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1
US10256719B2
Publication/Patent Number: US10256719B2
Publication date: 2019-04-09
Application number: 16/061,012
Filing date: 2016-11-16
Abstract: A power supply device includes a transformer, a primary semiconductor component, a secondary semiconductor component, a choke coil and a circuit board. Electronic components which include the transformer, the primary semiconductor component, the secondary semiconductor component, and the choke coil, are stacked in pairs, in a normal direction of a board. One pair forms a first stacked body and another pair to forms a second stacked body. A circuit board is interposed between the one pair of electronic components which forms the first stacked body, and also between the other pair of electronic components which forms the second stacked body. A power supply device includes a transformer, a primary semiconductor component, a secondary semiconductor component, a choke coil and a circuit board. Electronic components which include the transformer, the primary semiconductor component, the secondary semiconductor ...more ...less
2
US10244630B2
Publication/Patent Number: US10244630B2
Publication date: 2019-03-26
Application number: 15/463,510
Filing date: 2017-03-20
Inventor: Bdeir, Aya  
Abstract: Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together. Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing ...more ...less
3
US10244633B2
Publication/Patent Number: US10244633B2
Publication date: 2019-03-26
Application number: 15/844,107
Filing date: 2017-12-15
Assignee: Ferric Inc.
Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate. A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or ...more ...less
4
US10256028B2
Publication/Patent Number: US10256028B2
Publication date: 2019-04-09
Application number: 15/086,333
Filing date: 2016-03-31
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction. A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer ...more ...less
5
US10256180B2
Publication/Patent Number: US10256180B2
Publication date: 2019-04-09
Application number: 15/461,499
Filing date: 2017-03-17
Abstract: A package structure includes a substrate, an insulator, a plurality of pads and a patterned circuit layer. The substrate includes a plurality of through holes. The insulator covers the substrate and is filled in the through hole. The conductive vias are located in the through holes and penetrate the insulator filled in the through holes. The pads are disposed on an upper surface and a lower surface of the insulator and electrically connected to the conductive vias. A bottom surface of each pad is lower than the top surface of the insulator. The patterned circuit layer is disposed on the top surface of the insulator and connected to the conductive vias and the pads. A bottom surface of the patterned circuit layer is lower than the top surface of the insulator. A package structure includes a substrate, an insulator, a plurality of pads and a patterned circuit layer. The substrate includes a plurality of through holes. The insulator covers the substrate and is filled in the through hole. The conductive vias are located in the through ...more ...less
6
US10251258B2
Publication/Patent Number: US10251258B2
Publication date: 2019-04-02
Application number: 15/195,415
Filing date: 2016-06-28
Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide. An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also ...more ...less
7
US10251271B2
Publication/Patent Number: US10251271B2
Publication date: 2019-04-02
Application number: 15/542,916
Filing date: 2015-09-09
Abstract: A stress mitigation region is formed in which a predetermined number of stress mitigation holes penetrating through a wiring are disposed is formed in a proximity of a bonding portion of an electronic component via which the electronic component is bonded to the wiring with an electrically conductive bonding agent. Accordingly, even if a stress is generated in the wiring due to a heat, the stress mitigation holes are deformed so that the stress acted upon the electrically conductive bonding agent becomes small and a generation of cracks in the electrically conductive bonding agent can be suppressed. In addition, the stress mitigation holes are made circular so that concentrations of a current and the stress can be reduced and the generation of the cracks in the wiring can be suppressed. A stress mitigation region is formed in which a predetermined number of stress mitigation holes penetrating through a wiring are disposed is formed in a proximity of a bonding portion of an electronic component via which the electronic component is bonded to the wiring with an ...more ...less
8
US10251275B2
Publication/Patent Number: US10251275B2
Publication date: 2019-04-02
Application number: 15/523,472
Filing date: 2015-10-29
Inventor: Santo, Yoshiki  
Abstract: A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other. A plurality of signal input pins are provided to the first edge portion, a plurality of signal output pins are provided to the third edge portion, a plurality of between-element communication input pins are provided to the second edge portion, and a plurality of between-element communication output pins are provided to the fourth edge portion, respectively. A common signal is input to the first and second elements and a communication is performed between the first element and the second element. Loss of control function can be surely prevented while suppressing enlargement of the board and increase of development/production cost. A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other ...more ...less
9
US10249971B2
Publication/Patent Number: US10249971B2
Publication date: 2019-04-02
Application number: 15/697,429
Filing date: 2017-09-06
Abstract: A circuit board with wire conductive pads is provided for insertion of wires, and includes: a circuit board and a wire conductive pad. The wire conductive pad includes a main body in the form of a hollow column and an elastic locking piece extending from the main body. The main body includes a peripheral wall defining an insertion space. The elastic locking piece is inserted from the peripheral wall into the insertion space in an inclined manner to press towards the peripheral wall. Wires are inserted into the insertion space and clamped against the peripheral wall by the elastic piece, so that the wires can be prevented from falling off in a reverse direction, and thus can be connected to the circuit board in a more quick and stable manner. A circuit board with wire conductive pads is provided for insertion of wires, and includes: a circuit board and a wire conductive pad. The wire conductive pad includes a main body in the form of a hollow column and an elastic locking piece extending from the main body. The main ...more ...less
10
US10194530B2
Publication/Patent Number: US10194530B2
Publication date: 2019-01-29
Application number: 15/847,852
Filing date: 2017-12-19
Assignee: MEDIATEK INC.
Abstract: A microelectronic system includes a base and a semiconductor package mounted on the base. The base includes an internal conductive layer and a build-up layer on the internal conductive layer. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P, and the power/ground ball pad array includes a 4-ball pad unit area comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P. A microelectronic system includes a base and a semiconductor package mounted on the base. The base includes an internal conductive layer and a build-up layer on the internal conductive layer. The build-up layer includes a top conductive layer. A plurality of microvias is ...more ...less
11
US10199152B2
Publication/Patent Number: US10199152B2
Publication date: 2019-02-05
Application number: 14/743,623
Filing date: 2015-06-18
Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece. An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the ...more ...less
12
US10212807B2
Publication/Patent Number: US10212807B2
Publication date: 2019-02-19
Application number: 15/826,424
Filing date: 2017-11-29
Inventor: Moncayo, Alfredo  
Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads. A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped ...more ...less
13
US10212819B2
Publication/Patent Number: US10212819B2
Publication date: 2019-02-19
Application number: 15/051,434
Filing date: 2016-02-23
Inventor: Ahn, Hyeong-cheol  
Abstract: A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film. A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is ...more ...less
14
US10211139B2
Publication/Patent Number: US10211139B2
Publication date: 2019-02-19
Application number: 15/287,729
Filing date: 2016-10-06
Abstract: A chip package structure including a molding compound, a carrier board, a chip, a plurality of conductive pillars and a circuit board is provided. The carrier board includes a substrate and a redistribution layer. The substrate has a first surface and a second surface. The redistribution layer is disposed on the first surface. The chip and the conductive pillars are disposed on the redistribution layer. The molding compound covers the chip, the conductive pillars, and the redistribution layer. The circuit board is connected with the carrier board, wherein the circuit board is disposed on the molding compound, such that the chip is located between the substrate and the circuit board, and the chip and the redistribution layer are electrically connected with the circuit board through the conductive pillars. Heat generated by the chip is transmitted through the substrate from the first surface to the second surface to dissipate. A chip package structure including a molding compound, a carrier board, a chip, a plurality of conductive pillars and a circuit board is provided. The carrier board includes a substrate and a redistribution layer. The substrate has a first surface and a second surface. The ...more ...less