surface that ...more ...less
4
US10191206B2
Publication/Patent Number: US10191206B2
Publication date: 2019-01-29
Application number: 14/901,028
Filing date: 2014-06-11
Abstract: A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate. A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part ...more ...less
5
US10194524B1
Publication/Patent Number: US10194524B1
Publication date: 2019-01-29
Application number: 15/660,536
Filing date: 2017-07-26
Abstract: In one embodiment, an apparatus includes a plurality of layers in a printed circuit board comprising at least one power plane and at least one ground plane, and a plurality of vias extending through the plurality of layers and connecting two or more of the layers, the plurality of vias comprising at least one pair of differential signal vias and at least one pair of power vias, the signal vias and power vias surrounded by a plurality of ground vias. The ground plane includes an anti-pad formed therein by an opening defined by removal of material, with the pair of differential signal vias and pair of power vias extending through the anti-pad in the ground plane to reduce power via resonance. In one embodiment, an apparatus includes a plurality of layers in a printed circuit board comprising at least one power plane and at least one ground plane, and a plurality of vias extending through the plurality of layers and connecting two or more of the layers, the plurality ...more ...less
6
US10194525B2
Publication/Patent Number: US10194525B2
Publication date: 2019-01-29
Application number: 14/430,791
Filing date: 2013-09-26
Abstract: A multilayer wiring board has a central wiring layer disposed in the center of an odd number of wiring layers, insulating layers and wiring layers disposed above and below the central wiring layer, respectively, an interlayer connections having cross-sectionally trapezoidal shapes and penetrating the insulating layers to establish interlayer connection between the wiring layers. The interlayer connection is disposed to connect to a portion below the central wiring layer. The interlayer connection is disposed to connect to a portion above the central wiring layer. The directions of tapers of the cross-sectionally trapezoidal shapes of the interlayer connections are identical. A multilayer wiring board has a central wiring layer disposed in the center of an odd number of wiring layers, insulating layers and wiring layers disposed above and below the central wiring layer, respectively, an interlayer connections having cross-sectionally trapezoidal ...more ...less
7
US10194526B1
Publication/Patent Number: US10194526B1
Publication date: 2019-01-29
Application number: 16/113,467
Filing date: 2018-08-27
Assignee: TACTOTEK OY
Abstract: An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity. An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least ...more ...less
8
US10194529B2
Publication/Patent Number: US10194529B2
Publication date: 2019-01-29
Application number: 15/268,479
Filing date: 2016-09-16
Abstract: A partial metal fill is provided within the footprint of an ultra-thick-metal (UTM) conductor on a dielectric layer to strengthen the dielectric layer to inhibit delamination of the UTM conductor without inducing significant electrical coupling between the UTM conductor and the partial metal fill. A partial metal fill is provided within the footprint of an ultra-thick-metal (UTM) conductor on a dielectric layer to strengthen the dielectric layer to inhibit delamination of the UTM conductor without inducing significant electrical coupling between the UTM conductor and the ...more ...less
9
US10194531B2
Publication/Patent Number: US10194531B2
Publication date: 2019-01-29
Application number: 15/336,904
Filing date: 2016-10-28
Inventor: Ohtsu, Shigemi  
Abstract: Provided is a wiring board including a substrate formed of an insulation material, and plural conductive patterns including plural electrodes arranged on a surface of the substrate along an end surface of the substrate, and plural wiring patterns connected to the plural electrodes, respectively, wherein the substrate includes a notch formed between electrode groups each of which includes a predetermined number of the electrodes. Provided is a wiring board including a substrate formed of an insulation material, and plural conductive patterns including plural electrodes arranged on a surface of the substrate along an end surface of the substrate, and plural wiring patterns connected to the plural ...more ...less
10
US10192682B1
Publication/Patent Number: US10192682B1
Publication date: 2019-01-29
Application number: 15/838,988
Filing date: 2017-12-12
Abstract: The composite electronic component includes: a multilayer capacitor; an electrostatic discharge (ESD) protecting element; and first to fourth conductive resin layers, The multilayer capacitor includes: a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes connected to exposed portions of the first internal electrodes; and third and fourth external electrodes connected to exposed portions of the second internal electrodes. The ESD protecting element includes: a discharge portion disposed on the first surface of the capacitor body to be connected to the first to fourth external electrodes; and a protective layer. The first to fourth conductive resin layers are formed on the first to fourth external electrodes, respectively, and extend to portions of a first surface of the protective layer, respectively. The composite electronic component includes: a multilayer capacitor; an electrostatic discharge (ESD) protecting element; and first to fourth conductive resin layers, The multilayer capacitor includes: a capacitor body including dielectric layers and a plurality of first and ...more ...less
11
US10192846B2
Publication/Patent Number: US10192846B2
Publication date: 2019-01-29
Application number: 14/533,597
Filing date: 2014-11-05
Abstract: In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot. In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive ...more ...less
12
US10193206B2
Publication/Patent Number: US10193206B2
Publication date: 2019-01-29
Application number: 15/500,160
Filing date: 2014-09-02
Abstract: The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above. The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side ...more ...less
13
US10187990B2
Publication/Patent Number: US10187990B2
Publication date: 2019-01-22
Application number: 15/556,700
Filing date: 2016-03-24
Inventor: Watanabe, Hisashi  
Abstract: The present invention provides a flexible printed circuit capable of being mounted to an outer edge portion of a display panel including a periphery that is at least partially curved. The flexible printed circuit of the present invention includes: a flexible substrate provided with multiple slits; multiple conductive lines; and multiple terminals electrically coupled with the respective conductive lines in an independent manner. The slits and the conductive lines are disposed in the longitudinal direction of the flexible substrate. The terminals are disposed on a first longitudinal end of the flexible substrate. The present invention provides a flexible printed circuit capable of being mounted to an outer edge portion of a display panel including a periphery that is at least partially curved. The flexible printed circuit of the present invention includes: a flexible substrate provided ...more ...less
14
US10193287B2
Publication/Patent Number: US10193287B2
Publication date: 2019-01-29
Application number: 15/532,023
Filing date: 2015-11-09
Abstract: The present disclosure relates to a connecting adapter configured to connect to a terminal assembly. The connecting terminal assembly includes a plurality of electrical connecting terminals. The connecting adapter includes a printed circuit board that includes a comb-type conducting structure. The comb-type conducting structure includes a plurality of comb teeth, and each comb tooth includes an electrical contact surface. The connecting adapter also includes an electrical plug connector interface including a plug connector. The electrical plug connector interface includes electrical terminals electrically connected to the electrical contact surfaces of the comb teeth. The electrical plug connector interface is arranged on the printed circuit board. The present disclosure relates to a connecting adapter configured to connect to a terminal assembly. The connecting terminal assembly includes a plurality of electrical connecting terminals. The connecting adapter includes a printed circuit board that includes a comb-type ...more ...less
15
US10172238B2
Publication/Patent Number: US10172238B2
Publication date: 2019-01-01
Application number: 15/492,447
Filing date: 2017-04-20
Abstract: A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor body includes first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively. The multilayer capacitor includes first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively. A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor ...more ...less